US9147408B1 - Heated AFM layer deposition and cooling process for TMR magnetic recording sensor with high pinning field

Info

Abstract

Description

Claims

US9147408B1

Publication number: US9147408B1
Application number: US14/216,285
Authority: US
Inventors: Yuankai Zheng; Qunwen Leng; Tong Zhao; Christian Kaiser; Zhitao Diao; Xin Jiang
Original assignee: Western Digital Fremont LLC
Current assignee: Western Digital Technologies Inc
Priority date: 2013-12-19
Filing date: 2014-03-17
Publication date: 2015-09-29
Anticipated expiration: 2034-03-17
Also published as: US20150380026A1

Systems and methods are provided for manufacturing a magnetic recording sensor for use in a magnetic reader, such as a tunneling magnetoresistance (TMR) readers. The magnetic recording sensor can be manufactured by heating a substrate in a first chamber and depositing an antiferromagnetic (AFM) layer on the heated substrate. Additionally, a first pinned layer is added onto the AFM layer, and the substrate is subsequently cooled.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application Ser. No. 61/918,155, filed Dec. 19, 2013, which is incorporated herein by reference in its entirety.

BACKGROUND

In magnetic storage devices such as hard disk drives (HDD), read and write heads are used to magnetically read and write information to and from storage media. In a HDD, data may be stored on one or more disks in a series of adjacent concentric circles which may be referred to as data tracks. A HDD may include a rotary actuator, a suspension mounted on an arm of the rotary actuator, and a slider bonded to the suspension to form a head gimbal assembly (HGA). In a traditional HDD, the slider carries a write head and read head, and radially floats over the surface of the storage media, e.g., a disk, under the control of a servo control system that selectively positions a head over a specific track of the disk. In this one read head (reader) configuration, the reader is aligned over the center of a track for data read back.

As HDD storage capacities have increased, the data track separation has decreased and the density has increased. Smaller reader dimensions are required to meet these requirements of increasing track density and linear density. In tunneling magnetoresistance (TMR) readers, for example, this may involve decreasing the volume of the antiferromagnetic (AFM) layer. This reduction in volume reduces the blocking temperature distribution (TbD) and the pinning magnetic field strength (H_ex) in the TMR reader, thereby worsening the thermal stability of the pinned layer. Accordingly, as the size of the TMR reader decreases, the pinning strength or exchange field needs to be increased to keep the pinned layer stable. Prior processes have focused on heating the AFM layer after its deposition to improve the pinning field. However, this process does not improve the blocking temperature.

BRIEF DESCRIPTION OF THE DRAWINGS

The present application is illustrated by way of example, and not limitation, in the figures of the accompanying drawings in which:

FIG. 1 is an operational flow diagram illustrating an example prior art process for manufacturing a magnetic recording sensor having a conventional structure without a heating/cooling process;

FIG. 2 is an operational flow diagram illustrating an example process for manufacturing a magnetic recording sensor in accordance with various embodiments;

FIG. 3 illustrates an example magnetic recording sensor structure manufactured in accordance with various embodiments.

FIG. 4 is an example graph indicative of magnetoresistance (MR) as a function of resistance area (RA) for a recording sensor manufactured in accordance with various embodiments; and

FIG. 5 is an example graph indicative of the dependence of pinning magnetic field strength (H_ex) on incoming wafer degas pressure.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth to provide a thorough understanding of various embodiment of the present disclosure. It will be apparent to one skilled in the art, however, that these specific details need not be employed to practice various embodiments of the present disclosure. In other instances, well known components or methods have not been described in detail to avoid unnecessarily obscuring various embodiments of the present disclosure.

The terms “over,” “under,” “between,” and “on” as used herein refer to a relative position of one media layer with respect to other layers. As such, for example, one layer disposed over or under another layer may be directly in contact with the other layer or may have one or more intervening layers. Moreover, one layer disposed between two layers may be directly in contact with the two layers or may have one or more intervening layers. By contrast, a first layer “on” a second layer is in contact with that second layer. Additionally, the relative position of one layer with respect to other layers is provided assuming operations are performed relative to a substrate without consideration of the absolute orientation of the substrate.

In accordance with the present disclosure, systems and methods for manufacturing a TMR magnetic recording sensor with a high pinning field are disclosed. In the present disclosure, a substrate may be heated prior to AFM layer deposition. This is in contrast to prior methods and structures, which either manufacture the TMR structure without heating or perform heating after the AFM layer deposition.

For example, FIG. 1 is an operational flow diagram illustrating an example prior art process for manufacturing a magnetic recording sensor having a conventional structure without a heating/cooling process. Process 100 may begin at operation 102, where a substrate is provided. At operation 104, an AFM layer is then deposited on the substrate. At operation 106, the substrate is heated in a chamber or station of a disk processing system. At operation 108, the substrate is subsequently cooled. At operation 110, a first pinned layer is added onto the AFM layer. When a conventional structure is not heated/cooled at all, a substrate can be provided, an AFM layer may be deposited on the substrate, and a pinned layer can be added onto the AFM layer.

FIG. 2 illustrates an operational flow diagram illustrating an example process 200 for manufacturing a magnetic recording sensor in accordance with various embodiments. Process 200 may begin at operation 202 by providing a substrate. At operation 204, the substrate may be heated in a chamber or station of a disk processing system. At operation 206, an AFM layer may be deposited on the heated substrate. At operation 208, a first pinned layer can be added onto the AFM layer. At operation 210, the substrate can be cooled. At operation 212, a second pinned layer can be added onto the first pinned layer.

FIG. 3 illustrates a TMR stack 300 that may be manufactured utilizing process 200 of FIG. 2 in accordance with the present disclosure. TMR stack 300 may include a shield layer, a seed layer, a spacer, an AFM layer, a first pinned layer, a second pinned layer, a Ruthenium (Ru) spacer, a reference layer, a barrier, a free layer and a cap layer. In one embodiment, the AFM layer comprises Iridium Manganese (IrMn).

As illustrated in FIG. 3, the substrate is heated prior to depositing the AFM layer as described above at operation 204 of FIG. 2. In accordance with various embodiments, the substrate may be heated at temperatures ranging from 100° C. to 300° C. In one embodiment, heating can be performed by a resistive process. In another embodiment the heating can be accomplished using a rapid thermal process. In one embodiment, heating may be performed in the same chamber that the AFM layer is deposited. In an alternative embodiment, TMR stack 300 can be transferred to another chamber after heating of the substrate and before deposition of the AFM layer. During deposition of the AFM layer, TMR stack 300 can be maintained at approximately the temperature that the substrate was heated.

After deposition of the AFM layer at the heating temperature, the first pinned layer is deposited. A cooling process may then be performed as described above at operation 210 of FIG. 2. Cooling can occur at temperatures ranging between −222° C. to −2° C. In one embodiment, the temperature of TMR stack 300 is less than 101° C. after cooling.

Table 1 illustrates the performance characteristics of a TMR reader manufactured using two conventional processes versus a TMR reader manufactured using the process disclosed in the present disclosure. The operations of each process are illustrated from left to right under the “Structure” heading. In the disclosed process, a second pinned layer (P1 b) is formed in addition to the first pinned layer (P1 a).

TABLE 1

Structure	Bi-layer	MOKE	CIPT

Heat

AFM

Heat

Cool

Pla

Cool

Plb

Hcp

Hex

Tbd_50%

H's

Hex

RA

MR

No

Y

No

Y

N

478

1954

245

3508

5546

0.46

78

No

Y

Yes

Y

N

591

2863

240

3690

6082

0.42

73

Yes

Y

No

Y

808

2982

288

4043

6924

0.44

87

As illustrated in Table 1, the disclosed process manufactures a TMR reader with an improved bi-layer performance, showing a higher pinned layer coercivity (Hcp), higher pinning magnetic field strength (Hex), and higher blocking temperature distribution (Tbd) than prior conventional processes. The TMR reader manufactured in accordance with the process disclosed herein also shows an improved full stack exchange bias (H's). As illustrated in FIG. 4, the TMR reader also shows an improved magnetoresistance (MR) as a function of the resistance area (RA). Such improvements are evidenced, as indicated in Table 1, by the Magneto Optical Kerr Effect (MOKE) which describes changes to light reflected from a magnetized surface and therefore indicative of the magnetization structure of a material, as well as Current In Plane Tunneling (CIPT) for measuring the properties of a tunnel junction.

Table 2 and FIG. 5 illustrate the pinning dependence of the wafer at different wafer degas pressures (p_ChE) in units of e*10⁻⁸Torr for the TMR reader of the present disclosure and the conventional heat and cool after AFM deposition TMR reader. As illustrated in Table 2, the conventional TMR reader's coercivity and pinning magnetic field strength is highly dependent on the degas pressure. By contrast, the coercivity and pinning magnetic field strength of the TMR reader of the present disclosure has little dependence on the degas pressure.

Old heat/cool	Wafer 1	612	−2715	4.8
	Wafer 2	605	−2657	5.2
	Wafer 3	573	−2626	5
	Wafer 4	513	−2481	5.8
	Wafer 5	567	−2535	6
In situ heat	Wafer	6	743	−3034	4.8
P1/cool/P1	Wafer	7	746	−3038	5.2
	Wafer 8	751	−3043	6
	Wafer 9	751	−3030	6.4
	Wafer 10	750	−2906	9

The system and process for manufacturing a TMR reader provides many benefits. First, it improves the pinning strength of the TMR reader. Second, it improves the blocking temperature distribution. This in turn may improve the TMR device reliability and allow for a reduction of the thickness of the IrMn AFM layer. In one embodiment, the thickness of the layer may be reduced to 50 angstroms. Third, the in-coming wafer degas effect is substantially reduced. Fourth, due to the heating treatment prior to the AFM layer deposition, the illustrated process produces a smoother film than prior processes. It should be noted that although various embodiments described herein have been presented in the context of a TMR sensor, the systems and methods of manufacturing a recording sensor are contemplated to be applicable to other sensors, such as a current perpendicular to plane-giant magnetoresistance (CPP-GMR) sensor, to Magnetic Random Access Memory (MRAM) or other types of magnetic sensing or memory devices.

Although described above in terms of various exemplary embodiments and implementations, it should be understood that the various features, aspects and functionality described in one or more of the individual embodiments are not limited in their applicability to the particular embodiment with which they are described, but instead can be applied, alone or in various combinations, to one or more of the other embodiments of the application, whether or not such embodiments are described and whether or not such features are presented as being a part of a described embodiment. Thus, the breadth and scope of the present application should not be limited by any of the above-described exemplary embodiments.

Terms and phrases used in this document, and variations thereof, unless otherwise expressly stated, should be construed as open ended as opposed to limiting. As examples of the foregoing: the term “including” should be read as meaning “including, without limitation” or the like; the term “example” is used to provide exemplary instances of the item in discussion, not an exhaustive or limiting list thereof; the terms “a” or “an” should be read as meaning “at least one,” “one or more” or the like; and adjectives such as “conventional,” “traditional,” “normal,” “standard,” “known” and terms of similar meaning should not be construed as limiting the item described to a given time period or to an item available as of a given time, but instead should be read to encompass conventional, traditional, normal, or standard technologies that may be available or known now or at any time in the future. Likewise, where this document refers to technologies that would be apparent or known to one of ordinary skill in the art, such technologies encompass those apparent or known to the skilled artisan now or at any time in the future.

The presence of broadening words and phrases such as “one or more,” “at least,” “but not limited to” or other like phrases in some instances shall not be read to mean that the narrower case is intended or required in instances where such broadening phrases may be absent. The use of the term “module” does not imply that the components or functionality described or claimed as part of the module are all configured in a common package. Indeed, any or all of the various components of a module, whether control logic or other components, can be combined in a single package or separately maintained and can further be distributed in multiple groupings or packages or across multiple locations.

Additionally, the various embodiments set forth herein are described in terms of exemplary block diagrams, flow charts and other illustrations. As will become apparent to one of ordinary skill in the art after reading this document, the illustrated embodiments and their various alternatives can be implemented without confinement to the illustrated examples. For example, block diagrams and their accompanying description should not be construed as mandating a particular architecture or configuration.

p_ChE(e-8Torr)

What is claimed is:

1. A method for manufacturing a magnetic device on a substrate, comprising:

heating the substrate in a first chamber;

depositing an antiferromagnetic (AFM) layer on the heated substrate;

adding a first pinned layer on the AFM layer; and

cooling the substrate after adding the first pinned layer.

2. The method of claim 1, wherein prior to heating, the substrate comprises:

a shield layer;

a magnetic seed layer on the shield layer; and

a spacer on the magnetic seed layer.

3. The method of claim 1, wherein the heated substrate is maintained at an approximately constant temperature during the operation of depositing the AFM layer.

4. The method of claim 3, wherein the substrate is heated in the first chamber to a temperature between 100° C. and 300° C.

5. The method of claim 4, wherein the temperature of the substrate is less than 100° C. after cooling the substrate.

6. The method of claim 5, wherein the operation of cooling provides lower interlayer diffusion between the first pinned layer and the second pinned layer.

7. The method of claim 4, wherein the substrate is heated using a resistive process.

8. The method of claim 4, wherein the substrate is heated using a rapid thermal process.

9. The method of claim 4, wherein the AFM layer is deposited in the first chamber that the substrate is heated.

10. The method of claim 4, wherein the substrate is moved to a second chamber prior to performing the operation of depositing the AFM layer.

11. The method of claim 1, further comprising adding a second pinned layer on the first pinned layer after cooling the substrate.