US20050035046A1 - Wet chemical processing chambers for processing microfeature workpieces - Google Patents
Wet chemical processing chambers for processing microfeature workpieces Download PDFInfo
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- US20050035046A1 US20050035046A1 US10/860,384 US86038404A US2005035046A1 US 20050035046 A1 US20050035046 A1 US 20050035046A1 US 86038404 A US86038404 A US 86038404A US 2005035046 A1 US2005035046 A1 US 2005035046A1
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- processing
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- fixed unit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
- B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
- B01D61/425—Electro-ultrafiltration
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Definitions
- the present invention is directed toward apparatus and methods for processing microfeature workpieces having a plurality of microdevices integrated in and/or on the workpiece.
- the microdevices can include submicron features.
- Particular aspects of the present invention are directed toward a wet chemical processing chamber having a fixed unit and a detachable unit that can be removed quickly for servicing components within the chamber.
- Microdevices are manufactured by depositing and working several layers of materials on a single substrate to produce a large number of individual devices. For example, layers of photoresist, conductive materials, and dielectric materials are deposited, patterned, developed, etched, planarized, and otherwise manipulated to form features in and/or on a substrate. The features are arranged to form integrated circuits, micro-fluidic systems, and other structures.
- FIG. 1 schematically illustrates an integrated tool 10 that can perform one or more wet chemical processes.
- the tool 10 includes a housing or cabinet 20 having a platform 22 , a plurality of wet chemical processing chambers 30 in the cabinet 20 , and a transport system 40 .
- the tool 10 also includes lift-rotate units 32 coupled to corresponding processing chambers 30 for loading/unloading the workpieces W.
- the processing chambers 30 can be rinse/dry chambers, cleaning capsules, etching capsules, electrochemical deposition chambers, or other types of wet chemical processing vessels.
- the transport system 40 includes a linear track 42 and a robot 44 that moves along the track 42 to transport individual workpieces W within the tool 10 .
- the integrated tool 10 further includes a workpiece storage unit 60 having a plurality of containers 62 for holding workpieces W. In operation, the robot 44 transports workpieces to/from the containers 62 and the processing chambers 30 according to a predetermined workflow within the tool 10 .
- One problem with repairing or maintaining existing wet chemical processing chambers is that the tool must be taken offline for an extended period of time to replace the electrodes or service other components in the processing chambers 30 .
- a pre-maintained processing chamber 30 is mounted to the platform 22 at the vacant station.
- the lift/rotate unit 32 is generally moved out of the way and the operator reaches into the processing chamber 30 from above to repair or replace the components within the chamber 30 .
- the worn electrodes are disconnected from the chamber 30 and new electrodes are then installed.
- the tool 10 is not repaired or maintained until at least two or three processing chambers 30 are out of specification, then the tool operates at only a fraction of its full capacity for a period of time before it is taken offline for maintenance.
- This increases the operating costs of the tool 10 because the throughput not only suffers while the tool 10 is offline to replace the wet processing chambers 30 and recalibrate the robot 44 , but the throughput is also reduced while the tool is online because it operates at only a fraction of its full capacity.
- the electrochemical deposition chambers 30 must consistently meet much higher performance specifications.
- the present invention is directed toward wet chemical processing chambers with quick-release detachable units that reduce the downtime for repairing or maintaining processing components in the chambers compared to existing wet chemical processing chambers.
- processing components that require periodic maintenance or repair are housed or otherwise carried by the detachable units.
- an electrode can be one type of processing component that is housed within a detachable unit.
- Such processing components can be quickly replaced by simply removing the detachable unit from the chamber and installing a replacement detachable unit.
- the detachable unit is generally accessible without having to move the lift-rotate units or detach the head assembly of the chambers.
- the detachable unit can also be coupled to the chamber by a quick-release mechanism that is easily accessible. As such, the downtime for repairing or maintaining electrodes or other processing components in chambers is reduced by locating such components in detachable units that can be removed and replaced in only a few minutes compared to several hours for performing the same work on existing wet chemical processing chambers.
- a wet chemical processing chamber in accordance with the invention comprises a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit.
- the fixed unit can have a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool.
- the detachable unit can include a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit.
- the seal has an orifice through which processing fluid can flow between the first and second flow systems, and the processing component can impart a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.
- the tool can include a frame and a mounting module carried by the frame.
- the mounting module can include a plurality of positioning elements and attachment elements.
- the wet chemical processing chamber can have a fixed unit including a mounting fixture with a first interface member engaged with one of the positioning elements of the mounting module and a first fastener engaged with one of the attachment elements of the mounting module.
- the mounting module is configured to maintain relative positions between positioning elements such that a transport system for transporting workpieces to/from the wet chemical processing chamber does not need to be recalibrated when the processing chamber is replaced with another processing chamber or when one detachable unit is replaced with another detachable unit.
- FIG. 1 is a schematic top plan view of a wet chemical processing tool in accordance with the prior art.
- FIG. 2 is a schematic view illustrating a wet chemical processing chamber in accordance with one embodiment of the invention.
- FIG. 3 is a schematic view illustrating the operation of a wet chemical processing chamber in accordance with an embodiment of the invention.
- FIG. 4A is cross-sectional view schematically illustrating a wet chemical processing chamber in a detached configuration in accordance with an embodiment of the invention.
- FIG. 4B is a cross-sectional view schematically illustrating a wet chemical processing chamber in an assembled configuration in accordance with an embodiment of the invention.
- FIG. 5A is a top isometric view of a carriage for loading/unloading a detachable unit from a wet chemical processing chamber in accordance with an embodiment of the invention.
- FIG. 5B is a bottom isometric view of a carriage for loading/unloading a detachable unit of a wet chemical processing chamber in accordance with an embodiment of the invention.
- FIG. 6 is a top plan view of a wet chemical processing tool including a wet chemical processing chamber in accordance with another aspect of the invention.
- FIG. 7 is an isometric view of a mounting module for holding a wet chemical processing chamber in a wet chemical processing tool in accordance with an embodiment of the invention.
- FIG. 8 is a cross-sectional view taken along line 8 - 8 of FIG. 7 of a mounting module for carrying a wet chemical processing chamber in accordance with an embodiment of the invention.
- FIG. 9 is a cross-sectional view showing a portion of a deck of a mounting module in greater detail.
- FIG. 10 is a cross-sectional isometric view schematically illustrating a wet chemical processing chamber carried by a mounting module of a wet chemical processing tool in accordance with an embodiment of the invention.
- microfeature workpiece or “workpiece” refer to substrates on or in which microdevices are formed integrally.
- Typical microdevices include microelectronic circuits or components, thin-film recording heads, data storage elements, microfluidic devices, and other products.
- Micromachines or micromechanical devices are included within this definition because they are manufactured using much of the same technology as used in the fabrication of integrated circuits.
- the substrates can be semiconductive pieces (e.g., doped silicon wafers or gallium arsenide wafers), nonconductive pieces (e.g., various ceramic substrates) or conductive pieces.
- wet chemical processing chambers for processing microfeature workpieces are described in the context of electrochemical deposition chambers for electrolytically or electrolessly depositing metals or electrophoretic resist in or on structures of a workpiece.
- the wet chemical processing chambers in accordance with the invention can also be used for etching, rinsing, or other types of wet chemical processes in the fabrication of microfeatures in and/or on semiconductor substrates or other types of workpieces.
- FIGS. 2-10 Several embodiments of wet chemical processing chambers and integrated tools in accordance with the invention are set forth in FIGS. 2-10 and the corresponding text to provide a thorough understanding of particular embodiments of the invention. A person skilled in the art, however, will understand that the invention may have additional embodiments or that the invention may be practiced without several of the details of the embodiments shown in FIGS. 2-10 .
- FIG. 2 schematically illustrates a wet chemical processing chamber 100 that enables quick repair or replacement of components to reduce the downtime for maintaining processing chambers.
- the processing chamber 100 includes a wet chemical vessel 102 and a head 104 .
- the vessel 102 is carried by a deck 106 of a tool that can include several other processing chambers (not shown) and a workpiece transport system (not shown) for automatically handling workpieces.
- the vessel 102 contains the processing fluid and several components for directing the processing fluid or otherwise imparting properties to the processing fluid for processing a workpiece.
- the head 104 is carried by a lift-rotate unit 108 that moves the head 104 to load/unload the workpiece and to position the workpiece at a processing site 109 within the vessel 102 .
- the vessel 102 When the processing chamber 100 is an electrochemical deposition station for electroplating materials onto a workpiece, the vessel 102 typically has a fluid flow system and at least one electrode, and the head 104 typically includes a workpiece holder having a contact assembly with a plurality of electrical contacts configured to engage a conductive layer on the workpiece.
- the vessel 102 When the processing chamber 100 is a cleaning chamber or other type of capsule, the vessel 102 includes a plurality of fluid dispensers for flowing a fluid across the workpiece and the head 104 typically includes a workpiece holder. Suitable configurations of fluid flow systems, electrodes, and other processing components in the vessel 102 are disclosed in U.S. application Ser. Nos.
- the vessel 102 includes a fixed unit 110 mounted to the deck 106 and a detachable unit 120 carried by the fixed unit 110 .
- the fixed unit 110 can include a chassis 112 , a first flow system 114 , and a mounting fixture 116 .
- the chassis 112 can be a dielectric housing that is chemically compatible with the processing fluid.
- the chassis 112 for example, can be a high density polymer or other suitable material.
- the first flow system 114 can be configured to provide the desired flow to the processing site 109 . In electrochemical deposition chambers, the first flow system 114 can be configured to provide a flow that has a substantially uniform velocity in a direction normal to the workpiece throughout the processing site 109 .
- the mounting fixture 116 can be flanges or a ring projecting outwardly from the chassis 112 to engage the top surface of the deck 106 .
- the mounting fixture 116 can be configured to precisely locate the fixed unit 110 relative to the deck 106 as explained in more detail below.
- the fixed unit 110 can further include a processing component 118 to impart a property to the processing fluid flowing through the fixed unit 110 .
- the processing component 118 can be an electric field shaping element that shapes the electric field in the processing site 109 , a filter, a membrane, a nozzle, or another type of fluid dispenser.
- the processing component 118 can also be any combination of these types of structures. Suitable structures for first flow systems 114 , mounting fixtures 116 and processing components 118 for the fixed unit 110 are disclosed in U.S. application Ser. Nos. 09/872,151 and 09/804,697 incorporated by reference above.
- the detachable unit 120 of the vessel 102 includes a container 122 , a second flow system 124 configured to direct the processing fluid to and/or from the first flow system 114 of the fixed unit 110 , and a processing component 126 that imparts a property to the processing fluid.
- the second flow system 124 can include inlets and outlets to deliver processing fluid to the first flow system 114 and to receive processing from the first flow system 114 .
- the first and second flow systems operate together to provide a desired flow of processing fluid at the processing site.
- the first and second flow systems 114 and 124 can also be configured to provide a forward flow relative to the processing component 126 .
- the processing fluid passes the processing component 126 in the detachable unit 120 before the processing fluid reaches the processing site 109 .
- the first and second flow systems can also be configured to provide a reverse flow past the processing component 126 .
- the processing fluid passes the processing component 126 after the processing fluid has passed through the processing site 109 .
- the processing component 126 is disposed in the detachable unit 120 .
- the processing component 126 can be a filter, membrane, or electrode.
- the processing component 126 can be an electrode assembly having a plurality of electrodes arranged in a concentric configuration or another configuration suitable for electroplating materials onto the workpiece.
- the processing component 126 can be a combination of filters, membranes, electrodes, dielectric partitions between electrodes that define individual electrode compartments, spray bars with a plurality of nozzles, paddle platers, or other components used to process microfeature workpieces.
- the processing component 126 is generally a consumable component (e.g., a consumable electrode), a component that collects particulate matter or other undesirable constituents in the processing fluid to protect the surface of the workpiece (e.g., filters of membranes), or other components that may fail or need to be cleaned.
- the processing component 126 in the detachable unit 120 is accordingly subject to regular maintenance or replacement to maintain the performance of the processing chamber 100 within predetermined specifications.
- Such processing components can accordingly be quickly replaced with new or refurbished components by simply replacing one detachable unit 120 with a replacement detachable unit without having to move the head 104 or the fixed unit 110 .
- the vessel 102 also includes a seal 130 to prevent leaking between the fixed unit 110 and the detachable unit 120 .
- the seal is typically positioned between the fixed unit 110 and the detachable unit 120 .
- the seal 130 can include at least one orifice to allow the processing fluid to flow between the first flow system 114 in the fixed unit 110 and the second flow system 124 in the detachable unit 120 .
- the seal 130 is a gasket with a pattern of orifices to allow fluid to flow between the first and second flow systems 114 and 124 .
- the seal 130 orgasket is typically a compressible member that prevents liquid from leaking between the various flow channels of the flow systems.
- the seal 130 can also be made from a dielectric material that electrically isolates different fluid flows as they flow between the first and second flow systems 114 and 124 .
- Suitable materials for the seal 130 include VITON® closed cell foams, closed cell silicon, elastomers, polymers, rubber and other materials.
- the vessel 102 also includes an attachment assembly 140 for attaching the detachable unit 120 to the fixed unit 110 .
- the attachment assembly 140 can be a quick-release unit, such as a clamp or a plurality of clamps, that guides the detachable unit 120 to a desired orientation with respect to the fixed unit 110 and securely holds the detachable unit 120 to the fixed unit 110 .
- the attachment assembly 140 can be configured to move from a first position in which the detachable unit 120 is secured to the fixed unit 110 and a second position in which the detachable unit 120 can be removed from the fixed unit 110 . In several embodiments, as the attachment assembly 140 moves from the second position to the first position, the attachment assembly 140 drives the detachable unit 120 toward the fixed unit 110 .
- the attachment assembly 140 can be a clamp ring, a plurality of latches, a plurality of bolts, or other types of fasteners.
- FIG. 3 schematically illustrates the operation of the wet chemical processing chamber 100 for repairing or maintaining processing components in the detachable unit.
- a first detachable unit 120 a is removed from the fixed unit 110 after the flow system 124 a and/or the processing component 126 a in the first detachable unit 120 a no longer meet specifications.
- the seal 130 may also be removed, but this is optional.
- a second detachable unit 120 b is then installed by aligning it with the fixed unit 110 and engaging the attachment assembly 140 with the second detachable unit 120 b .
- the second detachable unit 120 b can include a flow system 124 b and processing components 126 b that are new or have been refurbished so that the processing chamber 100 can meet the specifications required for processing microfeature workpieces.
- One advantage of the processing chamber 100 illustrated in FIGS. 2 and 3 is that components in need of repair or maintenance can be quickly replaced with new or refurbished components without shutting down the processing chamber 100 for a significant period of time.
- One detachable unit 120 can be quickly removed from the fixed unit 110 , and then a replacement detachable unit 120 can be installed in only a matter of a few minutes. This significantly reduces the downtime for repairing electrodes or other processing components compared to conventional systems that require the components to be repaired in-situ on the tool or require the entire chamber to be removed from the tool.
- Another advantage of the processing chamber 100 is that the processing components 126 in the detachable units 120 can be replaced from a location that is easily accessible under the deck 106 .
- FIG. 4A is a cross-sectional view illustrating a vessel 402 in accordance with an embodiment of the invention.
- the vessel 402 can include a fixed unit 410 , a detachable unit 420 , a seal 430 , and an attachment assembly 440 .
- the fixed unit 410 can include a chassis 412 , a first flow system 414 (shown schematically), and processing components 418 (shown schematically).
- the detachable unit 420 can include a container 422 , a second flow system 424 (shown schematically), and processing components 426 (shown schematically).
- the seal 430 can be a gasket having an opening 431 to allow fluid to flow between the first and second flow systems 414 and 424 .
- the attachment assembly 440 can be a clamp ring.
- the fixed unit 410 can further include a plurality of hangers 450 arranged at a common radius with respect to a center line of the fixed unit 410 or in another pattern.
- the hangers 450 can include shoulders 452 to hold the attachment assembly.
- the attachment assembly 440 can be a ring that springs radially outwardly to contact the hangers 450 and rest on the shoulders 452 in an open position.
- the fixed unit 410 further includes a beveled guide surface 453 , a bearing ring 454 above the beveled guide surface 453 , and a seal surface 456 .
- the guide surface 453 can be an annular surface or a series of arcuate segments inclined upwardly with increasing radius.
- the bearing ring 454 can be a metal ring having a bearing surface inclined upwardly with decreasing radius.
- the bearing ring 454 can also be made from other materials that are typically harder than the material of the chassis 412 .
- the detachable unit 420 can include a rim 460 having a lower surface 462 and an upper surface 464 .
- the lower surface 462 and the upper surface 464 can be inclined upwardly with increasing radius.
- the upper surface 464 more specifically, can be inclined at an angle to mate with the guide surface 453 of the fixed unit 410 .
- the detachable unit 420 can further include a seal surface 466 configured to retain the seal 430 , slide channels 467 a and 467 b , and a bottom surface 468 .
- the attachment assembly 440 can include a first rim 472 configured to engage the lower surface 462 of the detachable unit 420 and a second rim 474 configured to engage the bearing surface of the bearing ring 454 .
- the attachment assembly 440 can include a latch (not shown) or lever that moves the ring radially inwardly and locks the ring into a fixed position.
- FIG. 4B illustrates the vessel 402 after the detachable unit 420 has been attached to the fixed unit 410 .
- the attachment assembly 440 moves radially inwardly so that the first rim 472 engages the lower surface 462 of the detachable unit 420 and the second rim 474 engages the bearing surface of the bearing ring 454 .
- the radially inward motion of the first rim 472 along the lower surface 462 lifts the detachable unit 420 upwardly toward the fixed unit 410 .
- the upper surface 464 engages the guide surface 453 to position the detachable unit 420 at a desired position with respect to the fixed unit 410 .
- the second rim 474 of the attachment assembly 440 moves radially inwardly along the inclined surface of the bearing ring 454 to clamp the seal 130 between the seal surfaces 456 and 466 .
- a lever (not shown) on the attachment assembly 440 can be moved from an open position to a closed position to induce a hoop stress in the attachment assembly 440 for securely holding the detachable unit 420 to the fixed unit 410 .
- FIG. 5A is a top isometric view of a carriage 500 for installing and removing a detachable unit in a wet chemical processing chamber in accordance with one embodiment of the invention.
- the carriage 500 can include a bracket 510 that mounts to the underside of the deck 106 ( FIG. 2 ) of the tool.
- the carriage 500 can further include guide rails 512 and an end stop 514 .
- the guide rails 512 receive the slide channels 467 a and 467 b ( FIGS. 4A and 4B ), and the end stop 514 engages a mating rounded portion of the detachable unit 420 .
- an operator slides the detachable unit 420 along the rails 512 until the detachable unit engages the end stop 514 .
- FIG. 5B is a bottom isometric view illustrating additional aspects of the carriage 500 .
- the carriage 500 can further include an actuator 520 having a handle 522 , a shaft 524 , and lifters 526 that are moved by the shaft 524 .
- the actuator 520 can further include a rod 528 connected to the lifters 526 and positioned in a joint 529 . The rotation of the handle accordingly rotates the rod 528 within the joint 529 to raise and lower the lifters 526 .
- the actuator 520 is moved to a first position as shown in FIG. 5B .
- the detachable unit is then inserted along the rails 512 as described above, and the actuator 520 is lifted.
- the actuator 520 rotates upwardly (arrow R)
- the handle 522 passes through a gap 530 in a bottom flange 531 of the bracket 510 .
- the lifters 526 accordingly engage the bottom surface 468 ( FIG. 4B ) and raise the detachable unit upwardly toward the fixed unit.
- the handle 522 slides axially along the shaft 524 (arrow A) to position the handle on top of the flange 531 . Referring back to FIG.
- the bevelled surfaces on the bottom of the supports 450 initially align the detachable unit 420 with the fixed unit 410 .
- the upper surface 464 of the detachable unit 420 and the guide surface 453 of the fixed unit 410 position the detachable unit 420 into final alignment with the fixed unit 410 .
- the attachment assembly 440 can then be actuated to clamp the detachable unit 420 to the fixed unit 410 .
- the carriage 500 accordingly makes it easier to remove and install the detachable unit 420 .
- FIG. 6 is a top plan view showing a portion of an integrated tool 600 in accordance with an embodiment of the invention.
- the integrated tool 600 includes a frame 610 , a dimensionally stable mounting module 620 mounted to the frame 610 , a plurality of wet chemical processing chambers 670 , and a plurality of lift-rotate units 680 .
- the tool 600 can also include a transport system 690 .
- the mounting module 620 carries the processing chambers 670 , the lift-rotate units 680 , and the transport system 690 .
- the wet chemical processing chambers 670 in the tool 600 can include vessels having fixed units and detachable units as described above with reference to FIGS. 2-5 . As such, any of the embodiments of the wet chemical processing chambers 100 and 400 can be the wet chemical processing chambers 670 in the integrated tool 600 .
- the frame 610 of the tool 600 has a plurality of posts 611 and cross-bars 612 that are welded together in a manner known in the art.
- the mounting module 620 is at least partially housed within the frame 610 . In one embodiment, the mounting module 620 is carried by cross-bars 612 of the frame 610 , but the mounting module 620 can stand directly on the floor of the facility or other structures in other embodiments.
- the mounting module 620 is a rigid, stable structure that maintains the relative positions between the wet chemical processing chambers 670 , the lift-rotate units 680 , and the transport system 690 .
- One aspect of the mounting module 620 is that it is much more rigid and has a significantly greater structural integrity compared to the frame 610 so that the relative positions between the wet chemical processing chambers 670 , the lift-rotate units 680 , and the transport system 690 do not change over time.
- Another aspect of the mounting module 620 is that it includes a dimensionally stable deck 630 with positioning elements at precise locations for positioning the processing chambers 670 and the lift-rotate units 680 at known locations on the deck 630 .
- the transport system 690 can be mounted directly to the deck 630 .
- the mounting module 620 also has a dimensionally stable platform 650 and the transport system 690 is mounted to the platform 650 .
- the deck 630 and the platform 650 are fixedly positioned relative to each other so that positioning elements on the deck 630 and positioning elements on the platform 650 do not move relative to each other.
- the mounting module 620 accordingly provides a system in which wet chemical processing chambers 670 and lift-rotate units 680 can be removed and replaced with interchangeable components in a manner that accurately positions the replacement components at precise locations on the deck 630 .
- the tool 600 is particularly suitable for applications that have demanding specifications which require frequent maintenance of the wet chemical processing chambers 670 , the lift-rotate units 680 , or the transport system 690 .
- a wet chemical processing chamber 670 can be repaired or maintained by simply detaching the chamber from the processing deck 630 and replacing the chamber 670 with an interchangeable chamber having mounting hardware configured to interface with the positioning elements on the deck 630 . Because the mounting module 620 is dimensionally stable and the mounting hardware of the replacement processing chamber 670 interfaces with the deck 630 , the chambers 670 can be interchanged on the deck 630 without having to recalibrate the transport system 690 .
- This aspect of the tool 600 is particularly useful when the fixed unit 110 ( FIG. 2 ) must be removed to repair the chamber.
- the transport system 690 retrieves workpieces from a load/unload module 698 attached to the mounting module 620 .
- the transport system 690 includes a track 692 , a robot 694 , and at least one end-effector 696 .
- the track 692 is mounted to the platform 650 . More specifically, the track 692 interfaces with positioning elements on the platform 650 to accurately position the track 692 relative to the chambers 670 and the lift-rotate units 680 attached to the deck 630 .
- the robot 694 and end-effectors 696 can accordingly move in a fixed, dimensionally stable reference frame established by the mounting module 620 .
- the tool 600 can further include a plurality of panels 699 attached to the frame 610 to enclose the mounting module 620 , the wet chemical processing chambers 670 , the lift-rotate units 680 , and the transport system 690 in a cabinet.
- the panels 699 on one or both sides of the tool 600 can be removed in the region above the processing deck 630 to provide an open tool.
- FIG. 7 is an isometric view of a mounting module 620 in accordance with an embodiment of the invention for use in the tool 600 .
- the deck 630 includes a rigid first panel 631 and a rigid second panel 632 superimposed underneath the first panel 631 .
- the first panel 631 can be an outer member and the second panel 632 can be an interior member juxtaposed to the outer member.
- the first and second panels 631 and 632 can also have different configurations than the configuration in FIG. 7 .
- a plurality of chamber receptacles 633 are disposed in the first and second panels 631 and 632 to receive the wet chemical processing chambers 670 ( FIG. 6 ).
- the deck 630 can further include a plurality of positioning elements 634 and attachment elements 635 arranged in a precise pattern across the first panel 631 .
- the positioning elements 634 can be holes machined in the first panel 631 at precise locations and with precise dimensions to receive dowels or pins that interface with the wet chemical processing chambers 670 ( FIG. 6 ).
- the positioning elements 634 can be pins, such as cylindrical pins or conical pins, that project upwardly from the first panel 631 to be received by mating structures in the wet chemical processing chambers 670 .
- the deck 630 has a first set of positioning elements 634 located at each chamber receptacle 633 to accurately position the individual wet chemical processing chambers at precise locations on the mounting module 620 .
- the deck 630 can also include a second set of positioning elements 634 near each receptacle 633 to accurately position individual lift-rotate units 680 at precise locations on the mounting module 620 .
- the attachment elements 635 can be threaded holes in the first panel 631 that receive bolts to secure the chambers 670 and the lift-rotate units 680 to the deck 630 .
- the mounting module 620 also includes exterior side plates 660 along longitudinal outer edges of the deck 630 , interior side plates 661 along longitudinal inner edges of the deck 630 , and endplates 662 and 664 attached to the ends of the deck 630 .
- the transport platform 650 is attached to the interior side plates 661 and the end plates 662 and 664 .
- the transport platform 650 includes positioning elements 652 for accurately positioning the track 692 ( FIG. 6 ) of the transport system 690 on the mounting module 620 .
- the transport platform 650 can further include attachment elements, such as tapped holes, that receive bolts to secure the track 692 to the platform 650 .
- FIG. 8 is a cross-sectional view illustrating one suitable embodiment of the internal structure of the deck 630
- FIG. 9 is a detailed view of a portion of the deck shown in FIG. 8
- the deck 630 includes bracing 640 , such as joists, extending laterally between the exterior side plates 660 and the interior side plates 661 .
- the first panel 631 is attached to the upper side of the bracing 640
- the second panel 632 is attached to the lower side of the bracing 640 .
- the deck 630 can further include a plurality of throughbolts 642 and nuts 644 that secure the first and second panels 631 and 632 to the bracing 640 .
- the bracing 640 has a plurality of holes 645 through which the throughbolts 642 extend.
- the nuts 644 can be welded to the bolts 642 to enhance the connection between these components.
- the panels and bracing of the deck 630 can be made from stainless steel, other metal alloys, solid cast materials, or fiber-reinforced composites.
- the panels and plates can be made from Nitronic 50 stainless steel, Hastelloy 625 steel alloys, or a solid cast epoxy filled with mica.
- the fiber-reinforced composites can include a carbon-fiber or Kevlar® mesh in a hardened resin.
- the material for the panels 631 and 632 should be highly rigid and compatible with the chemicals used in the wet chemical processes. Stainless steel is well-suited for many applications because it is strong but not affected by many of the electrolytic solutions or cleaning solutions used in wet chemical processes.
- the panels and plates 631 , 632 , 660 , 661 , 662 and 664 are 0.125 to 0.375 inch thick stainless steel, and more specifically they can be 0.250 inch thick stainless steel.
- the panels and plates, however, can have different thickness in other embodiments.
- the bracing 640 can also be stainless steel, fiber-reinforced composite materials, other metal alloys, and/or solid cast materials.
- the bracing can be 0.5 to 2.0 inch wide stainless steel joists, and more specifically 1.0 inch wide by 2.0 inches tall stainless steel joists.
- the bracing 640 can be a honey-comb core, a light-weight foamed metal or other type of foam, polymers, fiber glass or other materials.
- the mounting module 620 is constructed by assembling the sections of the deck 630 , and then welding or otherwise adhering the end plates 662 and 664 to the sections of the deck 630 .
- the components of the deck 630 are generally secured together by the throughbolts 642 without welds.
- the outer side plates 660 and the interior side plates 661 are attached to the deck 630 and the end plates 662 and 664 using welds and/or fasteners.
- the platform 650 is then securely attached to the end plates 662 and 664 , and the interior side plates 661 .
- the mounting module 620 provides a heavy-duty, dimensionally stable structure that maintains the relative positions between the positioning elements 634 on the deck 630 and the positioning elements 652 on the platform 650 within a range that does not require the transport system 690 to be recalibrated each time a replacement processing chamber 670 or lift-rotate unit 680 is mounted to the deck 630 .
- the mounting module 620 is generally a rigid structure that is sufficiently strong to maintain the relative positions between the positioning elements 634 and 652 when the wet chemical processing chambers 670 , the lift-rotate units 680 , and the transport system 690 are mounted to the mounting module 620 .
- the mounting module 620 is configured to maintain the relative positions between the positioning elements 634 and 652 to within 0.025 inch.
- the mounting module is configured to maintain the relative positions between the positioning elements 634 and 652 to within approximately 0.005 to 0.015 inch.
- the deck 630 often maintains a uniformly flat surface to within approximately 0.025 inch, and in more specific embodiments to approximately 0.005-0.015 inch.
- FIG. 10 is an isometric cross-sectional view showing the interface between a wet chemical processing chamber 670 and the deck 630 .
- the chamber 670 can include the processing vessel 102 or 402 described above and a collar 672 .
- the collar 672 and the vessel 102 can be separate components that are connected together.
- the collar 672 can be made from a dimensionally stable material, such as stainless steel, fiber-reinforced materials, steel alloys, cast solid materials, or other suitably rigid materials.
- the collar 672 is integral with the vessel 102 and formed from a high-density polymer or other suitable material.
- the collar 672 is one embodiment of a mounting fixture 116 ( FIG. 2 ).
- the collar 672 includes a plurality of interface members 674 that are arranged in a pattern to be aligned with the positioning elements 634 on the deck 630 .
- the positioning elements 634 and the interface members 674 are also configured to mate with one another to precisely position the collar 672 , and thus the chamber 670 , at a desired operating location on the deck 630 to work with lift-rotate unit 680 and the transport system 690 .
- the positioning elements 634 can be a set of precisely machined holes in the deck 630 and dowels received in the holes, and the interface members 674 can be holes precisely machined in the collar 672 to mate with the dowels.
- the dowels can be pins with cylindrical, spherical, conical or other suitable shapes to align and position the collar 672 at a precise location relative to the deck 630 .
- the collar 672 can further include a plurality of fasteners 675 arranged to be aligned with the attachment elements 635 in the deck 630 .
- the fasteners 675 can be bolts or other threaded members that securely engage the attachment elements 635 to secure the collar 672 to the deck 630 .
- the collar 672 accordingly holds the processing vessel 102 at a fixed, precise location on the deck.
Abstract
A wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing fluid can flow between the first and second flow systems, and the processing component can impart a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.
Description
- The present application claims the benefit of U.S. Application No. 60/476,786 filed on Jun. 6, 2003; 60/476,333 filed on Jun. 6, 2003; 60/476,881 filed on Jun. 6, 2003; and 60/476,776 filed on Jun. 6, 2003, all of which are incorporated herein in their entirety, including appendices, by reference. Additionally, U.S. Application No. 60/501,566 filed on Sep. 9, 2003 is also incorporated herein in its entirety by reference.
- The present invention is directed toward apparatus and methods for processing microfeature workpieces having a plurality of microdevices integrated in and/or on the workpiece. The microdevices can include submicron features. Particular aspects of the present invention are directed toward a wet chemical processing chamber having a fixed unit and a detachable unit that can be removed quickly for servicing components within the chamber.
- Microdevices are manufactured by depositing and working several layers of materials on a single substrate to produce a large number of individual devices. For example, layers of photoresist, conductive materials, and dielectric materials are deposited, patterned, developed, etched, planarized, and otherwise manipulated to form features in and/or on a substrate. The features are arranged to form integrated circuits, micro-fluidic systems, and other structures.
- Wet chemical processes are commonly used to form features on microfeature workpieces. Wet chemical processes are generally performed in wet chemical processing tools that have a plurality of individual processing chambers for cleaning, etching, electrochemically depositing materials, or performing combinations of these processes.
FIG. 1 schematically illustrates anintegrated tool 10 that can perform one or more wet chemical processes. Thetool 10 includes a housing orcabinet 20 having aplatform 22, a plurality of wetchemical processing chambers 30 in thecabinet 20, and atransport system 40. Thetool 10 also includes lift-rotate units 32 coupled tocorresponding processing chambers 30 for loading/unloading the workpieces W. Theprocessing chambers 30 can be rinse/dry chambers, cleaning capsules, etching capsules, electrochemical deposition chambers, or other types of wet chemical processing vessels. Thetransport system 40 includes alinear track 42 and arobot 44 that moves along thetrack 42 to transport individual workpieces W within thetool 10. The integratedtool 10 further includes aworkpiece storage unit 60 having a plurality ofcontainers 62 for holding workpieces W. In operation, therobot 44 transports workpieces to/from thecontainers 62 and theprocessing chambers 30 according to a predetermined workflow within thetool 10. - One concern of integrated wet chemical processing tools is that the processing chambers must be maintained and/or repaired periodically. In electrochemical deposition chambers, for example, consumable electrodes degrade over time because the reaction between the electrodes and the electrolytic solution decomposes the electrodes. The shape of consumable electrodes accordingly changes causing variations in the electrical field. As a result, consumable electrodes must be replaced periodically to maintain the desired deposition parameters across the workpiece. The electrical contacts that contact the workpiece also may need to be cleaned or replaced periodically. To maintain or repair electrochemical deposition chambers, they can be removed from the
tool 10 and replaced with an extra chamber, or they can be serviced in-situ within the tool. - One problem with repairing or maintaining existing wet chemical processing chambers is that the tool must be taken offline for an extended period of time to replace the electrodes or service other components in the
processing chambers 30. When theprocessing chamber 30 is removed from the tool, apre-maintained processing chamber 30 is mounted to theplatform 22 at the vacant station. When theprocessing chamber 30 is serviced in-situ on the platform, the lift/rotate unit 32 is generally moved out of the way and the operator reaches into theprocessing chamber 30 from above to repair or replace the components within thechamber 30. For example, to replace consumable electrodes, the worn electrodes are disconnected from thechamber 30 and new electrodes are then installed. This can be an extremely cumbersome process because there is only a limited amount of space in thetool 10 to access the lower portion of thechambers 30 where the electrodes are positioned. After thechamber 30 has been repaired or replaced, therobot 44 and the lift-rotate unit 32 are recalibrated to operate with the processing chamber. - The processes for replacing worn electrodes, servicing other components in-situ within the tool, or replacing a chamber with another chamber require a significant amount of time during which the tool cannot process workpieces. Moreover, the
robot 44 and the lift-rotate unit 32 are generally recalibrated to the repaired chamber after each repair; this is a time-consuming process that increases the downtime for repairing or maintaining processing chambers. As a result, when only oneprocessing chamber 30 of thetool 10 does not meet specifications, it is often more efficient to continue operating thetool 10 without stopping to repair the oneprocessing chamber 30 until more processing chambers do not meet the performance specifications. The loss of throughput of asingle processing chamber 30, therefore, is not as severe as the loss of throughput caused by taking thetool 10 offline to repair or maintain a single one of theprocessing chambers 30. - The practice of operating the
tool 10 until at least twoprocessing chambers 30 do not meet specifications severely impacts the throughput of thetool 10. For example, if thetool 10 is not repaired or maintained until at least two or threeprocessing chambers 30 are out of specification, then the tool operates at only a fraction of its full capacity for a period of time before it is taken offline for maintenance. This increases the operating costs of thetool 10 because the throughput not only suffers while thetool 10 is offline to replace thewet processing chambers 30 and recalibrate therobot 44, but the throughput is also reduced while the tool is online because it operates at only a fraction of its full capacity. Moreover, as the feature sizes decrease, theelectrochemical deposition chambers 30 must consistently meet much higher performance specifications. This causes theprocessing chambers 30 to fall out of specifications sooner, which results in shutting down the tool more frequently. Therefore, the downtime associated with repairing and/or maintaining electrochemical deposition chambers and other types of wet chemical processing chambers is significantly increasing the cost of operating wet chemical processing tools. - The present invention is directed toward wet chemical processing chambers with quick-release detachable units that reduce the downtime for repairing or maintaining processing components in the chambers compared to existing wet chemical processing chambers. In several embodiments of the inventive wet chemical processing chambers, processing components that require periodic maintenance or repair are housed or otherwise carried by the detachable units. For example, an electrode can be one type of processing component that is housed within a detachable unit. Such processing components can be quickly replaced by simply removing the detachable unit from the chamber and installing a replacement detachable unit. The detachable unit is generally accessible without having to move the lift-rotate units or detach the head assembly of the chambers. The detachable unit can also be coupled to the chamber by a quick-release mechanism that is easily accessible. As such, the downtime for repairing or maintaining electrodes or other processing components in chambers is reduced by locating such components in detachable units that can be removed and replaced in only a few minutes compared to several hours for performing the same work on existing wet chemical processing chambers.
- In one embodiment, a wet chemical processing chamber in accordance with the invention comprises a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal contacting the fixed unit and the detachable unit, and a processing component disposed in the fixed unit and/or the detachable unit. The fixed unit can have a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a platform or deck of an integrated processing tool. The detachable unit can include a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit. The seal has an orifice through which processing fluid can flow between the first and second flow systems, and the processing component can impart a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.
- Another aspect of the invention is an integrated tool for wet chemical processing of microfeature workpieces. In one embodiment, the tool can include a frame and a mounting module carried by the frame. The mounting module can include a plurality of positioning elements and attachment elements. In this embodiment, the wet chemical processing chamber can have a fixed unit including a mounting fixture with a first interface member engaged with one of the positioning elements of the mounting module and a first fastener engaged with one of the attachment elements of the mounting module. The mounting module is configured to maintain relative positions between positioning elements such that a transport system for transporting workpieces to/from the wet chemical processing chamber does not need to be recalibrated when the processing chamber is replaced with another processing chamber or when one detachable unit is replaced with another detachable unit.
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FIG. 1 is a schematic top plan view of a wet chemical processing tool in accordance with the prior art. -
FIG. 2 is a schematic view illustrating a wet chemical processing chamber in accordance with one embodiment of the invention. -
FIG. 3 is a schematic view illustrating the operation of a wet chemical processing chamber in accordance with an embodiment of the invention. -
FIG. 4A is cross-sectional view schematically illustrating a wet chemical processing chamber in a detached configuration in accordance with an embodiment of the invention. -
FIG. 4B is a cross-sectional view schematically illustrating a wet chemical processing chamber in an assembled configuration in accordance with an embodiment of the invention. -
FIG. 5A is a top isometric view of a carriage for loading/unloading a detachable unit from a wet chemical processing chamber in accordance with an embodiment of the invention. -
FIG. 5B is a bottom isometric view of a carriage for loading/unloading a detachable unit of a wet chemical processing chamber in accordance with an embodiment of the invention. -
FIG. 6 is a top plan view of a wet chemical processing tool including a wet chemical processing chamber in accordance with another aspect of the invention. -
FIG. 7 is an isometric view of a mounting module for holding a wet chemical processing chamber in a wet chemical processing tool in accordance with an embodiment of the invention. -
FIG. 8 is a cross-sectional view taken along line 8-8 ofFIG. 7 of a mounting module for carrying a wet chemical processing chamber in accordance with an embodiment of the invention. -
FIG. 9 is a cross-sectional view showing a portion of a deck of a mounting module in greater detail. -
FIG. 10 is a cross-sectional isometric view schematically illustrating a wet chemical processing chamber carried by a mounting module of a wet chemical processing tool in accordance with an embodiment of the invention. - As used herein, the terms “microfeature workpiece” or “workpiece” refer to substrates on or in which microdevices are formed integrally. Typical microdevices include microelectronic circuits or components, thin-film recording heads, data storage elements, microfluidic devices, and other products. Micromachines or micromechanical devices are included within this definition because they are manufactured using much of the same technology as used in the fabrication of integrated circuits. The substrates can be semiconductive pieces (e.g., doped silicon wafers or gallium arsenide wafers), nonconductive pieces (e.g., various ceramic substrates) or conductive pieces.
- Several embodiments of wet chemical processing chambers for processing microfeature workpieces are described in the context of electrochemical deposition chambers for electrolytically or electrolessly depositing metals or electrophoretic resist in or on structures of a workpiece. The wet chemical processing chambers in accordance with the invention, however, can also be used for etching, rinsing, or other types of wet chemical processes in the fabrication of microfeatures in and/or on semiconductor substrates or other types of workpieces. Several embodiments of wet chemical processing chambers and integrated tools in accordance with the invention are set forth in
FIGS. 2-10 and the corresponding text to provide a thorough understanding of particular embodiments of the invention. A person skilled in the art, however, will understand that the invention may have additional embodiments or that the invention may be practiced without several of the details of the embodiments shown inFIGS. 2-10 . - A. Embodiments of Wet Chemical Processing Chambers
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FIG. 2 schematically illustrates a wetchemical processing chamber 100 that enables quick repair or replacement of components to reduce the downtime for maintaining processing chambers. Theprocessing chamber 100 includes a wetchemical vessel 102 and ahead 104. Thevessel 102 is carried by adeck 106 of a tool that can include several other processing chambers (not shown) and a workpiece transport system (not shown) for automatically handling workpieces. Thevessel 102 contains the processing fluid and several components for directing the processing fluid or otherwise imparting properties to the processing fluid for processing a workpiece. Thehead 104 is carried by a lift-rotateunit 108 that moves thehead 104 to load/unload the workpiece and to position the workpiece at aprocessing site 109 within thevessel 102. When theprocessing chamber 100 is an electrochemical deposition station for electroplating materials onto a workpiece, thevessel 102 typically has a fluid flow system and at least one electrode, and thehead 104 typically includes a workpiece holder having a contact assembly with a plurality of electrical contacts configured to engage a conductive layer on the workpiece. When theprocessing chamber 100 is a cleaning chamber or other type of capsule, thevessel 102 includes a plurality of fluid dispensers for flowing a fluid across the workpiece and thehead 104 typically includes a workpiece holder. Suitable configurations of fluid flow systems, electrodes, and other processing components in thevessel 102 are disclosed in U.S. application Ser. Nos. 09/804,696; 09/804,697; 10/234,637; 10/234,982; 10/234,628; 10/234,442; 09/849,505; 09/866,391; 09/866,463; 09/875,365; 09/872,151; and 10/295,302, all of which are herein incorporated by reference. Additionally, suitable workpiece holders are disclosed in U.S. Pat. No. 6,309,524 and U.S. application Ser. Nos. 09/717,927; and 09/823,948, all of which are also herein incorporated by reference. - The
vessel 102 includes a fixedunit 110 mounted to thedeck 106 and adetachable unit 120 carried by the fixedunit 110. The fixedunit 110 can include achassis 112, afirst flow system 114, and a mountingfixture 116. Thechassis 112 can be a dielectric housing that is chemically compatible with the processing fluid. Thechassis 112, for example, can be a high density polymer or other suitable material. Thefirst flow system 114 can be configured to provide the desired flow to theprocessing site 109. In electrochemical deposition chambers, thefirst flow system 114 can be configured to provide a flow that has a substantially uniform velocity in a direction normal to the workpiece throughout theprocessing site 109. The mountingfixture 116 can be flanges or a ring projecting outwardly from thechassis 112 to engage the top surface of thedeck 106. The mountingfixture 116 can be configured to precisely locate the fixedunit 110 relative to thedeck 106 as explained in more detail below. The fixedunit 110 can further include aprocessing component 118 to impart a property to the processing fluid flowing through the fixedunit 110. For example, theprocessing component 118 can be an electric field shaping element that shapes the electric field in theprocessing site 109, a filter, a membrane, a nozzle, or another type of fluid dispenser. Theprocessing component 118 can also be any combination of these types of structures. Suitable structures forfirst flow systems 114, mountingfixtures 116 andprocessing components 118 for the fixedunit 110 are disclosed in U.S. application Ser. Nos. 09/872,151 and 09/804,697 incorporated by reference above. - The
detachable unit 120 of thevessel 102 includes acontainer 122, asecond flow system 124 configured to direct the processing fluid to and/or from thefirst flow system 114 of the fixedunit 110, and aprocessing component 126 that imparts a property to the processing fluid. Thesecond flow system 124 can include inlets and outlets to deliver processing fluid to thefirst flow system 114 and to receive processing from thefirst flow system 114. The first and second flow systems operate together to provide a desired flow of processing fluid at the processing site. The first andsecond flow systems processing component 126. In a forward flow system, the processing fluid passes theprocessing component 126 in thedetachable unit 120 before the processing fluid reaches theprocessing site 109. The first and second flow systems can also be configured to provide a reverse flow past theprocessing component 126. In a reverse flow configuration, the processing fluid passes theprocessing component 126 after the processing fluid has passed through theprocessing site 109. - The
processing component 126 is disposed in thedetachable unit 120. Theprocessing component 126 can be a filter, membrane, or electrode. In addition, theprocessing component 126 can be an electrode assembly having a plurality of electrodes arranged in a concentric configuration or another configuration suitable for electroplating materials onto the workpiece. In still other embodiments, theprocessing component 126 can be a combination of filters, membranes, electrodes, dielectric partitions between electrodes that define individual electrode compartments, spray bars with a plurality of nozzles, paddle platers, or other components used to process microfeature workpieces. Theprocessing component 126 is generally a consumable component (e.g., a consumable electrode), a component that collects particulate matter or other undesirable constituents in the processing fluid to protect the surface of the workpiece (e.g., filters of membranes), or other components that may fail or need to be cleaned. Theprocessing component 126 in thedetachable unit 120 is accordingly subject to regular maintenance or replacement to maintain the performance of theprocessing chamber 100 within predetermined specifications. Such processing components can accordingly be quickly replaced with new or refurbished components by simply replacing onedetachable unit 120 with a replacement detachable unit without having to move thehead 104 or the fixedunit 110. - The
vessel 102 also includes aseal 130 to prevent leaking between thefixed unit 110 and thedetachable unit 120. The seal is typically positioned between thefixed unit 110 and thedetachable unit 120. Theseal 130 can include at least one orifice to allow the processing fluid to flow between thefirst flow system 114 in the fixedunit 110 and thesecond flow system 124 in thedetachable unit 120. In many embodiments, theseal 130 is a gasket with a pattern of orifices to allow fluid to flow between the first andsecond flow systems seal 130 orgasket is typically a compressible member that prevents liquid from leaking between the various flow channels of the flow systems. Theseal 130 can also be made from a dielectric material that electrically isolates different fluid flows as they flow between the first andsecond flow systems seal 130 include VITON® closed cell foams, closed cell silicon, elastomers, polymers, rubber and other materials. - The
vessel 102 also includes anattachment assembly 140 for attaching thedetachable unit 120 to the fixedunit 110. Theattachment assembly 140 can be a quick-release unit, such as a clamp or a plurality of clamps, that guides thedetachable unit 120 to a desired orientation with respect to the fixedunit 110 and securely holds thedetachable unit 120 to the fixedunit 110. Theattachment assembly 140 can be configured to move from a first position in which thedetachable unit 120 is secured to the fixedunit 110 and a second position in which thedetachable unit 120 can be removed from the fixedunit 110. In several embodiments, as theattachment assembly 140 moves from the second position to the first position, theattachment assembly 140 drives thedetachable unit 120 toward the fixedunit 110. This motion compresses theseal 130 and positions thedetachable unit 120 at a desired location with respect to the fixedunit 110. Theattachment assembly 140 can be a clamp ring, a plurality of latches, a plurality of bolts, or other types of fasteners. -
FIG. 3 schematically illustrates the operation of the wetchemical processing chamber 100 for repairing or maintaining processing components in the detachable unit. Like reference numbers refer to like components inFIGS. 2 and 3 . A first detachable unit 120 a is removed from the fixedunit 110 after theflow system 124 a and/or theprocessing component 126 a in the first detachable unit 120 a no longer meet specifications. Theseal 130 may also be removed, but this is optional. A seconddetachable unit 120 b is then installed by aligning it with the fixedunit 110 and engaging theattachment assembly 140 with the seconddetachable unit 120 b. The seconddetachable unit 120 b can include aflow system 124 b andprocessing components 126 b that are new or have been refurbished so that theprocessing chamber 100 can meet the specifications required for processing microfeature workpieces. - One advantage of the
processing chamber 100 illustrated inFIGS. 2 and 3 is that components in need of repair or maintenance can be quickly replaced with new or refurbished components without shutting down theprocessing chamber 100 for a significant period of time. Onedetachable unit 120 can be quickly removed from the fixedunit 110, and then a replacementdetachable unit 120 can be installed in only a matter of a few minutes. This significantly reduces the downtime for repairing electrodes or other processing components compared to conventional systems that require the components to be repaired in-situ on the tool or require the entire chamber to be removed from the tool. Another advantage of theprocessing chamber 100 is that theprocessing components 126 in thedetachable units 120 can be replaced from a location that is easily accessible under thedeck 106. As a result, there is no need to move either the fixedunit 110, thehead 104, or the lift-rotateunit 108 to replace worn processing components. This further reduces the downtime for maintaining processing components because thehead 104 and lift-rotateunit 108 do not need to be repositioned with respect to the fixedunit 110. Moreover, a workpiece transport system that delivers the workpieces to thehead 104 and retrieves the workpieces from thehead 104 does not need to be recalibrated to theprocessing chamber 100 because the position between thehead 104 and such a workpiece transport system is not changed. The significant reduction in downtime for replacing processing components provided by theprocessing chamber 100 is expected to significantly increase the productivity of the wet chemical processing tool compared to existing tools. -
FIG. 4A is a cross-sectional view illustrating avessel 402 in accordance with an embodiment of the invention. Thevessel 402 can include a fixedunit 410, adetachable unit 420, aseal 430, and anattachment assembly 440. The fixedunit 410 can include achassis 412, a first flow system 414 (shown schematically), and processing components 418 (shown schematically). Thedetachable unit 420 can include acontainer 422, a second flow system 424 (shown schematically), and processing components 426 (shown schematically). Theseal 430 can be a gasket having anopening 431 to allow fluid to flow between the first andsecond flow systems attachment assembly 440 can be a clamp ring. - The fixed
unit 410 can further include a plurality ofhangers 450 arranged at a common radius with respect to a center line of the fixedunit 410 or in another pattern. Thehangers 450 can includeshoulders 452 to hold the attachment assembly. For example, theattachment assembly 440 can be a ring that springs radially outwardly to contact thehangers 450 and rest on theshoulders 452 in an open position. The fixedunit 410 further includes abeveled guide surface 453, abearing ring 454 above thebeveled guide surface 453, and aseal surface 456. Theguide surface 453 can be an annular surface or a series of arcuate segments inclined upwardly with increasing radius. Thebearing ring 454 can be a metal ring having a bearing surface inclined upwardly with decreasing radius. Thebearing ring 454 can also be made from other materials that are typically harder than the material of thechassis 412. - The
detachable unit 420 can include arim 460 having alower surface 462 and anupper surface 464. Thelower surface 462 and theupper surface 464 can be inclined upwardly with increasing radius. Theupper surface 464, more specifically, can be inclined at an angle to mate with theguide surface 453 of the fixedunit 410. Thedetachable unit 420 can further include aseal surface 466 configured to retain theseal 430,slide channels bottom surface 468. - The
attachment assembly 440 can include afirst rim 472 configured to engage thelower surface 462 of thedetachable unit 420 and asecond rim 474 configured to engage the bearing surface of thebearing ring 454. Theattachment assembly 440 can include a latch (not shown) or lever that moves the ring radially inwardly and locks the ring into a fixed position. -
FIG. 4B illustrates thevessel 402 after thedetachable unit 420 has been attached to the fixedunit 410. In operation, theattachment assembly 440 moves radially inwardly so that thefirst rim 472 engages thelower surface 462 of thedetachable unit 420 and thesecond rim 474 engages the bearing surface of thebearing ring 454. The radially inward motion of thefirst rim 472 along thelower surface 462 lifts thedetachable unit 420 upwardly toward the fixedunit 410. As thedetachable unit 420 moves upwardly, theupper surface 464 engages theguide surface 453 to position thedetachable unit 420 at a desired position with respect to the fixedunit 410. Thesecond rim 474 of theattachment assembly 440 moves radially inwardly along the inclined surface of thebearing ring 454 to clamp theseal 130 between the seal surfaces 456 and 466. A lever (not shown) on theattachment assembly 440 can be moved from an open position to a closed position to induce a hoop stress in theattachment assembly 440 for securely holding thedetachable unit 420 to the fixedunit 410. - The chamber can also include an assembly for loading/unloading the
detachable unit 120.FIG. 5A is a top isometric view of acarriage 500 for installing and removing a detachable unit in a wet chemical processing chamber in accordance with one embodiment of the invention. Thecarriage 500 can include abracket 510 that mounts to the underside of the deck 106 (FIG. 2 ) of the tool. Thecarriage 500 can further includeguide rails 512 and anend stop 514. The guide rails 512 receive theslide channels FIGS. 4A and 4B ), and theend stop 514 engages a mating rounded portion of thedetachable unit 420. In operation, an operator slides thedetachable unit 420 along therails 512 until the detachable unit engages theend stop 514. -
FIG. 5B is a bottom isometric view illustrating additional aspects of thecarriage 500. Thecarriage 500 can further include anactuator 520 having ahandle 522, ashaft 524, andlifters 526 that are moved by theshaft 524. Theactuator 520 can further include arod 528 connected to thelifters 526 and positioned in a joint 529. The rotation of the handle accordingly rotates therod 528 within the joint 529 to raise and lower thelifters 526. - To install a detachable unit, the
actuator 520 is moved to a first position as shown inFIG. 5B . The detachable unit is then inserted along therails 512 as described above, and theactuator 520 is lifted. As theactuator 520 rotates upwardly (arrow R), thehandle 522 passes through agap 530 in abottom flange 531 of thebracket 510. Thelifters 526 accordingly engage the bottom surface 468 (FIG. 4B ) and raise the detachable unit upwardly toward the fixed unit. After reaching the raised position, thehandle 522 slides axially along the shaft 524 (arrow A) to position the handle on top of theflange 531. Referring back toFIG. 4B , the bevelled surfaces on the bottom of thesupports 450 initially align thedetachable unit 420 with the fixedunit 410. After therim 460 of thedetachable unit 420 passes theshoulders 452 of thesupports 450, theupper surface 464 of thedetachable unit 420 and theguide surface 453 of the fixedunit 410 position thedetachable unit 420 into final alignment with the fixedunit 410. Theattachment assembly 440 can then be actuated to clamp thedetachable unit 420 to the fixedunit 410. Thecarriage 500 accordingly makes it easier to remove and install thedetachable unit 420. - B. Embodiments of Integrated Tools with Wet Chemical Processing Chambers
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FIG. 6 is a top plan view showing a portion of anintegrated tool 600 in accordance with an embodiment of the invention. In this embodiment, theintegrated tool 600 includes aframe 610, a dimensionallystable mounting module 620 mounted to theframe 610, a plurality of wetchemical processing chambers 670, and a plurality of lift-rotateunits 680. Thetool 600 can also include a transport system 690. The mountingmodule 620 carries theprocessing chambers 670, the lift-rotateunits 680, and the transport system 690. The wetchemical processing chambers 670 in thetool 600 can include vessels having fixed units and detachable units as described above with reference toFIGS. 2-5 . As such, any of the embodiments of the wetchemical processing chambers 100 and 400 can be the wetchemical processing chambers 670 in theintegrated tool 600. - The
frame 610 of thetool 600 has a plurality of posts 611 and cross-bars 612 that are welded together in a manner known in the art. The mountingmodule 620 is at least partially housed within theframe 610. In one embodiment, the mountingmodule 620 is carried by cross-bars 612 of theframe 610, but the mountingmodule 620 can stand directly on the floor of the facility or other structures in other embodiments. - The mounting
module 620 is a rigid, stable structure that maintains the relative positions between the wetchemical processing chambers 670, the lift-rotateunits 680, and the transport system 690. One aspect of the mountingmodule 620 is that it is much more rigid and has a significantly greater structural integrity compared to theframe 610 so that the relative positions between the wetchemical processing chambers 670, the lift-rotateunits 680, and the transport system 690 do not change over time. Another aspect of the mountingmodule 620 is that it includes a dimensionallystable deck 630 with positioning elements at precise locations for positioning theprocessing chambers 670 and the lift-rotateunits 680 at known locations on thedeck 630. In one embodiment (not shown), the transport system 690 can be mounted directly to thedeck 630. In other embodiments, the mountingmodule 620 also has a dimensionallystable platform 650 and the transport system 690 is mounted to theplatform 650. Thedeck 630 and theplatform 650 are fixedly positioned relative to each other so that positioning elements on thedeck 630 and positioning elements on theplatform 650 do not move relative to each other. The mountingmodule 620 accordingly provides a system in which wetchemical processing chambers 670 and lift-rotateunits 680 can be removed and replaced with interchangeable components in a manner that accurately positions the replacement components at precise locations on thedeck 630. - The
tool 600 is particularly suitable for applications that have demanding specifications which require frequent maintenance of the wetchemical processing chambers 670, the lift-rotateunits 680, or the transport system 690. A wetchemical processing chamber 670 can be repaired or maintained by simply detaching the chamber from theprocessing deck 630 and replacing thechamber 670 with an interchangeable chamber having mounting hardware configured to interface with the positioning elements on thedeck 630. Because the mountingmodule 620 is dimensionally stable and the mounting hardware of thereplacement processing chamber 670 interfaces with thedeck 630, thechambers 670 can be interchanged on thedeck 630 without having to recalibrate the transport system 690. This is expected to significantly reduce the downtime associated with repairing or maintainingprocessing chambers 670 so that the tool can maintain a high throughput in applications that have stringent performance specifications. This aspect of thetool 600 is particularly useful when the fixed unit 110 (FIG. 2 ) must be removed to repair the chamber. - The transport system 690 retrieves workpieces from a load/unload
module 698 attached to the mountingmodule 620. The transport system 690 includes atrack 692, arobot 694, and at least one end-effector 696. Thetrack 692 is mounted to theplatform 650. More specifically, thetrack 692 interfaces with positioning elements on theplatform 650 to accurately position thetrack 692 relative to thechambers 670 and the lift-rotateunits 680 attached to thedeck 630. Therobot 694 and end-effectors 696 can accordingly move in a fixed, dimensionally stable reference frame established by the mountingmodule 620. Thetool 600 can further include a plurality ofpanels 699 attached to theframe 610 to enclose the mountingmodule 620, the wetchemical processing chambers 670, the lift-rotateunits 680, and the transport system 690 in a cabinet. In other embodiments, thepanels 699 on one or both sides of thetool 600 can be removed in the region above theprocessing deck 630 to provide an open tool. - C. Embodiments of Dimensionally Stable Mounting Modules
-
FIG. 7 is an isometric view of a mountingmodule 620 in accordance with an embodiment of the invention for use in thetool 600. In this embodiment, thedeck 630 includes a rigidfirst panel 631 and a rigidsecond panel 632 superimposed underneath thefirst panel 631. Thefirst panel 631 can be an outer member and thesecond panel 632 can be an interior member juxtaposed to the outer member. The first andsecond panels FIG. 7 . A plurality ofchamber receptacles 633 are disposed in the first andsecond panels FIG. 6 ). - The
deck 630 can further include a plurality ofpositioning elements 634 andattachment elements 635 arranged in a precise pattern across thefirst panel 631. Thepositioning elements 634 can be holes machined in thefirst panel 631 at precise locations and with precise dimensions to receive dowels or pins that interface with the wet chemical processing chambers 670 (FIG. 6 ). In other embodiments, thepositioning elements 634 can be pins, such as cylindrical pins or conical pins, that project upwardly from thefirst panel 631 to be received by mating structures in the wetchemical processing chambers 670. Thedeck 630 has a first set ofpositioning elements 634 located at eachchamber receptacle 633 to accurately position the individual wet chemical processing chambers at precise locations on the mountingmodule 620. Thedeck 630 can also include a second set ofpositioning elements 634 near eachreceptacle 633 to accurately position individual lift-rotateunits 680 at precise locations on the mountingmodule 620. Theattachment elements 635 can be threaded holes in thefirst panel 631 that receive bolts to secure thechambers 670 and the lift-rotateunits 680 to thedeck 630. - The mounting
module 620 also includesexterior side plates 660 along longitudinal outer edges of thedeck 630,interior side plates 661 along longitudinal inner edges of thedeck 630, andendplates deck 630. Thetransport platform 650 is attached to theinterior side plates 661 and theend plates transport platform 650 includes positioning elements 652 for accurately positioning the track 692 (FIG. 6 ) of the transport system 690 on the mountingmodule 620. Thetransport platform 650 can further include attachment elements, such as tapped holes, that receive bolts to secure thetrack 692 to theplatform 650. -
FIG. 8 is a cross-sectional view illustrating one suitable embodiment of the internal structure of thedeck 630, andFIG. 9 is a detailed view of a portion of the deck shown inFIG. 8 . In this embodiment, thedeck 630 includes bracing 640, such as joists, extending laterally between theexterior side plates 660 and theinterior side plates 661. Thefirst panel 631 is attached to the upper side of the bracing 640, and thesecond panel 632 is attached to the lower side of the bracing 640. Thedeck 630 can further include a plurality ofthroughbolts 642 andnuts 644 that secure the first andsecond panels FIG. 9 , the bracing 640 has a plurality ofholes 645 through which thethroughbolts 642 extend. Thenuts 644 can be welded to thebolts 642 to enhance the connection between these components. - The panels and bracing of the
deck 630 can be made from stainless steel, other metal alloys, solid cast materials, or fiber-reinforced composites. For example, the panels and plates can be made from Nitronic 50 stainless steel, Hastelloy 625 steel alloys, or a solid cast epoxy filled with mica. The fiber-reinforced composites can include a carbon-fiber or Kevlar® mesh in a hardened resin. The material for thepanels plates - The bracing 640 can also be stainless steel, fiber-reinforced composite materials, other metal alloys, and/or solid cast materials. In one embodiment, the bracing can be 0.5 to 2.0 inch wide stainless steel joists, and more specifically 1.0 inch wide by 2.0 inches tall stainless steel joists. In other embodiments the bracing 640 can be a honey-comb core, a light-weight foamed metal or other type of foam, polymers, fiber glass or other materials.
- The mounting
module 620 is constructed by assembling the sections of thedeck 630, and then welding or otherwise adhering theend plates deck 630. The components of thedeck 630 are generally secured together by thethroughbolts 642 without welds. Theouter side plates 660 and theinterior side plates 661 are attached to thedeck 630 and theend plates platform 650 is then securely attached to theend plates interior side plates 661. - The mounting
module 620 provides a heavy-duty, dimensionally stable structure that maintains the relative positions between thepositioning elements 634 on thedeck 630 and the positioning elements 652 on theplatform 650 within a range that does not require the transport system 690 to be recalibrated each time areplacement processing chamber 670 or lift-rotateunit 680 is mounted to thedeck 630. The mountingmodule 620 is generally a rigid structure that is sufficiently strong to maintain the relative positions between thepositioning elements 634 and 652 when the wetchemical processing chambers 670, the lift-rotateunits 680, and the transport system 690 are mounted to the mountingmodule 620. In several embodiments, the mountingmodule 620 is configured to maintain the relative positions between thepositioning elements 634 and 652 to within 0.025 inch. In other embodiments, the mounting module is configured to maintain the relative positions between thepositioning elements 634 and 652 to within approximately 0.005 to 0.015 inch. As such, thedeck 630 often maintains a uniformly flat surface to within approximately 0.025 inch, and in more specific embodiments to approximately 0.005-0.015 inch. - D. Embodiments of Wet Chemical Processing Chambers
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FIG. 10 is an isometric cross-sectional view showing the interface between a wetchemical processing chamber 670 and thedeck 630. Thechamber 670 can include theprocessing vessel collar 672. Thecollar 672 and thevessel 102 can be separate components that are connected together. In such cases, thecollar 672 can be made from a dimensionally stable material, such as stainless steel, fiber-reinforced materials, steel alloys, cast solid materials, or other suitably rigid materials. In other embodiments, thecollar 672 is integral with thevessel 102 and formed from a high-density polymer or other suitable material. - The
collar 672 is one embodiment of a mounting fixture 116 (FIG. 2 ). Thecollar 672 includes a plurality ofinterface members 674 that are arranged in a pattern to be aligned with thepositioning elements 634 on thedeck 630. Thepositioning elements 634 and theinterface members 674 are also configured to mate with one another to precisely position thecollar 672, and thus thechamber 670, at a desired operating location on thedeck 630 to work with lift-rotateunit 680 and the transport system 690. Thepositioning elements 634 can be a set of precisely machined holes in thedeck 630 and dowels received in the holes, and theinterface members 674 can be holes precisely machined in thecollar 672 to mate with the dowels. The dowels can be pins with cylindrical, spherical, conical or other suitable shapes to align and position thecollar 672 at a precise location relative to thedeck 630. Thecollar 672 can further include a plurality offasteners 675 arranged to be aligned with theattachment elements 635 in thedeck 630. Thefasteners 675 can be bolts or other threaded members that securely engage theattachment elements 635 to secure thecollar 672 to thedeck 630. Thecollar 672 accordingly holds theprocessing vessel 102 at a fixed, precise location on the deck. - From the foregoing, it will be appreciated that specific embodiments of the invention have been described herein for purposes of illustration, but that various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the present invention is not limited except as by the appended claims.
Claims (35)
1. A chamber for wet chemical processing of microfeature workpieces, comprising:
a fixed unit having a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a support member of a tool;
a detachable unit having a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit and a processing component that imparts a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures; and
an attachment system releasably coupling the detachable unit to the fixed unit, wherein the attachment system has a first position in which the detachable unit is secured to the fixed unit and a second position in which the detachable unit can be detached from the fixed unit; and
a processing site configured to receive the microfeature workpiece, the processing site being disposed in one of the fixed unit or the detachable unit to contact the workpiece with a portion of the processing fluid having the property imparted by the processing component.
2. The chamber of claim 1 , further comprising a head positioned over the fixed unit, wherein the head comprises a workpiece holder configured to hold the workpiece at the processing site.
3. The chamber of claim 1 wherein:
the processing component comprises an electrode in the detachable unit; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
4. The chamber of claim 1 wherein:
the processing component comprises an electrode assembly having a plurality of independently operable electrodes separated from each other by dielectric dividers, and the electrode assembly being positioned in the detachable unit; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
5. The chamber of claim 1 wherein the processing component comprises a filter in the detachable unit.
6. The chamber of claim 1 wherein the processing component comprises a membrane configured to conduct electrical current across the membrane.
7. The chamber of claim 1 wherein the attachment assembly comprises a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
8. The chamber of claim 1 , further comprising a seal between a first seal surface of the fixed unit and a second seal surface of the detachable unit.
9. The chamber of claim 1 wherein:
the fixed unit further comprises a beveled guide surface inclined upwardly with increasing radius, a beveled bearing ring having a bearing surface inclined upwardly with decreasing radius, and a first seal surface;
a detachable unit further comprises a rim having a lower surface inclined upwardly with increasing radius, an upper surface inclined upwardly with increasing radius, and a second seal surface; and
a seal between the first and second seal surfaces.
10. The chamber of claim 1 wherein:
the processing component comprises an electrode in the detachable unit; and
the chamber further comprises (a) a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece, and (b) a seal between a portion of the fixed unit and the detachable unit.
11. The chamber of claim 1 wherein:
the processing component comprises an electrode in the detachable unit and a filter between the electrode and the processing site; and
the chamber further comprises (a) a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece, and (b) a seal between a portion of the fixed unit and the detachable unit.
12. The chamber of claim 1 wherein:
the processing component comprises an electrode in the detachable unit and a membrane between the electrode and the processing site, wherein the membrane is configured to conduct electrical current; and
the chamber further comprises (a) a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece, and (b) a seal between a portion of the fixed unit and the detachable unit.
13. A chamber for wet chemical processing of microfeature workpieces, comprising:
a fixed unit having a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture for fixedly attaching the fixed unit to a support surface of a tool;
a detachable unit releasably coupled to the fixed unit, the detachable unit having a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit;
a seal between the fixed unit and the detachable unit to prevent processing fluid from leaking between the fixed unit and the detachable unit, the seal having an orifice through which processing fluid can flow between the first and second flow systems; and
a processing component disposed in the fixed unit and/or the detachable unit, wherein the processing component imparts a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures.
14. The chamber of claim 13 , further comprising a head positioned over the fixed unit, wherein the head comprises a workpiece holder configured to hold the workpiece at the processing site.
15. The chamber of claim 13 wherein:
the processing component comprises an electrode in the detachable unit; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
16. The chamber of claim 13 wherein:
the processing component comprises an electrode assembly having a plurality of independently operable electrodes separated from each other by dielectric dividers, and the electrode assembly being positioned in the detachable unit; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
17. The chamber of claim 13 wherein the processing component comprises a filter in the detachable unit.
18. The chamber of claim 13 wherein the processing component comprises a membrane in the detachable unit, and the membrane being configured to conduct electrical current across the membrane.
19. The chamber of claim 13 , further comprising an attachment assembly having a clamp ring configured to move radially inwardly from a first position to a second position to clamp the detachable unit to the fixed unit.
20. The chamber of claim 13 wherein:
the processing component comprises an electrode in the detachable unit and a filter between the electrode and the processing site; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
21. The chamber of claim 13 wherein:
the processing component comprises an electrode in the detachable unit and a membrane between the electrode and the processing site, wherein the membrane is configured to conduct electrical current; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
22. An integrated tool for wet chemical processing of microfeature workpieces, comprising:
a frame;
a mounting module carried by the frame, the mounting module having a plurality of positioning elements and attachment elements;
a wet chemical processing chamber carried by the mounting module, the wet chemical processing chamber comprising a fixed unit, a detachable unit, an attachment system and a processing site, wherein (a) the fixed unit has a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture having a first interface member engaged with one of the positioning elements and a first fastener engaged with one of the attachment elements, (b) the detachable unit has a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit and a processing component that imparts a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures, (c) the attachment system releasably couples the detachable unit to the fixed unit, and (d) the processing site is configured to receive the microfeature workpiece, the processing site being disposed in one of the fixed unit or the detachable unit to contact the workpiece with a portion of the processing fluid having the property imparted by the processing component;
a transport system carried by the mounting module for transporting the workpiece within the tool, the transport system having a second interface member engaged with one of the positioning elements and a second fastener engaged with one of the attachment elements; and
wherein the mounting module is configured to maintain relative positions between positioning elements such that the transport system does not need to be recalibrated when the processing chamber is replaced with another processing chamber.
23. The tool of claim 22 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel superimposed under the first panel, joists between the first and second panel, and bolts through the first panel, the joists and the second panel.
24. The tool of claim 22 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel juxtaposed to the first panel, and bracing between the first and second panels.
25. The tool of claim 24 , further comprising a head positioned over the fixed unit, wherein the head comprises a workpiece holder configured to hold the workpiece at the processing site.
26. The tool of claim 24 wherein:
the processing component comprises an electrode in the detachable unit; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
27. The tool of claim 24 , further comprising a seal between a first seal surface of the fixed unit and a second seal surface of the detachable unit.
28. The tool of claim 24 wherein:
the processing component comprises an electrode in the detachable unit; and
the chamber further comprises (a) a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece, and (b) a seal between a portion of the fixed unit and the detachable unit.
29. The tool of claim 24 wherein:
the processing component comprises an electrode in the detachable unit and a filter between the electrode and the processing site; and
the chamber further comprises (a) a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece, and (b) a seal between a portion of the fixed unit and the detachable unit.
30. The tool of claim 24 wherein:
the processing component comprises an electrode in the detachable unit and a membrane between the electrode and the processing site, wherein the membrane is configured to conduct electrical current; and
the chamber further comprises (a) a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece, and (b) a seal between a portion of the fixed unit and the detachable unit.
31. An integrated tool for wet chemical processing of microfeature workpieces, comprising:
a frame;
a mounting module carried by the frame, the mounting module having a plurality of positioning elements and attachment elements;
a wet chemical processing chamber carried by the mounting module, the wet chemical processing chamber comprising a fixed unit, a detachable unit releasably coupled to the fixed unit, a seal between the fixed unit and the detachable unit, and processing component disposed in the fixed unit and/or the detachable unit, wherein (a) the a fixed unit has a first flow system configured to direct a processing fluid through the fixed unit and a mounting fixture having a first interface member engaged with one of the positioning elements and a first fastener engaged with one of the attachment elements, (b) the detachable unit has a second flow system configured to direct the processing fluid to and/or from the first flow system of the fixed unit, (c) the seal has an orifice through which processing fluid can flow between the first and second flow systems, (d) the processing component imparts a property to the processing fluid for processing a surface on a microfeature workpiece having submicron microfeatures;
a transport system carried by the mounting module for transporting the workpiece within the tool, the transport system having a second interface member engaged with one of the positioning elements and a second fastener engaged with one of the attachment elements; and
wherein the mounting module is configured to maintain relative positions between positioning elements such that the transport system does not need to be recalibrated when the processing chamber is replaced with another processing chamber.
32. The tool of claim 31 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel superimposed under the first panel, joists between the first and second panel, and bolts through the first panel, the joists and the second panel.
33. The tool of claim 31 wherein the mounting module further comprises a deck having a rigid first panel, a rigid second panel juxtaposed to the first panel, and bracing between the first and second panels.
34. The tool of claim 31 further comprising a head positioned over the fixed unit, wherein the head comprises a workpiece holder configured to hold the workpiece at the processing site.
35. The tool of claim 31 wherein:
the processing component comprises an electrode in the detachable unit; and
the chamber further comprises a head having a workpiece holder including electrical contacts configured to hold a workpiece at the processing site and engage a conductive layer on the workpiece.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/860,384 US20050035046A1 (en) | 2003-06-06 | 2004-06-03 | Wet chemical processing chambers for processing microfeature workpieces |
US11/851,552 US20070295600A1 (en) | 2003-06-06 | 2007-09-07 | Wet chemical processing chambers for processing microfeature workpieces |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47678603P | 2003-06-06 | 2003-06-06 | |
US47633303P | 2003-06-06 | 2003-06-06 | |
US47677603P | 2003-06-06 | 2003-06-06 | |
US47688103P | 2003-06-06 | 2003-06-06 | |
US50156603P | 2003-09-09 | 2003-09-09 | |
US10/860,384 US20050035046A1 (en) | 2003-06-06 | 2004-06-03 | Wet chemical processing chambers for processing microfeature workpieces |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/851,552 Division US20070295600A1 (en) | 2003-06-06 | 2007-09-07 | Wet chemical processing chambers for processing microfeature workpieces |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050035046A1 true US20050035046A1 (en) | 2005-02-17 |
Family
ID=38646089
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/859,749 Abandoned US20050034977A1 (en) | 2003-06-06 | 2004-06-03 | Electrochemical deposition chambers for depositing materials onto microfeature workpieces |
US10/860,384 Abandoned US20050035046A1 (en) | 2003-06-06 | 2004-06-03 | Wet chemical processing chambers for processing microfeature workpieces |
US10/860,593 Active 2025-02-14 US7371306B2 (en) | 2003-06-06 | 2004-06-03 | Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
US10/860,385 Expired - Fee Related US7313462B2 (en) | 2003-06-06 | 2004-06-03 | Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces |
US11/851,552 Abandoned US20070295600A1 (en) | 2003-06-06 | 2007-09-07 | Wet chemical processing chambers for processing microfeature workpieces |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/859,749 Abandoned US20050034977A1 (en) | 2003-06-06 | 2004-06-03 | Electrochemical deposition chambers for depositing materials onto microfeature workpieces |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/860,593 Active 2025-02-14 US7371306B2 (en) | 2003-06-06 | 2004-06-03 | Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
US10/860,385 Expired - Fee Related US7313462B2 (en) | 2003-06-06 | 2004-06-03 | Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces |
US11/851,552 Abandoned US20070295600A1 (en) | 2003-06-06 | 2007-09-07 | Wet chemical processing chambers for processing microfeature workpieces |
Country Status (2)
Country | Link |
---|---|
US (5) | US20050034977A1 (en) |
TW (1) | TWI275916B (en) |
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Also Published As
Publication number | Publication date |
---|---|
US20050061438A1 (en) | 2005-03-24 |
TWI275916B (en) | 2007-03-11 |
TW200504476A (en) | 2005-02-01 |
US20050109088A1 (en) | 2005-05-26 |
US20070295600A1 (en) | 2007-12-27 |
US20050034977A1 (en) | 2005-02-17 |
US7313462B2 (en) | 2007-12-25 |
US7371306B2 (en) | 2008-05-13 |
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