WO2014133974A1 - Thin form computational and modular array cameras - Google Patents
Thin form computational and modular array cameras Download PDFInfo
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- WO2014133974A1 WO2014133974A1 PCT/US2014/018084 US2014018084W WO2014133974A1 WO 2014133974 A1 WO2014133974 A1 WO 2014133974A1 US 2014018084 W US2014018084 W US 2014018084W WO 2014133974 A1 WO2014133974 A1 WO 2014133974A1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/13—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with multiple sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/95—Computational photography systems, e.g. light-field imaging systems
- H04N23/951—Computational photography systems, e.g. light-field imaging systems by using two or more images to influence resolution, frame rate or aspect ratio
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
- H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
- H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
- H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/48—Increasing resolution by shifting the sensor relative to the scene
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/701—Line sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
Definitions
- the present invention generally relates to one-dimensional array cameras and also relates to the construction of modular array cameras using one-dimensional sub-array modules.
- array cameras are characterized in that they include an imager array that has multiple arrays of pixels, where each pixel array is intended to define a focal plane, and each focal plane has a separate lens stack.
- each focal plane includes a plurality of rows of pixels that also forms a plurality of columns of pixels, and each focal plane is contained within a region of the imager that does not contain pixels from another focal plane.
- An image is typically formed on each focal plane by its respective lens stack.
- the array camera is constructed using an imager array that incorporates multiple focal planes and an optic array of lens stacks.
- a 1 xN array camera module includes: a 1 xN arrangement of focal planes, where N is greater than or equal to 2, each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xN arrangement of lens stacks, the 1 xN arrangement of lens stacks being disposed relative to the 1 xN arrangement of focal planes so as to form a 1 xN arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
- N is greater than or equal to 3.
- N is 5.
- the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum.
- the green camera is centrally disposed relative to the 1 xN arrangement of cameras.
- the lens stack of the green camera is adapted to image light corresponding with the green band of the visible spectrum.
- a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
- N is 7.
- the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1 xN arrangement of cameras.
- a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
- N is 9.
- the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1 xN arrangement of cameras.
- a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
- the 1 xN arrangement of focal planes is embodied within a monolithic structure.
- the 1 xN arrangement of lens stacks is embodied within a monolithic structure.
- the 1 xN arrangement of focal planes and the 1 xN arrangement of lens stacks are each embodied within the same monolithic structure.
- At least one camera is embodied within a single sub-array module, the sub-array module including: a 1 xX arrangement of focal planes, where X is greater than or equal to 1 , each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1 xX arrangement of lens stacks being disposed relative to the 1 xX arrangement of focal planes so as to form a 1xX arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
- the sub-array module further includes interface circuitry that can allow the sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
- the 1 xX arrangement of cameras is embodied within a single monolithic structure.
- N 9 and X is 3.
- the 1 x9 arrangement of cameras are embodied within three 1 x3 sub-array modules, each 1 x3 sub-array module including: a 1 x3 arrangement of focal planes, where each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 x3 arrangement of lens stacks, the 1 x3 arrangement of lens stacks being disposed relative to the 1x3 arrangement of focal planes so as to form a 1 x3 arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
- each sub-array module further includes interface circuitry that can allow the sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
- an array camera module further includes at least two sub-array modules, where each sub-array module includes: a 1 xX arrangement of focal planes, where X is greater than or equal to 1 , each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1 xX arrangement of lens stacks being disposed relative to the 1 xX arrangement of focal planes so as to form a 1xX arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; where each of the at least two sub-array modules are adjoined to the interconnects of a single substrate, and can thereby interface with at least one other sub-array module.
- each of the at least two sub-array modules further includes interface circuitry that can allow the respective sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
- the substrate is optically transparent.
- the substrate is glass.
- the substrate is ceramic
- a 1 xX sub-array module includes: a 1 xX arrangement of focal planes, where X is greater than or equal to 1 , each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1 xX arrangement of lens stacks being disposed relative to the 1 xX arrangement of focal planes so as to form a 1 xX arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
- the 1 xX sub-array module further includes interface circuitry that can allow the sub-array module to interface with another sub- array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
- the interface circuitry implements a MIPI CSI 2 interface.
- a 1xN array camera includes: a 1 xN arrangement of focal planes, where N is greater than or equal to 2, each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xN arrangement of lens stacks, the 1xN arrangement of lens stacks being disposed relative to the 1 xN arrangement of focal planes so as to form a 1xN arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and a processor that is configured to construct an image of the scene using image data generated by the 1 xN array camera module.
- an XxY sub-array module includes: an XxY arrangement of focal planes, where X and Y are each greater than or equal to 1 , each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and an XxY arrangement of lens stacks, the XxY arrangement of lens stacks being disposed relative to the XxY arrangement of focal planes so as to form an XxY arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and image data output circuitry that is configured to output image data from the XxY sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed.
- X is 1 .
- X and Y are each greater than 1 .
- the arrangement of cameras are embodied within a single monolithic structure
- an MxN array camera includes: a plurality of XxY sub-array modules, each including: an XxY arrangement of focal planes, where X and Y are each greater than or equal to 1 , each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and an XxY arrangement of lens stacks, the XxY arrangement of lens stacks being disposed relative to the XxY arrangement of focal planes so as to form an XxY arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and image data output circuitry that is configured to output image data from the sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed;
- X is 1 and M is 1 .
- the plurality of XxY sub-array modules define an MxN arrangement of cameras.
- an MxN array camera further includes circuitry that aggregates the image data generated by each of the sub-array modules into a single MIPI output, and provides the MIPI output to the processor so that the processor can construct an image of the scene.
- an MxN array camera further includes a parallax disparity resolution module, where the parallax disparity resolution module is configured to receive image data captured by each sub-array module, implement a parallax detection and correction process on the received image data, and output the result for further processing.
- an MxN array camera further includes circuitry that converts the output of the parallax disparity resolution module into a single MIPI output, and provides the MIPI output to the processor so that the processor can construct an image of the scene.
- the parallax disparity resolution module includes a processor and memory, where the memory contains software to configure the processor to act as a parallax disparity resolution module.
- the parallax disparity resolution module is a hardware parallax disparity resolution module.
- M and N are each greater than or equal to 2.
- At least two of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and can thereby output image data through the interconnects.
- each of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and can thereby output image data through the interconnects.
- the substrate is optically transparent.
- the substrate is glass.
- the substrate is ceramic
- At least one sub-array module is embodied within a single monolithic structure.
- each sub-array module is embodied within a single respective monolithic structure.
- an array camera further includes: a plurality of I/O devices, where each of the plurality of I/O devices interfaces with at least one camera: and a separate I/O block that includes circuitry configured to receive image data, aggregate the received image data, and output the aggregated image data to the processor so that the processor can construct an image of the scene; and where each of the plurality of I/O devices interfaces with the I/O block.
- the number of I/O devices equals the number of sub-array modules, and each I/O device interfaces with a corresponding sub-array module.
- FIG. 1 conceptually illustrates an array camera architecture in accordance with an embodiment of the invention.
- FIG. 2 conceptually illustrates an imager array architecture in accordance with an embodiment of the invention.
- FIG. 3 conceptually illustrates the construction of an array camera module in accordance with an embodiment of the invention.
- FIGS. 4A and 4B illustrate 1 x5 array camera modules in accordance with embodiments of the invention.
- FIGS. 5A-5C illustrate 1 x7 array camera modules in accordance with embodiments of the invention.
- FIGS. 6A-6C illustrate 1 x9 array camera modules in accordance with embodiments of the invention.
- FIG. 7A illustrates a 1 x 3 sub-array module in accordance with an embodiment of the invention.
- FIG. 7B illustrates another 1 x 3 sub-array module in accordance with another embodiment of the invention
- FIGS. 8A-8K illustrate 1 x3 sub-array modules in accordance with embodiments of the invention.
- FIG. 9 illustrates how sub-array modules may be reconfigured in accordance with an embodiment of the invention.
- FIGS. 10A-10C illustrate how 1 x3 sub-array modules may be coupled to form array camera modules in accordance with embodiments of the invention.
- FIGS. 1 1A-1 1 B illustrates how 1 x3 sub-array modules may interface with a receiving device and thereby implement an array camera in accordance with embodiments of the invention
- FIG. 12 illustrate how sub-array modules may be coupled via a glass substrate with interconnects to form an array camera module in accordance with embodiments of the invention.
- FIGS. 13A-13B illustrate how array camera modules formed from sub-array modules may utilize a parallax disparity resolution module in accordance with embodiments of the invention.
- FIGS. 14A-14B illustrate how sub-array modules may be coupled to form an MxN array camera in accordance with embodiments of the invention.
- FIG. 15 illustrates how sub-array modules may be coupled via a glass substrate with interconnects to form a two-dimensional array camera in accordance with embodiments of the invention
- FIG. 16 illustrates a Pi filter group that may be utilized in accordance with embodiments of the invention.
- FIGS. 17A-17B illustrates how sub-array modules may be coupled to form an array camera that employs Pi filter groups.
- FIGS. 18A-18B illustrate 1 x4 sub-array modules in accordance with embodiments of the invention.
- FIGS. 19A-19B illustrate how 1 x4 sub-array modules may be coupled to form an MxN array camera in accordance with embodiments of the invention
- FIGS. 20A-20D illustrate 1 x5 sub-array modules in accordance with embodiments of the invention.
- FIGS. 21A-21 B illustrate how 1 x5 sub-array modules may be coupled to form an MxN array camera in accordance with embodiments of the invention.
- FIG. 22 illustrates a two-dimensional array camera fabricated from multiple two-dimensional sub-array modules.
- array cameras capture image data that can be used to form multiple images of a single scene using their constituent cameras, and process the image data to yield a single image of the scene with improved image properties.
- U.S. Patent Application Serial No. 12/935,504 discloses many two- dimensional array camera schemes. However, such two-dimensional embodiments may be inapplicable in a number of desirable applications. For example, a consumer electronics device, such as a tablet or smartphone, may benefit from the use of an array camera with a distinctly thin form factor such that it would be able to fit within the device's bezel.
- One-dimensional array camera modules are advantageous insofar as they may accommodate distinct form factor requirements, and are further advantageous in that they may ease processing requirements as compared with two-dimensional array cameras (e.g. they simplify parallax disparity resolution calculations).
- 1 x5 array camera modules are utilized in the construction of an array camera.
- a 1 x5 array camera module is utilized that includes a central narrow spectral band green camera (i.e.
- a camera configured to image light that falls within the 'green' band of the visible spectrum, which can be achieved, for example, where the corresponding lens stack is configured to focus light that falls within the 'green' band of the visible spectrum onto the corresponding focal plane), and adjacent narrow spectral band blue and red cameras on either side of the central narrow spectral band green camera.
- 1x7 array camera modules are utilized in the construction of array cameras.
- a 1 x7 array camera module includes a central narrow spectral band green camera, adjacent narrow spectral band blue and red cameras on either side of the central narrow spectral band green camera, and two periphery narrow spectral band green cameras.
- 1 x9 array camera modules are utilized in the construction of an array camera.
- a 1 x9 array camera module can be preferable to either a 1x7 or a 1 x5 array camera module since a 1 x9 array camera module can capture more image data.
- 1 x9 array camera modules may include narrow spectral band green, blue, and red cameras, full visual spectrum cameras, and/or near-infrared (near-IR) cameras, which are useful for imaging in low lighting conditions.
- a 1 x9 array camera module includes more narrow spectral band green cameras than either narrow spectral band blue, narrow spectral band red, or near-IR cameras.
- one-dimensional array camera modules are constructed that do not use narrow spectral band cameras; in many embodiments one- dimensional array camera modules are constructed that employ Bayer filters to facilitate the imaging of a scene.
- one-dimensional array cameras may be beneficial in numerous applications, their manufacture can be challenging.
- components for one- dimensional array cameras e.g. the lenses and the corresponding sensor
- the elongated nature of the components may not be conducive to optimizing wafer space.
- the periphery of the wafer used in the manufacture may contain significant unused space that, because of the elongated shape of lens array, cannot accommodate further lens arrays.
- wafers may be more efficient in the manufacture of components that are more 'square' in shape than 'elongated.'
- array cameras are constructed using sub-array modules.
- Each of the sub-array modules are configured to interface with other sub-array modules so that data can pass between the sub-array modules, enabling a processor to communicate with multiple sub-array modules via an interface with one of the sub-array modules.
- the dies used in the construction of sub-array modules may be less elongated as compared with the dies utilized in the construction of the aforementioned one-dimensional array camera modules, and can therefore better utilize wafer space.
- a 1 x3 sub-array module is utilized that includes input and output interface circuitry, which allow the sub-array module to couple with other sub-array modules.
- a sub-array module including a single camera is utilized.
- the interface circuitry can further allow coupled sub-array modules to transmit and receive data including image data and/or instructions from a processor with one another.
- the image data from one of the sub-array modules may be read out by a processor.
- the interface circuitry may employ any interface protocol including Mobile Industry Processor Interface Alliance (MIPI) Camera Serial Interface 2(c) interface format (the "MIPI interface format”) or a Standard Mobile Imaging Architecture (“SMIA”) format.
- MIPI Mobile Industry Processor Interface Alliance
- C Camera Serial Interface 2(c) interface format
- SIA Standard Mobile Imaging Architecture
- the 1 x3 modular array cameras may include constituent narrow spectral band green, blue, or red cameras and may also include near-IR cameras.
- sub-array modules can provide numerous advantages. First, the manufacture of sub-array modules can result in a greater yield as compared with the manufacturing yield of longer one-dimensional array camera modules since sub-array module components may more efficiently utilize wafer space. Additionally, their manufacture can also result in comparatively greater homogeneity between sub-array modules since sub-array modules are less intricate as compared with longer one-dimensional array camera modules or two-dimensional array camera modules. Moreover, sub-array modules are versatile insofar as they can be used to construct array cameras of any specified dimension.
- Array cameras in accordance with many embodiments of the invention can include an array camera module and a processor.
- the array camera module can include an array of cameras.
- An array camera module can include an imager array, which is a sensor that includes an array of focal planes.
- Each focal plane includes an array of pixels used to capture an image formed on the focal plane by a lens stack.
- the focal plane can be formed of, but is not limited to, traditional CIS (CMOS Image Sensor), CCD (charge-coupled device), quantum film image sensors, high dynamic range sensor elements, multispectral sensor elements and various alternatives thereof.
- the pixels of each focal plane have similar physical properties and receive light through the same lens stack.
- the pixels in each focal plane may be associated with the same color filter.
- At least one of the focal planes includes a Bayer-pattern filter.
- the focal planes are independently controlled.
- the operation of the focal planes in the imager array is controlled via a single set of controls.
- Array cameras are discussed in U.S. patent application Ser. No. 13/106,797 entitled “Architectures for imager arrays and array cameras” and U.S. patent application Ser. No. 12/952,106 entitled “Capturing and processing of images using monolithic camera array with heterogenous imagers" the disclosure of both applications is hereby incorporated by reference in its entirety.
- the array camera 100 includes an array camera module 102 that is configured to transmit 106 image data to a receiving device 108 via an interface format involving the transmission of additional data describing the transmitted image data.
- the array camera module 102 includes an array of cameras 104.
- the cameras 104 in the array camera module 102 are formed from the combination of a lens stack and a focal plane.
- the array camera module 102 can include an optic array of lens stacks and an imager array of focal planes. These multiple cameras 104 may be active or inactive at any given time.
- the image data captured by these multiple cameras may be transmitted from the focal planes of each camera to a processor.
- the focal planes may have different imaging characteristics, such as varying exposure times, start times, and end times. Therefore, the timing of the transmission of the image data captured by each focal plane can vary. Accordingly, the imager array can transmit additional data describing the image data to enable a device receiving the image data to appropriately reconstruct images from the received image data.
- the transmission of array camera image data is disclosed in U.S. Patent Application Serial No. 13/470,252, entitled “Systems and Methods for Transmitting and Receiving Array Camera Image Data," the disclosure of which is hereby incorporated by reference.
- the array camera 100 captures images using a plurality of cameras 104, which can have different imaging characteristics.
- the array camera 100 can separately control each of the cameras to obtain enhanced image capture and/or to enhance processes such as (but not limited to) super-resolution processes that may be applied to the captured images.
- each pixel of a focal plane may capture different wavelengths of light, or may capture the intensity of light, varying exposure times, start times, or end times.
- the image data captured by different cameras can be interleaved for transmission to a receiving device 108 that includes interface circuitry configured to receive image data.
- the interface circuitry is implemented in hardware and/or using a processor.
- the receiving device 108 can then organize the captured image data from the received packet and appropriately combine the image data to process and/or reconstruct the image(s) captured by one or more of the focal planes in the imager array.
- image data from multiple images of a scene can be captured by the array camera module 102.
- the array camera module 102 transmits 106 the image data to a receiving device 108.
- the array camera module 102 transmits the image data using a small number of local data storage cells on the array camera module 102 that store the captured image data following capture by the cameras.
- the array camera module 102 manages the capture and transmission of image data so that the captured image data stored in the storage cells is transmitted by the imager array of the array camera module 102 in the time taken to capture and load the next set of image data into the storage cells. In this way, the array camera module can continuously buffer and transmit image data using a number of local data storage cells that is less than the total number of pixels in the array camera module.
- a line of image data transmitted by an imager array can be considered to equal the number of pixels in a row of a focal plane multiplied by the number of focal planes.
- the clock frequency of transmitter circuitry on the imager array is set to a desired output data rate and the internal focal plane pixel rate is set to 1/N the desired output data rate (where N is the total number of focal planes).
- N is the total number of focal planes.
- a sufficient number of data storage cells and a buffering mechanism can be developed that starts transmission of pixels once there are sufficient pixels stored such that all of the pixels will have been captured and transmitted by the time the end of the line of image data is reached. If, for example, an imager array including 4 focal planes (as in a 1 x 4 array) transmits image data from all focal planes, then there is very little data storage utilized prior to the start of focal plane readout, because the data is transmitted at approximately the rate that at which it is being read. If, however, the same imager array only has one active imager, then almost all of the pixels from a row of the focal plane are stored since the buffer is being read 4 times as fast as it is being written.
- the data storage requirement would be one row of pixels (i.e. 1 /4th of a line of image data).
- the total number of data storage cells utilized is equal to the number of pixels in three quarters of a row of one of the focal planes in this example.
- the above examples illustrate how the data storage requirements of an imager array can vary based upon the number of active focal planes. In many embodiments, the total number of storage cells within an imager array is less than a quarter of a line of image data. In several embodiments, the total number of storage cells within an imager array is equal to a line of image data.
- the total number of data storage cells is between a quarter of a line of image data and a full line of image data. In a number of embodiments, the total number of storage cells is equal to or greater than a line of image data.
- Imager arrays in accordance with many embodiments of the invention are configured to output image data via an interface format that accommodates the transfer of image data captured via multiple focal planes.
- the imager array is configured to transmit captured image data in accordance with an interface format that is compatible with standard interface formats, such as (but not limited to) the MIPI CSI-2 interface format (MIPI interface format), the Camera Link interface format, and any of the Universal Serial Bus (USB) interface formats or FireWire interface formats.
- MIPI interface format MIPI interface format
- USB Universal Serial Bus
- FireWire interface formats any of the Universal Serial Bus
- the imager array 200 includes a focal plane array core 202 that includes a 1 x N array of focal planes 204 and all analog signal processing, pixel level control logic, signaling, and analog-to-digital conversion circuitry.
- the imager array also includes focal plane timing and control circuitry 206 that is responsible for controlling the capture of image information using the pixels.
- the focal plane timing and control circuitry 206 can synchronize the capture of image data by the focal planes such that active focal planes capture image data from a scene simultaneously.
- the focal plane timing and control circuitry 206 causes the active focal planes to capture image data from a scene in a particular controlled sequence.
- the focal plane timing and control circuitry 206 utilizes reset and read-out signals to control the integration time of the pixels. In several embodiments, any of a variety of techniques can be utilized to control integration time of pixels and/or to capture image information using pixels. In many embodiments, the focal plane timing and control circuitry 206 provides flexibility of image information capture control, which enables features including (but not limited to) high dynamic range imaging, high speed video, and electronic image stabilization.
- the imager array 200 includes power management and bias generation circuitry 208. The power management and bias generation circuitry 208 provides current and voltage references to analog circuitry such as the reference voltages against which an ADC would measure the signal to be converted against.
- the power management and bias circuitry also includes logic that turns off the current/voltage references to certain circuits when they are not in use for power saving reasons.
- the imager array includes dark current and fixed pattern (FPN) correction circuitry 210 that increases the consistency of the black level of the image data captured by the imager array and can reduce the appearance of row temporal noise and column fixed pattern noise.
- FPN dark current and fixed pattern
- each focal plane includes reference pixels for the purpose of calibrating the dark current and FPN of the focal plane and the control circuitry can keep the reference pixels active when the rest of the pixels of the focal plane are powered down in order to increase the speed with which the imager array can be powered up by reducing the need for calibration of dark current and FPN.
- the SOC imager includes focal plane framing circuitry 212 that packages the data captured from the focal planes into a container file and can prepare the captured image data for transmission.
- the focal plane framing circuitry 212 includes information identifying the focal plane and/or group of pixels from which the captured image data originated.
- the imager array 200 also includes an interface for transmission of captured image data to external devices.
- the interface is a MIPI CSI 2 output interface supporting four lanes that can support read-out of video at 30 fps from the imager array and incorporating data output interface circuitry 214, interface control circuitry 216 and interface input circuitry 218.
- the bandwidth of each lane is optimized for the total number of pixels in the imager array and the desired frame rate.
- various interfaces including the MIPI CSI 2 interface to transmit image data captured by an array of imagers within an imager array to an external device in accordance with embodiments of the invention is described in in U.S. patent application Ser. No. 13/470,252, cited to and incorporated by reference above.
- An imager array in accordance with embodiments of the invention can include a single controller that can separately sequence and control each focal plane. Having a common controller and I/O circuitry can provide important system advantages including lowering the cost of the system due to the use of less silicon area, decreasing power consumption due to resource sharing and reduced system interconnects, simpler system integration due to the host system only communicating with a single controller rather than M x N controllers and read-out I/O paths, simpler array synchronization due to the use of a common controller, and improved system reliability due to the reduction in the number of interconnects.
- an imager array in accordance with embodiments of the invention may include a parallax disparity resolution module 220 that can determine disparity between pixels in different images captured by the camera array using parallax detection processes similar to those described in U.S. Provisional Patent Application Serial No. 61/691 ,666 entitled “Systems and Methods for Parallax Detection and Correction in Images Captured Using Array Cameras" to Venkataraman et al., the disclosure of which is incorporated by reference herein in its entirety.
- the processing requirements for a parallax disparity resolution calculation may be sufficiently low that the process may be computed by the imager array circuitry.
- any of a variety of imager arrays can be constructed in accordance with embodiments of the invention that enable the capture of images of a scene at a plurality of focal planes in accordance with embodiments of the invention.
- Array camera modules that utilize imager arrays are discussed below.
- Array camera modules in accordance with many embodiments of the invention include the combination of an optic array including a 1 x N array of lens stacks and an imager array that includes a 1 x N array of focal planes. Each lens stack in the optic array defines a separate optical channel.
- the optic array may be mounted to an imager array that includes a focal plane for each of the optical channels, where each focal plane includes an array of pixels or sensor elements configured to capture an image.
- the array camera module can be utilized to capture image data from multiple images of a scene that can be read out to a processor for further processing, e.g. to synthesize a high resolution image using super-resolution processing.
- each of the cameras in an array camera module can capture image data of a scene reflecting a sub-pixel shifted view of the scene - i.e. relative to the corresponding image formed by at least one other camera (e.g. the lens stack of each camera can have a field-of-view that is shifted with respect to the field-of-view of each other camera so that each shift includes a sub-pixel shifted view of the scene); hence, the aggregated image data can embody sufficient sampling diversity to enable the implementation of super- resolution processes that can be used construct an enhanced image of the scene using the aggregated image data.
- each lens stack can form an image of a scene onto a corresponding focal plane, and thereby generate image data, from a slightly different viewpoint relative to an image formed by each of the other lens stacks, such that the images formed of the scene by each of the lens stacks contain non- redundant information of about the scene.
- the non-redundant information can be used in the construction of a super-resolved image.
- the optics in an array camera module are designed to be able to resolve images to a sufficient extent such that the super-resolution processes can be implemented.
- the MTF of the optics is able to resolve variation in intensity at the spatial resolution of the image that is to result from implemented super-resolution processes (e.g. as opposed to the spatial resolution of the image that can be formed by a single respective camera within an array camera module).
- a plurality of distinct lens stacks are disposed relative to one-another to form a 1 xN array of lens stacks; similarly, in many instances a plurality of distinct focal planes are disposed relative to one-another to form a 1 xN array of focal planes.
- a plurality of lens stacks, and a plurality of focal planes can be adjoined in any suitable way to construct a 1 xN array camera module in accordance with embodiments of the invention.
- the focal planes and/or lens stacks are embodied within monolithic structures.
- FIG. 3 An exploded view of an array camera module formed by combining a lens stack array with a monolithic sensor including an array of focal planes in accordance with an embodiment of the invention is illustrated in FIG. 3.
- the array camera module 300 includes an optic array 310 including 1 x N distinct lens stacks forming N separate apertures and an imager array 330 that includes a 1 x N array of focal planes 340.
- Each lens stack 320 in the optic array 310 creates an optical channel that resolves an image on one of the focal planes 340 on the imager array 330.
- Each of the lens stacks 320 may be of a different type.
- the optical channels are used to capture images of different portions of the wavelength of light spectrum (e.g. using color filters, located either within the lens stack or on the sensor) and the lens stack in each optical channel is specifically optimized for the portion of the spectrum imaged by the focal plane associated with the optical channel.
- the array camera module 300 includes lens stacks 320 having one or multiple separate optical lens elements axially arranged with respect to each other.
- Optic arrays of lens stacks 310 in accordance with several embodiments of the invention include one or more adaptive optical elements that can enable the independent adjustment of the focal length of each lens stack and/or later shifting of the centration of the refractive power distribution of the adaptive optical element.
- the use of adaptive optical elements is described in U.S. Patent Application No. 13/650,039, entitled “Lens Stack Arrays Including Adaptive Optical Elements", filed October 1 1 , 2012, the disclosure of which is incorporated by reference herein in its entirety.
- the array camera module employs wafer level optics (WLO) technology.
- WLO is a technology that encompasses a number of processes, including, for example, molding of lens arrays on glass wafers, stacking of those wafers (including wafers having lenses replicated on either side of the substrate) with appropriate spacers, followed by packaging of the optics directly with the imager into a monolithic integrated module.
- the WLO procedure may involve, among other procedures, using a diamond-turned mold to create each plastic lens element on a glass substrate.
- the process chain in WLO generally includes producing a diamond turned lens master (both on an individual and array level), then producing a negative mold for replication of that master (also called a stamp or tool), and then finally forming a polymer replica on a glass substrate, which has been structured with appropriate supporting optical elements, such as, for example, apertures (transparent openings in light blocking material layers), and filters.
- a diamond turned lens master both on an individual and array level
- a negative mold for replication of that master also called a stamp or tool
- a polymer replica on a glass substrate which has been structured with appropriate supporting optical elements, such as, for example, apertures (transparent openings in light blocking material layers), and filters.
- appropriate supporting optical elements such as, for example, apertures (transparent openings in light blocking material layers), and filters.
- one-dimensional (or 1 x N) array camera modules are utilized in the construction of array cameras.
- One-dimensional array camera modules can provide a number of benefits.
- one-dimensional array camera modules can enable the construction of array cameras having distinctly thin form factors.
- Such array cameras may be useful in a host of applications.
- array cameras having a thin form factor may be incorporated within the bezel of a consumer electronics device such as a laptop, a tablet, or a smart phone, and may further be incorporated within a pair of eye glasses.
- array cameras that incorporate one-dimensional array camera modules are advantageous insofar as they may require less processing and/or memory requirements as compared to two-dimensional (or M x N) array cameras.
- array cameras typically employ a parallax detection and correction process in order to facilitate the imaging of a scene.
- the process is meant to address the fact that the relative positioning of objects in a scene may appear to vary from the respective viewpoints of different cameras within an array camera module.
- this technique can be processor intensive and involve significant data storage requirements related to searches for corresponding pixels along epipolar lines (other than just horizontal or vertical) between cameras located in different rows and/or columns within the array camera module.
- Array camera modules typically pass image data to a processor by starting with image data captured by pixels in a first row of a focal plane and then advancing to the next row of pixels and reading out image data from pixels within the next row of pixels.
- the read out of image data from pixels within a focal plane can also be interspersed with the readout of image data from pixels within other focal planes. Note that with this technique, because image data is being passed to the processor along the rows of the focal planes, searches for corresponding pixels along vertical or diagonal epipolar lines, for example during a parallax detection and correction process of a two-dimensional array camera, involve the processor storing substantial amounts of image data across multiple rows of image data captured by a focal plane.
- one-dimensional array camera modules may provide greater manufacturing yield as compared with two dimensional array camera modules, because one-dimensional array camera modules may have less cameras.
- FIG. 4A A 1 x 5 array camera module in accordance with embodiments of the invention is illustrated in FIG. 4A.
- the array camera module includes a central narrow spectral band green camera (G), adjacent narrow spectral band blue cameras (B), and periphery narrow spectral band red cameras (R).
- Color filters may be employed to achieve the respective narrow spectral band cameras.
- the color filters may be located either within the lens stack or on the sensor.
- a narrow spectral band green camera may be centrally placed to accommodate the fact that humans are most sensitive to green light.
- Narrow spectral band red and blue cameras may be placed on either side of the central narrow spectral band green camera - this configuration may counteract any occlusion that may occur as a result of any obstructing foreground objects.
- FIG. 4B is similar to FIG. 4A except that the narrow spectral band red cameras are adjacent to a central narrow spectral band green camera, and narrow spectral band blue cameras enclose the configuration.
- N near-IR cameras
- P full visual spectrum cameras
- Bayer filters which are typically implemented on the sensor, may be utilized to obtain color information.
- FIGS. 5A - 5C A 1 x 7 array camera module in accordance with embodiments of the invention is illustrated in FIGS. 5A - 5C.
- a 1 x 7 array camera module may employ more narrow spectral band green cameras than narrow spectral band blue or narrow spectral band red cameras. This may be to accommodate the fact that humans are most sensitive to green light.
- the array camera module includes a central narrow spectral band green camera and periphery narrow spectral band green cameras, and narrow spectral band red and blue cameras. The cameras may be symmetrically distributed or they may be asymmetrically distributed.
- the narrow spectral band cameras are symmetrically distributed.
- the narrow spectral band cameras are asymmetrically distributed.
- the inclusion of multiple red and blue cameras uniformly distributed around the central green camera reduces the likelihood of color artifacts related to occlusions by foreground objects.
- the presence of multiple green cameras in an array having sub-pixel shifted views of the scene to provide sampling diversity enables the application of super-resolution processes to the captured image data to recover a higher resolution image of the scene.
- any number of configurations may be employed all in accordance with embodiments of the invention.
- near-IR cameras may be employed, and in a number of embodiments, full visual spectrum cameras are employed.
- Bayer filters may be utilized to obtain color information.
- a 1 x 9 array camera module in accordance with embodiments of the invention is illustrated in FIGS. 6A - 6F.
- a 1 x 9 array camera module may be more preferable than either a 1 x 7 array camera module or a 1 x 5 array camera module since it provides more image data.
- a 1 x 9 array camera module may employ more narrow spectral band green cameras than narrow spectral band blue or narrow spectral band red cameras. The inclusion of multiple red and blue cameras distributed around the central green camera reduces the likelihood of color artifacts related to occlusions by foreground objects.
- sub-array modules are used in the construction of array cameras.
- Sub-array modules may be configured to interface with other sub-array modules so that data can pass between the sub-array modules, thereby enabling a processor to interact with multiple coupled sub- array modules via an interface with one of the sub-array modules.
- sub-array modules can couple with other sub-array modules to enable the fabrication of array cameras of any number of specified dimensions and characteristics.
- sub-array modules do not couple with one-another, but instead interact directly or indirectly (e.g. via a bus) with a receiving device (e.g. a processor).
- sub-array modules of this variety can also enable the modular construction of an array camera of any number of specified dimensions and characteristics.
- the use of sub-array modules in the construction of array cameras can provide a number of benefits.
- the use of sub-array modules to construct array cameras can improve manufacturing yield relative to the direct fabrication of an array camera module.
- one-dimensional array camera modules may be beneficial in numerous applications, their manufacture can be challenging.
- components for one-dimensional array cameras e.g. the lenses and the corresponding sensor
- the periphery of the wafer used in the manufacture may contain significant unused space that, because of the elongated shape of a lens array, cannot accommodate further lens arrays.
- wafers are may be more efficient in the manufacture of components that are more 'square' in shape than 'elongated.
- sub-array modules that are used in the construction of an array camera module may be less elongated than the array camera module. Hence, sub-array modules can better optimize wafer space during manufacture.
- sub-array modules are also beneficial since they comprise a relatively fewer number of cameras compared to an array camera module: the more cameras an array camera module has, the more difficult it is to directly manufacture since it is more likely to have a critical number of faulty cameras.
- manufacturing processes disclosed in prior U.S. Patent Application Ser. No. 13/050,429 disclosure entitled “Fabrication process for mastering imaging lens arrays" can be more beneficially applied if the array to be generated is smaller like those discussed in this application.
- the 1 x N master structure, for the sub-array can be more optimally fine-tuned for homogeneity either by multiple attempts to directly diamond-turn the 1 x N arrays of the template or by multiple attempts to step-and-repeat the 1 x N array of the template from single lens pins before using the final small-variation 1 x N template to fully populate, for example, a 8" wafer scale master.
- the array- internal performance variation and in particular BFL-variation can be reduced.
- Resulting variations from array to array on the full wafer scale master can be compensated by the approach presented under the method described above.
- array camera modules constructed from sub-array modules may be further advantageous in that each individual sub-array module may incorporate custom spacers to counteract back focal length variation.
- U.S. Patent Application Ser. No. 61/666,852 entitled “Systems and Methods for Manufacturing Camera Modules Using Active Alignment of Lens Stack Arrays and Sensors” discusses the issues related to back focal length (BFL) misalignment in the construction of array camera modules, and is hereby incorporated by reference.
- BFL back focal length
- the distribution of the average BFL for a 1 x N sub-array module fabricated in a wafer stack is determined over a sufficient number of stacks to establish the repeatable array-average BFL variation.
- a spacer wafer may then be machined with steps in thickness that correspond to the pattern of the average-BFL over the wafer stack, and the spacers may thereafter be incorporated into the sub array module.
- the standard deviation of the BFL of sub- array modules within a wafer stack is expected to be small given the relatively small number of cameras in a sub-array module; accordingly, the incorporation of the customized spacers into the sub-array modules is expected to result in sufficient focusing.
- the sub-array module 700 includes a focal plane array core 702 that includes a 1 x 3 array of focal planes 704 and all analog signal processing, pixel level control logic, signaling, and analog-to-digital conversion circuitry. Although a 1 x 3 array of focal planes is illustrated, any number of focal planes can be used in accordance with embodiments of the invention.
- the sub-array module includes lens stacks 706, and the combination of a lens stack 706 and its corresponding focal plane 704 can be configured to implement any type of camera including but not limited to narrow spectral band red cameras, narrow spectral band blue cameras, narrow spectral band green cameras, near-IR cameras, and full visual spectrum cameras. Bayer-filters may be employed to facilitate imaging.
- the sub-array module may utilize focal plane timing and control circuitry 708 that is responsible for controlling the capture of image information using the focal plane's constituent pixels.
- the focal plane timing and control circuitry 708 provides flexibility of image information capture control which enables features including, but not limited to, high dynamic range imaging, high speed video, and electronic imaging stabilization.
- the focal plane timing and control circuitry can have inputs 720 and outputs 722 related to the timing of image capture, so that the sub-array module timing can be controlled by an external device (e.g. a processor, or alternatively another sub-array module).
- the sub-array module 700 includes power management and bias generation circuitry 710.
- the power management and bias generation circuitry 710 provides current and voltage references to analog circuitry such as the reference voltages against which an ADC would measure the signal to be converted against.
- the power management and bias circuitry 710 also includes logic that turns off the current/voltage references to certain circuits when they are not in use for power saving reasons.
- the imager array includes dark current and fixed pattern (FPN) correction circuitry 712 that increases the consistency of the black level of the image data captured by the imager array and can reduce the appearance of row temporal noise and column fixed pattern noise.
- FPN dark current and fixed pattern
- each focal plane includes reference pixels for the purpose of calibrating the dark current and FPN of the focal plane and the control circuitry can keep the reference pixels active when the rest of the pixels of the focal plane are powered down in order to increase the speed with which the imager array can be powered up by reducing the need for calibration of dark current and FPN.
- the sub-array module includes focal plane framing circuitry 714 that packages the data captured from the focal planes into a container file and can prepare the captured image data for transmission.
- the focal plane framing circuitry 714 includes information identifying the focal plane and/or group of pixels from which the captured image data originated.
- the sub-array module 700 also includes an interface for transmission and reception of data to and from external device(s).
- the interface can allow for the transmission and reception of image data.
- the interface is a MIPI CSI 2 output interface supporting four lanes that can support read-out of video at 30 fps from the imager array and incorporating interface control circuitry 716, and two sets of data input/output interface circuitry 718.
- each set of interface circuitry is capable of both sending and receiving data.
- the interface circuitry, the interface control circuitry, and the focal plane timing and control inputs/outputs can allow the sub-array module to be controlled by a processor (either directly or indirectly), and/or can also allow the sub-array module to receive/transmit captured image data.
- the bandwidth of each input/output lane is optimized for the total number of pixels in the imager array and the desired frame rate.
- the input/output interface circuitry is configured to interface with any receiving device such as another sub-array module or a processor. Note that although the illustrated embodiment depicts a MIPI CSI 2 protocol, any interface protocol may be used including a Standard Mobile Imaging Architecture ("SMIA”) format.
- SIA Standard Mobile Imaging Architecture
- the use of various interfaces including the MIPI CSI 2 interface to transmit image data captured by an array of imagers within an imager array to an external device in accordance with embodiments of the invention is described in in U.S. Patent Application Serial No. 13/470,252, cited to and incorporated by reference above.
- the sub-array module may also include pins that can be used to establish a unique slave address for the sub-array module in the case where the sub-array module interfaces with a master device (e.g. a processor, or a master sub-array module) via a bus as discussed below. In this way, each slave device can be independently controlled by the master device.
- a master device e.g. a processor, or a master sub-array module
- FIG. 7B A sub-array module in accordance with several embodiments of the invention is illustrated in FIG. 7B.
- the sub-array module 750 is similar to that seen in FIG. 7A, except that it does not include two sets of interface circuitry that allow both the transmission and reception of data; instead the illustrated embodiment depicts a sub- array module that includes receive interface circuitry 752 configured to receive image data from another sub-array module for forwarding, and transmit interface circuitry 754 configured to transmit forwarded image data and image data captured by the sub-array module.
- receive interface circuitry 752 configured to receive image data from another sub-array module for forwarding
- transmit interface circuitry 754 configured to transmit forwarded image data and image data captured by the sub-array module.
- sub-array modules are implemented that are not required to couple with other sub-array modules; instead they each interface - either directly or indirectly - with a receiving device, such as a processor, and thereby provide image data.
- a receiving device such as a processor
- any suitable way for transmitting the data can be implemented.
- image data can be transmitted in parallel, or it can be transmitted in a serial fashion.
- sub-array modules are configured to output image data to a bus; subsequently, the image data carried by the bus (e.g. from each of many sub-array modules) can be processed into a single MIPI output that can be more easily handled by a receiving device.
- the image data can be transmitted to the bus in a parallel fashion, or as serial data, e.g. via low voltage differential signaling.
- any suitable I/O device may be used to relay image data to a receiving device, not just a conventional bus.
- sub-array modules can be implemented that do not have to have, for example, distinct MIPI processing circuitry; instead, the processing of image data from many sub-array modules into a single MIPI output can be accomplished separately and more efficiently. Accordingly, the manufacture of sub-array modules can become less intricate, and their manufacturing yield may increase as a result. Further, with this modular construction, I/O devices can be easily swapped if desired.
- any suitable architecture can be implemented in accordance with embodiments of the invention.
- sub-array modules any of a variety of sub-array modules that can allow for transmission and reception of data may be implemented in accordance with embodiments of the invention.
- 1 x 4, 1 x 2, and even 1 x 1 sub-array modules may be implemented.
- 2-dimensional sub-array modules may also be implemented in accordance with embodiments of the invention; for example 2 x 3, 2 x 2, and 3 x 3 sub- array modules may be implemented.
- Two-dimensional sub-array modules may be used to construct two-dimensional array camera modules. Sub-array module lens configurations and the construction of one-dimensional array camera modules using sub-array modules are discussed below.
- Sub-array modules may include cameras arranged in a variety of configurations in accordance with embodiments of the invention.
- the exact configurations employed in sub-array modules depend on the particular design of the array camera to be formed. For example, in the case where a GNRBGBRNG 1 x 9 array camera is desired (like the one illustrated in FIG. 6E), three 1 x 3 sub-array modules may be used to form the corresponding array camera module having the following respective camera arrangement configurations: GNR, BGB, and RNG.
- FIGS. 8A-8K depict ten examples of sub-array module configurations that are similar to those shown in FIG. 7B in accordance with embodiments of the invention. Although ten examples are provided in FIGS.
- any number of configurations of sub-array modules using any of a variety of color filter patterns may be implemented in accordance with embodiments of the invention.
- the sub-array modules 800 are illustrated as having corresponding interface circuitry 802, represented by arrows. The direction of the arrows is meant to indicate the direction in which image data is passed when the interface circuitry is operational.
- a BGR sub-array module may be reconfigured so that it acts as a RGB sub-array module.
- FIG. 9 illustrates how a BGR sub-array module may be reconfigured to act as a RGB sub-array module.
- the BGR sub-array module 900 may be rotated 180° 902, and its corresponding interface circuitry may be reconfigured 904 such that the transmission/reception protocols in the interface circuitry are reversed.
- the data read from the sub-array module can include a flag and/or additional data indicating the orientation of the sub-array module to enable a processor to map the relative position of pixel addresses to corresponding locations in other cameras in an array camera.
- the BGR sub-array module may be rotated 180° and positioned on a PCB (or laminated chip carrier or other similar such interconnector), and the configuration of the PCB (or laminated chip carrier or other similar such interconnector) may invert the routing of the data transmitted to/from the sub-array module, such that the sub-array module acts as a RGB sub-array module.
- Sub-array modules may be coupled to form an array camera module in accordance with embodiments of the invention.
- sub-array modules may be coupled via their respective interface circuitry such that data may be passed from one sub-array module to the coupled sub-array module.
- FIGS. 10A-10C illustrate the construction of three respective 1 x 9 array camera modules using three 1 x 3 sub-array modules. For example, FIG.
- FIG. 10A illustrates a GNRBGBRNG array camera module 1000 made from a GNR sub-array module 1002, a BGB sub-array module 1004, and a RNG sub-array module 1006.
- data received by one sub-array module can of course be transmitted to another sub-array module.
- a respective sub- array module can include within the transmission information regarding the type of data and its origination and/or the orientation of the sub-array module within the array (i.e. standard or inverted/rotated).
- the BGB sub-array module 1004 transmits data to the RNG sub-array module 1006, the BGB can also transmit information regarding what type of data is being transmitted - e.g.
- the RNG sub-array module 1006 can read out the data to an external device.
- the GNR sub-array module 1002 can transmit image data to the BGB sub-array module 1004, which can then transmit image data (including the image data received from the GNR sub-array module) to the RNG sub-array module 1006; the RNG sub-array module 1006 may then read out image data (including the image data received from the BGB sub-array module, which itself includes image data received from the GNR sub-array module) to an external device.
- the manner in which the sub-array modules interface with each other and with a receiving device may be different.
- the manner in which the RNG sub-array module 1006 interfaces with a receiving device may be in accordance with the MIPI interface format, whereas the manner in which the GNR sub-array module 1002, the BGB sub- array module 1004, and the RNG sub-array module 1006 interface with one another in a different manner, e.g., via simple analog voltages or serial interfaces.
- the array camera module 1000 can couple with a receiving device, e.g. a processor, such that the receiving device can synchronize the capture of images from each of the sub-array modules.
- each of the sub-array modules has inputs and outputs that can be used to control the respective sub-array module's internal timing engine, and that can allow a processor to synchronize the capture of images.
- a processor can thus provide a driving signal to each of the sub-array modules that synchronizes the capture of images of the focal planes in the sub-array modules.
- the processor can provide the signal via a bus-type architecture, where the processor is set as a master, and each of the sub-arrays is set as a slave.
- the processor can also provide the driving signal to a directly coupled sub-array module, and the sub-array module can then relay the driving signal to an adjacent sub-array module, and this relaying process can continue until each sub-array module is provided with a driving signal.
- the processor does not provide a driving signal to each sub-array module; instead, the processor provides a driving signal to a master sub-array module.
- the master sub-array module can then controls the slave sub-array modules so that the capture of images from the cameras of the sub-array modules is synchronized.
- the driving signal can constitute a 'horizontal sync pulse' and a 'vertical sync pulse' to help facilitate the precise capture of image data.
- the image data may be captured by the pixels of the focal plane by advancing along the rows of pixels of the focal plane - i.e. image data is captured by a first row of pixels in a particular direction (e.g. left-to-right), then image data is captured by a next row of pixels, etc.
- a constituent horizontal sync pulse within a driving signal can synchronize the sampling and readout of a particular row of pixels within a focal plane (whichever row the vertical timing controller is pointing to at that time).
- the vertical sync pulse indicates to a vertical timing controller associated with a focal plane that the vertical timing controller should start at the beginning of the frame (i.e. row zero).
- the vertical sync pulse can synchronize the capture of individual frames from each sub-array module within the video.
- one of the sub-arrays is configured as a master that outputs the horizontal and vertical sync pulses to the other sub-arrays in the array cameras, which are designated as slaves synchronized to the control signals issued by the master sub-array.
- any driving signal can be used to synchronize the capture of image data in accordance with embodiments of the invention.
- the sub-array modules can also include outputs that provide information concerning the state of the internal timing engine of the sub-array camera module. In many embodiments, the timing information is also provided using a 'horizontal sync pulse' and a 'vertical sync pulse'.
- FIGS. 10A-10C any number of array camera modules can be constructed using sub-array modules in accordance with embodiments of the invention. For example, array camera modules of any length may be constructed using sub-array modules in accordance with embodiments of the invention.
- FIG. 1 1A illustrates a 1 x 9 array camera fabricated from three 1 x 3 sub-array modules that do not couple with one another in accordance with embodiments of the invention.
- the array camera 1 100 corresponds with that seen in FIG. 10A, except that each sub-array module, 1 102, 1 104, and 1 106, outputs image data to a bus 1 108, and thereby transmits image data to a processor 1 108.
- intermediary circuitry is used to convert received image data to a single MIPI output, which is then transmitted to a processor 1 1 10.
- array cameras can be implemented whereby sub-array modules do not couple with one another.
- Fig. 1 1 B illustrates a 1 x9 array camera similar to that seen in FIG. 1 1 A, except that each sub-array module is associated with a respective I/O device, that itself interfaces with an I/O block which processes the received image data and provides an output to a processor.
- a 1 x9 array camera 1 150 includes three sub-array modules 1 152, 1 154, and 1 156, that are each affiliated with a respective I/O device, 1 158, 1 160, and 1 162.
- the respective I/O devices interface with a separate I/O block 1 164 that can aggregate the image data and thereby provide a single MIPI output.
- the I/O block 1 164 can provide the output in a MIPI container to a processor 1 166 for further processing.
- this architecture includes multiple I/O devices, each affiliated with certain cameras, image data may be processed more effectively and efficiently. For example, using this architecture, the length of circuit traces can be reduced, and correspondingly, the signal to noise ratio can be enhanced. Consequently, the increased efficiency can help mitigate a host of issues that may otherwise be present including those relating to: image data synchronization; power consumption; and cross-talk.
- each of multiple I/O devices can be adapted to have a smaller footprint, and can thereby facilitate the implementation of an advantageous physical layout of the sub-array modules.
- each of multiple I/O devices can be affiliated with any number of cameras in accordance with embodiments of the invention. For example, in many embodiments, 2 I/O devices are incorporated whereby one I/O device is affiliated with 6 cameras, and the other I/O device is affiliated with 3 cameras. The I/O devices may then interface with a separate I/O block that receives image data, aggregates it, and outputs it to a processor for further processing.
- two-dimensional sub- array modules may also be implemented in accordance with embodiments of the invention; accordingly, I/O devices may also be affiliated with any number of cameras in an arrangement of two-dimensional sub-array modules in accordance with embodiments of the invention.
- I/O blocks may be affiliated with cameras within sub-array modules of any dimensions in accordance with embodiments of the invention.
- sub-array modules of different types may be coupled to form array camera modules.
- 1 x 3 sub-array modules may be combined with 1 x 2 sub-array modules, 1 x 4 sub-array modules, or even 1 x 1 sub-array modules.
- This flexibility is advantageous insofar as it can alleviate unwieldy manufacturing processes.
- the manufacture of sub-array modules that include near-IR cameras may require the imposition of an IR cut- off filter (that can be a structured dielectric coating), which may then be selectively removed in the areas of the sub-array module where a near-IR camera is desired (e.g.
- a 1 x 1 near-IR sub-array module may be coupled with another sub-array module of any type, thereby resulting in an array camera module that includes a near-IR camera. This technique may be advantageous in that cumbersome manufacturing processes may be avoided.
- 1 x 1 sub-array modules that include near-IR cameras can be produced separately on a single wafer that does not include any other color channels and later coupled with a sub-array module that includes color cameras constituting different color channels. Consequently, the step of selectively removing an IR cut-off filter and then applying an organic near-IR pass filter or other dielectric coating may be avoided.
- a 1 x 2 GR sub-array module may be coupled to a 1 x 1 near-IR camera to form a 1 x 3 GRN array camera module in accordance with embodiments of the invention.
- the particular lens fabrication technique employed in the fabrication of a sub-array module may be selected to accommodate the particular sub-array module's functionality and/or its manufacturing process.
- any number of sub-array modules which can each be of different types, can be coupled to form an array camera module in accordance with embodiments of the invention.
- the constituent sub-array modules may be designed to accommodate any number of different manufacturing processes.
- sub-array modules may be combined using a single substrate that includes interconnects.
- sub-array modules may be coupled to a substrate that has interconnects, such that when the sub-array modules are coupled to the substrate, the sub-array modules can thereby interface with each other and/or with a receiving device (e.g. a processor) via the substrate's interconnects.
- a receiving device e.g. a processor
- FIG. 12 The interconnection of three sub-array modules coupled to a glass substrate in accordance with an embodiment of the invention is illustrated in FIG. 12.
- three sub-array modules are coupled to a glass substrate that includes interconnects, thereby allowing the sub-array modules to interface with one another and with a receiving device.
- the array camera module 1200 is constructed from a glass substrate 1202 that includes interconnects 1204, upon which sub-array modules 1206 can couple.
- the sub-array modules can include electrical pads to couple with the glass substrate's interconnects.
- the electrical pads can include the same interface functionality discussed above with respect to FIGS. 7A and 7B (e.g. interface circuitry 718, 752, 754, inputs/outputs, 720, 722).
- the interconnects 1204 can allow the sub- array modules to interface with one another and with a receiving device such as, but not limited to, an appropriately configured microprocessor and/or an application specific device that is configured to read in the serial data from the independent sub-array modules and synthesize a cohesive output data stream (e.g.
- the interconnects can be configured so as to allow each sub-array module to interface - either directly or indirectly - with a receiving device such that each sub-array module can provide image data to a receiving device without having to couple with another sub-array module.
- the array camera seen in FIG. 1 1 can be constructed using a single substrate. Additionally, where a glass substrate is used, the lenses of a sub-array module may also be bonded to the glass substrate.
- the sensors that include the sub-arrays of focal planes may be coupled with the glass substrate on one side of it that includes interconnects, and the corresponding lenses that combine with the sensors to form an imager array may be bonded to the other side of the glass substrate such that the complete functionality of the sub-array module is achieved.
- the sub-array module can still function even though the glass substrate lies between the sensor dies and the corresponding lenses.
- the lens for each sensor in a sub-array module can be independently mounted to the glass substrate.
- arrays of lens stacks can be mounted to the glass substrate and the number of lens stacks in the array need not correspond with the number of focal planes on the sensors mounted to the glass substrate.
- Using a substrate to facilitate the coupling of sub-array modules can be advantageous in that the specific configuration of the substrate can govern the spacing between the sub-array modules, and the spacing between sub-array modules can control the array camera module's imaging ability. Specifically, the manner in which the interconnects are situated can govern the sub-array module spacing. Hence, sub-array modules that are coupled need not be within immediate proximity of one another when a substrate is used to enable their coupling. Although much of the discussion above refers to the use of glass substrates, any of a variety of optically transparent substrate materials can be utilized as appropriate to the requirements of specific applications in accordance with embodiments of the invention.
- substrates in which openings are formed to permit transmission of light through the substrate can also be utilized including (but not limited to) ceramic substrates in which through holes are formed.
- a single sensor or multiple sensors can be fixed to one side of the ceramic carrier to form the focal planes of the array camera module and lens barrels containing lens stacks can be affixed to the other side of the ceramic carrier so that the lens stacks direct light onto the focal planes of the one or more sensors through the openings in the ceramic carrier.
- the ceramic carrier is rigid and has a coefficient of thermal expansion that matches that of the sensor.
- One-dimensional array camera modules constructed from sub-array modules may also be coupled to a parallax disparity resolution module in accordance with embodiments of the invention.
- the parallax disparity resolution module may either a hardware parallax disparity resolution module or may be a software parallax disparity resolution module.
- FIG. 13A illustrates a 1 x 9 array camera module constructed from three constituent 1 x 3 sub array modules, where the array camera module 1300 outputs the data to a hardware parallax disparity resolution module 1302.
- FIG. 13B illustrates a 1 x 9 array camera module constructed from three constituent 1 x 3 sub-array modules, where the array camera module 1350 outputs the data to a software parallax disparity resolution module 1352.
- Either parallax disparity resolution module 1302, 1352 can receive the data and implement processes to detect parallax within image data (using processes similar to, but not limited to, those described in U.S. Provisional Patent Application Serial No. 61/691 ,666) and implement processes to account for the detected parallax in the further processing of the image data.
- Sub-array modules may be coupled to form two-dimensional array cameras in accordance with embodiments of the invention.
- a 3 x 9 two-dimensional array camera constructed from sub-array modules in accordance with embodiments of the invention is illustrated in FIG 14A.
- nine 1 x 3 sub-array modules are coupled so as to form three array camera module sub-assemblies 1402.
- Each array camera module subassembly 1402 is then coupled to a parallax disparity resolution module 1404 (either hardware or software).
- an interconnection module interfaces with a processor 1406 and one of the sub-arrays in each of the rows of the camera array to enable communication between the processor and each of the sub- arrays.
- the processor is configured to directly interface with multiple sub-arrays, e.g. similar to the arrangement seen in FIG. 1 1 .
- each sub-array module is configured to interface with circuitry that receives image data from each sub-array module and converts the image data to a single MIPI output, which is thereby provided to a processor.
- the three 1 x 9 array camera module sub-assemblies are adjacent to each other such that a 3 x 9 array camera module can be achieved.
- the processor 1406 is made aware of the relative location of the cameras, and uses this information in processing received data.
- a two-dimensional array camera is formed from sub- array modules where a single sub-array module reads out data to a processor.
- FIG. 14B illustrates a two-dimensional 3 x 9 array camera where a single constituent sub-array module reads out data to a processor.
- the array camera 1450 is formed from nine 1 x 3 sub-array modules that are coupled, where data from the sub-array modules is read out by a single sub-array module 1452 to a processor 1454, which can then process the image data.
- the sub array modules are arranged such that a 3 x 9 array camera module is achieved.
- any arrangement may be implemented in order to achieve a two- dimensional array camera module in accordance with embodiments of the invention.
- the processor 1454 is made aware of the relative location of the cameras, and uses this information in processing received data.
- the manner in which the sub-array modules interface with one another and with a receiving device may all be different.
- FIG. 15 illustrates a two- dimensional array camera formed from sub-array modules coupled to a substrate.
- the array camera 1500 includes a glass substrate 1502 with interconnects 1504, sub-array modules 1506, and a processor 1508.
- the sub-array modules 1506 can connect to the glass substrate 1502 via electrical pads, and as before the imager arrays of a sub-array module 1506 may be coupled to one-side of the glass substrate that includes interconnects 1504, and corresponding lenses may be bonded to the other side of the glass substrate 1502.
- using substrates to facilitate the coupling of sub-array modules - either to one another or to independent circuitry - can be advantageous in that the substrate can control the spacing between sub-array modules, and this affects the array camera's imaging ability.
- an array camera module may be patterned with " ⁇ filter groups", or alternatively "Pi filter groups.”
- Pi filter groups refers to a pattern of narrow spectral band cameras within the array camera module. Processes for patterning array cameras with Pi filter groups are described in U.S. Provisional Patent Application Serial No. 61/641 ,164, entitled “Camera Modules Patterned with ⁇ Filter Groups", Venkataraman et al. The disclosure of U.S. Provisional Patent Application Serial No. 61/641 ,164 is incorporated by reference herein in its entirety.
- a single Pi filter group is illustrated in FIG. 16, wherein 5 cameras are configured to receive green light, 2 cameras are configured to receive red light, and 2 cameras are configured to receive blue light.
- the Pi filter patterns may facilitate the efficient capturing of color image data.
- two-dimensional array cameras are constructed using sub-array modules wherein the sub-array modules are arranged such that Pi filter groups are implemented within the array camera.
- FIGS. 17A and 17B are similar to FIGS. 14A and 14B except that the sub-array modules are configured to implement Pi filter groups.
- FIGS. 18A-18B illustrate 1 x 4 sub-array modules in accordance with some embodiments. It should be repeated that although only narrow spectral band blue, green and red cameras are illustrated in FIGS. 18A-18B, any type of camera may of course be implemented in sub-array modules in accordance with embodiments of the invention.
- FIGS. 19A and 19B illustrate the construction of a 4 x 4 array camera using 1 x 4 sub-array modules in accordance with many embodiments.
- FIGS. 19A and 19B are similar to FIGS. 14A and 14B except that 1 x 4 sub-array modules are used to form the array camera.
- the illustrated embodiment includes an array camera, sub-array module sub-assemblies 1902, an interconnection module 1904, and a processor 1906, 1908.
- Pi filter groups are patterned on the array camera.
- FIGS. 20A- 20D illustrate 1 x 5 sub-array modules
- 21A-21 B illustrate the construction of 5 x 5 array cameras using 1 x 5 sub-array modules.
- the illustrated embodiment includes an array camera 2100, sub-array modules sub-assemblies 2102, an interconnection module 2104, and a processor 2106, 2108.
- Pi filter groups are implemented on the two dimensional array cameras.
- a particular benefit of utilizing 1 x 5 sub-array modules to build a 5 x 5 array camera module is that the 5 x 5 array camera can be constructed using two different types of 1 x 5 sub-array modules (i.e. GRGRG and BGBGB or GBGBG and RGRGR).
- any square array patterned with Pi filter groups including an odd number of rows and columns can be constructed using only two different types of sub-arrays.
- FIG. 22 illustrates the construction of a 4x4 array camera using 2x2 sub-array modules.
- the 4x4 array camera 2200 is similar to that seen in FIG. 19, except that it includes four 2x2 sub-array modules 2202.
- each sub-array module 2202 interfaces with circuitry 2204 that receives image data from each of the sub-array modules and outputs the aggregated image data to a processor 2206.
- the sub-array modules can provide image data to a processor in any suitable fashion in accordance with embodiments of the invention.
- the two-dimensional sub-arrays include interface circuitry that allow them to interface with other sub-array modules, and thereby transmit image data to (and otherwise interact with) a processor.
- modular array cameras include both two-dimensional and one-dimensional sub-array modules.
- modular array cameras of any dimension can be constructed from one- dimensional and/or two-dimensional sub-array modules in accordance with embodiments of the invention.
- 1 x 1 sub-array modules may also be used to construct array cameras, and this is discussed below.
- 1 x 1 sub-array modules may be used to construct array cameras.
- 1 x 1 sub-array modules may be used to construct either one dimensional array cameras or two- dimensional array cameras.
- 1 x 1 sub-array modules are similar to the sub-array modules discussed above except that they do not include multiple lens stacks and multiple focal planes. Instead, a 1 x 1 sub-array module includes a single lens stack and a sensor including single focal plane. Accordingly, the above-mentioned techniques regarding constructing array cameras from sub-array modules may also be used to construct array cameras from 1 x 1 sub-array modules.
- 1 x 1 sub-array modules may confer a host of benefits.
- Array cameras of any dimension may be constructed using 1 x 1 sub-array modules, and many different types of 1 x 1 sub-array modules may be used in the construction.
- 1 x 1 sub-array modules that have different F numbers, focal lengths, image sensor formats and/or fields of view may be used, particularly because slightly different heights of different types of 1 x 1 sub-array modules can be accommodated.
- the different substrates and spacer thicknesses within a lens stack may be accommodated.
- these sub-array modules are used to construct array cameras that can provide optical zoom with no moving parts.
- Array cameras may also incorporate 1 x 1 sub-array modules that are configured for near-IR sensitivity and far-IR sensitivity. Additionally, sub-array modules that implement a time-of-f light camera to provide additional depth information, may also be used in accordance with embodiments of the invention. As already discussed above, 1 x 1 sub-array modules are also beneficial insofar as 1 x 1 sub-array modules of the same type (e.g., near-IR cameras) may be constructed on the same wafer, thereby increasing manufacturing efficiencies.
- 1 x 1 sub-array modules may be assembled to form an array camera module using a variety of technique appropriate to the specific 1 x 1 sub-array module constructions, including any of the above discussed techniques, in accordance with embodiments of the invention.
- the sensor of a 1 x 1 sub-array module is adjoined to a printed circuit board using reflow soldering. Subsequently, the respective lenses of the sub-array module may be adjoined to the sensor. Note that the lenses may be affixed to the sensor using the active alignment processes U.S. Patent Application Ser. No. 61/666,852.
- the sensors of a 1 x 1 sub-array module are bonded to a glass substrate that includes interconnects that allow the sub-array modules and other components to interface.
- the corresponding lenses may also be bonded to the glass substrate. This technique is similar to that already described above.
- each sub-array module is first independently formed such that it is inclusive of the sensor and the lens stack array, and is then reflow soldered to a printed circuit board.
- both the lens and the sensor are adapted to be capable of undergoing a reflow soldering process.
- This method of manufacture may be advantageous insofar as the individual sub-array modules can be evaluated prior to construction of the array camera. It may be further advantageous, as the formed sub-array modules may be easily rearranged to provide different types of array cameras.
- one-dimensional array camera modules and two-dimensional array camera modules may be formed from 1 x 1 sub-array modules in accordance with embodiments of the invention.
- the particular arrangement of the 1 x 1 sub-array modules will govern whether a one-dimensional or a two- dimensional array camera module is achieved.
- the sub-array modules when the individual sub-array modules are assembled to form an array camera, the sub-array modules may be oriented in slightly different directions with respect to one another, for example due to manufacturing tolerances and corrections for alignment. As a result, the epipolar lines of the resulting array camera may deviate with respect to the scanlines of the individual cameras. Consequently, in many embodiments, the array camera includes a processor that can perform an affine transformation in conjunction with parallax disparity resolution, in processing the images provided by the sub-array modules, to resolve the discrepancies in camera orientation.
- an array camera that is constructed from 1 x 1 sub- array modules also utilizes an external hardware block that can read in serial data from the independent 1 x 1 sub-array modules, and synthesize a cohesive output data stream (e.g. a MIPI serial output data stream) that can be transmitted to a receiving device, e.g. a processor.
- the external hardware block can interact with the sub-array modules through a custom I2C interface to, for example, command and control the individual sub-array modules.
- the external hardware block includes sufficient buffer space so that it can read out all the data from the sub-array modules to the receiving device simultaneously.
- the external hardware block includes circuitry to encrypt the data being read out from the camera array to enable digital rights management control.
- the external hardware block includes circuitry to compress the data being read out from the camera array to reduce the data bandwidth requirements in the resulting output stream.
- array camera modules can be constructed using any of a variety of techniques involving fixing sub- array modules of any dimension to a substrate appropriate to the requirements of a specific application in accordance with embodiments of the invention.
Abstract
Systems and methods in accordance with embodiments of the invention implement one-dimensional array cameras, as well as modular array cameras using sub-array modules. In one embodiment, a 1xN array camera module includes: a 1xN arrangement of focal planes, where N is greater than or equal to 2, each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane not including pixels from another focal plane; and a 1 xN arrangement of lens stacks, the arrangement of lens stacks being disposed relative to the arrangement of focal planes so as to form a 1xN arrangement of cameras, each configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to that of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
Description
Thin Form Computational and Modular Array Cameras
FIELD OF THE INVENTION
[0001] The present invention generally relates to one-dimensional array cameras and also relates to the construction of modular array cameras using one-dimensional sub-array modules.
BACKGROUND
[0002] In response to the constraints placed upon a traditional digital camera based upon the camera obscura, a new class of cameras that can be referred to as array cameras has been proposed. Array cameras are characterized in that they include an imager array that has multiple arrays of pixels, where each pixel array is intended to define a focal plane, and each focal plane has a separate lens stack. Typically, each focal plane includes a plurality of rows of pixels that also forms a plurality of columns of pixels, and each focal plane is contained within a region of the imager that does not contain pixels from another focal plane. An image is typically formed on each focal plane by its respective lens stack. In many instances, the array camera is constructed using an imager array that incorporates multiple focal planes and an optic array of lens stacks.
SUMMARY OF THE INVENTION
[0003] Systems and methods in accordance with embodiments of the invention implement one-dimensional array cameras, as well as modular array cameras using sub-array modules. In one embodiment, a 1 xN array camera module includes: a 1 xN arrangement of focal planes, where N is greater than or equal to 2, each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xN arrangement of lens stacks, the 1 xN arrangement of lens stacks being disposed relative to the 1 xN arrangement of focal planes so as to form a 1 xN arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
[0004] In another embodiment, N is greater than or equal to 3.
[0005] In yet another embodiment, N is 5.
[0006] In still another embodiment, the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum.
[0007] In still yet another embodiment, the green camera is centrally disposed relative to the 1 xN arrangement of cameras.
[0008] In a further embodiment, the lens stack of the green camera is adapted to image light corresponding with the green band of the visible spectrum.
[0009] In a still further embodiment, a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
[0010] In a yet further embodiment, N is 7.
[0011] In a still yet further embodiment, the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1 xN arrangement of cameras.
[0012] In another embodiment, a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
[0013] In yet another embodiment, N is 9.
[0014] In still another embodiment, the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1 xN arrangement of cameras.
[0015] In still yet another embodiment, a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
[0016] In a further embodiment, the 1 xN arrangement of focal planes is embodied within a monolithic structure.
[0017] In a still further embodiment, the 1 xN arrangement of lens stacks is embodied within a monolithic structure.
[0018] In a yet further embodiment, the 1 xN arrangement of focal planes and the 1 xN arrangement of lens stacks are each embodied within the same monolithic structure.
[0019] In a still yet further embodiment, at least one camera is embodied within a single sub-array module, the sub-array module including: a 1 xX arrangement of focal planes, where X is greater than or equal to 1 , each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1 xX arrangement of lens stacks being disposed relative to the 1 xX arrangement of focal planes so as to form a 1xX arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
[0020] In another embodiment, the sub-array module further includes interface circuitry that can allow the sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
[0021] In yet another embodiment, the 1 xX arrangement of cameras is embodied within a single monolithic structure.
[0022] In still another embodiment N is 9 and X is 3.
[0023] In still yet another embodiment, the 1 x9 arrangement of cameras are embodied within three 1 x3 sub-array modules, each 1 x3 sub-array module including: a 1 x3 arrangement of focal planes, where each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 x3 arrangement of lens stacks, the 1 x3 arrangement of lens stacks being disposed relative to the 1x3 arrangement of focal planes so as to form a 1 x3 arrangement of cameras, each of which being configured to
independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
[0024] In a further embodiment, each sub-array module further includes interface circuitry that can allow the sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
[0025] In a still further embodiment, an array camera module further includes at least two sub-array modules, where each sub-array module includes: a 1 xX arrangement of focal planes, where X is greater than or equal to 1 , each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1 xX arrangement of lens stacks being disposed relative to the 1 xX arrangement of focal planes so as to form a 1xX arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; where each of the at least two sub-array modules are adjoined to the interconnects of a single substrate, and can thereby interface with at least one other sub-array module.
[0026] In a yet further embodiment, each of the at least two sub-array modules further includes interface circuitry that can allow the respective sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
[0027] In a still yet further embodiment, the substrate is optically transparent.
[0028] In another embodiment, the substrate is glass.
[0029] In yet another embodiment, the substrate is ceramic.
[0030] In a further embodiment, a 1 xX sub-array module includes: a 1 xX arrangement of focal planes, where X is greater than or equal to 1 , each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1 xX arrangement of lens stacks being disposed relative
to the 1 xX arrangement of focal planes so as to form a 1 xX arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
[0031] In a yet further embodiment, the 1 xX sub-array module further includes interface circuitry that can allow the sub-array module to interface with another sub- array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
[0032] In a still further embodiment, the interface circuitry implements a MIPI CSI 2 interface.
[0033] In another embodiment, a 1xN array camera includes: a 1 xN arrangement of focal planes, where N is greater than or equal to 2, each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and a 1 xN arrangement of lens stacks, the 1xN arrangement of lens stacks being disposed relative to the 1 xN arrangement of focal planes so as to form a 1xN arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and a processor that is configured to construct an image of the scene using image data generated by the 1 xN array camera module.
[0034] In a further embodiment, an XxY sub-array module includes: an XxY arrangement of focal planes, where X and Y are each greater than or equal to 1 , each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and an XxY arrangement of lens stacks, the XxY arrangement of lens stacks being disposed relative to the XxY arrangement of focal planes so as to form an XxY arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and image data output circuitry that is configured to output image data from the XxY
sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed.
[0035] In a yet further embodiment, X is 1 .
[0036] In a still further embodiment, X and Y are each greater than 1 .
[0037] In a still yet further embodiment, the arrangement of cameras are embodied within a single monolithic structure
[0038] In another embodiment, an MxN array camera includes: a plurality of XxY sub-array modules, each including: an XxY arrangement of focal planes, where X and Y are each greater than or equal to 1 , each focal plane includes a plurality of rows of pixels that also form a plurality of columns of pixels, and each focal plane does not include pixels from another focal plane; and an XxY arrangement of lens stacks, the XxY arrangement of lens stacks being disposed relative to the XxY arrangement of focal planes so as to form an XxY arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and image data output circuitry that is configured to output image data from the sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed; where the plurality of XxY sub-array modules define at least some of the cameras in an MxN arrangement of cameras; and a processor; where the processor is configured to construct an image of the scene using image data generated by each of the sub-array modules.
[0039] In yet another embodiment, X is 1 and M is 1 .
[0040] In still another embodiment, the plurality of XxY sub-array modules define an MxN arrangement of cameras.
[0041] In still yet another embodiment, an MxN array camera further includes circuitry that aggregates the image data generated by each of the sub-array modules into a single MIPI output, and provides the MIPI output to the processor so that the processor can construct an image of the scene.
[0042] In a further embodiment, an MxN array camera further includes a parallax disparity resolution module, where the parallax disparity resolution module is configured
to receive image data captured by each sub-array module, implement a parallax detection and correction process on the received image data, and output the result for further processing.
[0043] In a still further embodiment, an MxN array camera further includes circuitry that converts the output of the parallax disparity resolution module into a single MIPI output, and provides the MIPI output to the processor so that the processor can construct an image of the scene.
[0044] In a still yet further embodiment, the parallax disparity resolution module includes a processor and memory, where the memory contains software to configure the processor to act as a parallax disparity resolution module.
[0045] In another embodiment, the parallax disparity resolution module is a hardware parallax disparity resolution module.
[0046] In still another embodiment, M and N are each greater than or equal to 2.
[0047] In yet another embodiment, at least two of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and can thereby output image data through the interconnects.
[0048] In still yet another embodiment, each of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and can thereby output image data through the interconnects.
[0049] In a further embodiment, the substrate is optically transparent.
[0050] In a still further embodiment, the substrate is glass.
[0051] In a still yet further embodiment, the substrate is ceramic.
[0052] In another embodiment, at least one sub-array module is embodied within a single monolithic structure.
[0053] In yet another embodiment, each sub-array module is embodied within a single respective monolithic structure.
[0054] In still another embodiment, an array camera further includes: a plurality of I/O devices, where each of the plurality of I/O devices interfaces with at least one camera: and a separate I/O block that includes circuitry configured to receive image data, aggregate the received image data, and output the aggregated image data to the
processor so that the processor can construct an image of the scene; and where each of the plurality of I/O devices interfaces with the I/O block.
[0055] In still yet another embodiment, the number of I/O devices equals the number of sub-array modules, and each I/O device interfaces with a corresponding sub-array module.
BRIEF DESCRIPTION OF THE DRAWINGS
[0056] FIG. 1 conceptually illustrates an array camera architecture in accordance with an embodiment of the invention.
[0057] FIG. 2 conceptually illustrates an imager array architecture in accordance with an embodiment of the invention.
[0058] FIG. 3 conceptually illustrates the construction of an array camera module in accordance with an embodiment of the invention.
[0059] FIGS. 4A and 4B illustrate 1 x5 array camera modules in accordance with embodiments of the invention.
[0060] FIGS. 5A-5C illustrate 1 x7 array camera modules in accordance with embodiments of the invention.
[0061] FIGS. 6A-6C illustrate 1 x9 array camera modules in accordance with embodiments of the invention.
[0062] FIG. 7A illustrates a 1 x 3 sub-array module in accordance with an embodiment of the invention.
[0063] FIG. 7B illustrates another 1 x 3 sub-array module in accordance with another embodiment of the invention
[0064] FIGS. 8A-8K illustrate 1 x3 sub-array modules in accordance with embodiments of the invention.
[0065] FIG. 9 illustrates how sub-array modules may be reconfigured in accordance with an embodiment of the invention.
[0066] FIGS. 10A-10C illustrate how 1 x3 sub-array modules may be coupled to form array camera modules in accordance with embodiments of the invention.
[0067] FIGS. 1 1A-1 1 B illustrates how 1 x3 sub-array modules may interface with a receiving device and thereby implement an array camera in accordance with embodiments of the invention
[0068] FIG. 12 illustrate how sub-array modules may be coupled via a glass substrate with interconnects to form an array camera module in accordance with embodiments of the invention.
[0069] FIGS. 13A-13B illustrate how array camera modules formed from sub-array modules may utilize a parallax disparity resolution module in accordance with embodiments of the invention.
[0070] FIGS. 14A-14B illustrate how sub-array modules may be coupled to form an MxN array camera in accordance with embodiments of the invention.
[0071] FIG. 15 illustrates how sub-array modules may be coupled via a glass substrate with interconnects to form a two-dimensional array camera in accordance with embodiments of the invention
[0072] FIG. 16 illustrates a Pi filter group that may be utilized in accordance with embodiments of the invention.
[0073] FIGS. 17A-17B illustrates how sub-array modules may be coupled to form an array camera that employs Pi filter groups.
[0074] FIGS. 18A-18B illustrate 1 x4 sub-array modules in accordance with embodiments of the invention.
[0075] FIGS. 19A-19B illustrate how 1 x4 sub-array modules may be coupled to form an MxN array camera in accordance with embodiments of the invention
[0076] FIGS. 20A-20D illustrate 1 x5 sub-array modules in accordance with embodiments of the invention.
[0077] FIGS. 21A-21 B illustrate how 1 x5 sub-array modules may be coupled to form an MxN array camera in accordance with embodiments of the invention.
[0078] FIG. 22 illustrates a two-dimensional array camera fabricated from multiple two-dimensional sub-array modules.
DETAILED DESCRIPTION
[0079] Turning now to the drawings, systems and methods for implementing one- dimensional array cameras and modular array cameras are disclosed. Processes for constructing array cameras using lens stack arrays are described in U.S. Patent Application Serial No. 12/935,504, entitled "Capturing and Processing of Images Using Monolithic Camera Array with Heterogeneous Imagers", Venkataraman et al., which is incorporated herein by reference in its entirety. The monolithic array camera modules illustrated in U.S. Patent Application Serial No. 12/935,504 can be constructed from an optic array of lens stacks - each lens stack in the array defining an optical channel - and an imager array including a plurality of focal planes corresponding to the optical channels in the optic array. The combination of a lens stack and its corresponding focal plane can be understood to be a 'camera' (as opposed to an 'array camera'). Typically, array cameras capture image data that can be used to form multiple images of a single scene using their constituent cameras, and process the image data to yield a single image of the scene with improved image properties.
[0080] U.S. Patent Application Serial No. 12/935,504 discloses many two- dimensional array camera schemes. However, such two-dimensional embodiments may be inapplicable in a number of desirable applications. For example, a consumer electronics device, such as a tablet or smartphone, may benefit from the use of an array camera with a distinctly thin form factor such that it would be able to fit within the device's bezel.
[0081] Many embodiments of the invention utilize one-dimensional array camera modules. One-dimensional array camera modules are advantageous insofar as they may accommodate distinct form factor requirements, and are further advantageous in that they may ease processing requirements as compared with two-dimensional array cameras (e.g. they simplify parallax disparity resolution calculations). In many embodiments, 1 x5 array camera modules are utilized in the construction of an array camera. In several embodiments, a 1 x5 array camera module is utilized that includes a central narrow spectral band green camera (i.e. a camera configured to image light that falls within the 'green' band of the visible spectrum, which can be achieved, for example, where the corresponding lens stack is configured to focus light that falls within
the 'green' band of the visible spectrum onto the corresponding focal plane), and adjacent narrow spectral band blue and red cameras on either side of the central narrow spectral band green camera. In a number of embodiments, 1x7 array camera modules are utilized in the construction of array cameras. In several embodiments, a 1 x7 array camera module includes a central narrow spectral band green camera, adjacent narrow spectral band blue and red cameras on either side of the central narrow spectral band green camera, and two periphery narrow spectral band green cameras.
[0082] In many embodiments, 1 x9 array camera modules are utilized in the construction of an array camera. A 1 x9 array camera module can be preferable to either a 1x7 or a 1 x5 array camera module since a 1 x9 array camera module can capture more image data. 1 x9 array camera modules may include narrow spectral band green, blue, and red cameras, full visual spectrum cameras, and/or near-infrared (near-IR) cameras, which are useful for imaging in low lighting conditions. In many embodiments, a 1 x9 array camera module includes more narrow spectral band green cameras than either narrow spectral band blue, narrow spectral band red, or near-IR cameras.
[0083] In many embodiments, one-dimensional array camera modules are constructed that do not use narrow spectral band cameras; in many embodiments one- dimensional array camera modules are constructed that employ Bayer filters to facilitate the imaging of a scene.
[0084] Although one-dimensional array cameras may be beneficial in numerous applications, their manufacture can be challenging. Specifically, components for one- dimensional array cameras (e.g. the lenses and the corresponding sensor) are typically manufactured on wafers, but the elongated nature of the components may not be conducive to optimizing wafer space. For example, in the manufacture of a one- dimensional lens array, the periphery of the wafer used in the manufacture may contain significant unused space that, because of the elongated shape of lens array, cannot accommodate further lens arrays. In other words, wafers may be more efficient in the manufacture of components that are more 'square' in shape than 'elongated.'
[0085] In many embodiments of the invention, array cameras are constructed using sub-array modules. Each of the sub-array modules are configured to interface with other
sub-array modules so that data can pass between the sub-array modules, enabling a processor to communicate with multiple sub-array modules via an interface with one of the sub-array modules. The dies used in the construction of sub-array modules may be less elongated as compared with the dies utilized in the construction of the aforementioned one-dimensional array camera modules, and can therefore better utilize wafer space. In several embodiments, a 1 x3 sub-array module is utilized that includes input and output interface circuitry, which allow the sub-array module to couple with other sub-array modules. In many embodiments, a sub-array module including a single camera is utilized. The interface circuitry can further allow coupled sub-array modules to transmit and receive data including image data and/or instructions from a processor with one another. The image data from one of the sub-array modules may be read out by a processor. The interface circuitry may employ any interface protocol including Mobile Industry Processor Interface Alliance (MIPI) Camera Serial Interface 2(c) interface format (the "MIPI interface format") or a Standard Mobile Imaging Architecture ("SMIA") format. The 1 x3 modular array cameras may include constituent narrow spectral band green, blue, or red cameras and may also include near-IR cameras.
[0086] Using sub-array modules to construct array cameras can provide numerous advantages. First, the manufacture of sub-array modules can result in a greater yield as compared with the manufacturing yield of longer one-dimensional array camera modules since sub-array module components may more efficiently utilize wafer space. Additionally, their manufacture can also result in comparatively greater homogeneity between sub-array modules since sub-array modules are less intricate as compared with longer one-dimensional array camera modules or two-dimensional array camera modules. Moreover, sub-array modules are versatile insofar as they can be used to construct array cameras of any specified dimension.
[0087] One-dimensional array camera modules and sub-array modules in accordance with embodiments of the invention are discussed further below.
ARRAY CAMERA ARCHITECTURE
[0088] Array cameras in accordance with many embodiments of the invention can include an array camera module and a processor. The array camera module can
include an array of cameras. An array camera module can include an imager array, which is a sensor that includes an array of focal planes. Each focal plane includes an array of pixels used to capture an image formed on the focal plane by a lens stack. The focal plane can be formed of, but is not limited to, traditional CIS (CMOS Image Sensor), CCD (charge-coupled device), quantum film image sensors, high dynamic range sensor elements, multispectral sensor elements and various alternatives thereof. In many embodiments, the pixels of each focal plane have similar physical properties and receive light through the same lens stack. Furthermore, the pixels in each focal plane may be associated with the same color filter. In a number of embodiments, at least one of the focal planes includes a Bayer-pattern filter. In several embodiments, the focal planes are independently controlled. In other embodiments, the operation of the focal planes in the imager array is controlled via a single set of controls. Array cameras are discussed in U.S. patent application Ser. No. 13/106,797 entitled "Architectures for imager arrays and array cameras" and U.S. patent application Ser. No. 12/952,106 entitled "Capturing and processing of images using monolithic camera array with heterogenous imagers" the disclosure of both applications is hereby incorporated by reference in its entirety.
[0089] An array camera architecture that can be used in a variety of array camera configurations in accordance with embodiments of the invention is illustrated in FIG. 1 . The array camera 100 includes an array camera module 102 that is configured to transmit 106 image data to a receiving device 108 via an interface format involving the transmission of additional data describing the transmitted image data. The array camera module 102 includes an array of cameras 104. The cameras 104 in the array camera module 102 are formed from the combination of a lens stack and a focal plane. The array camera module 102 can include an optic array of lens stacks and an imager array of focal planes. These multiple cameras 104 may be active or inactive at any given time. The image data captured by these multiple cameras may be transmitted from the focal planes of each camera to a processor. The focal planes may have different imaging characteristics, such as varying exposure times, start times, and end times. Therefore, the timing of the transmission of the image data captured by each focal plane can vary. Accordingly, the imager array can transmit additional data describing the image data to
enable a device receiving the image data to appropriately reconstruct images from the received image data. The transmission of array camera image data is disclosed in U.S. Patent Application Serial No. 13/470,252, entitled "Systems and Methods for Transmitting and Receiving Array Camera Image Data," the disclosure of which is hereby incorporated by reference.
[0090] In many embodiments, the array camera 100 captures images using a plurality of cameras 104, which can have different imaging characteristics. The array camera 100 can separately control each of the cameras to obtain enhanced image capture and/or to enhance processes such as (but not limited to) super-resolution processes that may be applied to the captured images. For example, each pixel of a focal plane may capture different wavelengths of light, or may capture the intensity of light, varying exposure times, start times, or end times. Once the array camera 100 has commenced capturing image data using the pixels on the imager array, the focal planes can commence transmitting the image data captured using the pixels to a receiving device 108. The image data captured by different cameras can be interleaved for transmission to a receiving device 108 that includes interface circuitry configured to receive image data. In many embodiments, the interface circuitry is implemented in hardware and/or using a processor. The receiving device 108 can then organize the captured image data from the received packet and appropriately combine the image data to process and/or reconstruct the image(s) captured by one or more of the focal planes in the imager array.
[0091] In the illustrated embodiment, image data from multiple images of a scene can be captured by the array camera module 102. As the image data is captured, the array camera module 102 transmits 106 the image data to a receiving device 108. The array camera module 102 transmits the image data using a small number of local data storage cells on the array camera module 102 that store the captured image data following capture by the cameras. In the illustrated embodiment, the array camera module 102 manages the capture and transmission of image data so that the captured image data stored in the storage cells is transmitted by the imager array of the array camera module 102 in the time taken to capture and load the next set of image data into the storage cells. In this way, the array camera module can continuously buffer and
transmit image data using a number of local data storage cells that is less than the total number of pixels in the array camera module.
[0092] In many embodiments, a line of image data transmitted by an imager array can be considered to equal the number of pixels in a row of a focal plane multiplied by the number of focal planes. In several embodiments, the clock frequency of transmitter circuitry on the imager array is set to a desired output data rate and the internal focal plane pixel rate is set to 1/N the desired output data rate (where N is the total number of focal planes). In many image transmission protocols, once a start of line condition is sent, all of image data is transmitted without interrupt until the end of line. Accordingly, a sufficient number of data storage cells and a buffering mechanism can be developed that starts transmission of pixels once there are sufficient pixels stored such that all of the pixels will have been captured and transmitted by the time the end of the line of image data is reached. If, for example, an imager array including 4 focal planes (as in a 1 x 4 array) transmits image data from all focal planes, then there is very little data storage utilized prior to the start of focal plane readout, because the data is transmitted at approximately the rate that at which it is being read. If, however, the same imager array only has one active imager, then almost all of the pixels from a row of the focal plane are stored since the buffer is being read 4 times as fast as it is being written. Therefore, the data storage requirement would be one row of pixels (i.e. 1 /4th of a line of image data). When three focal planes are active, 1/ the data from the three focal planes is buffered before transmission commences to avoid underflow. Therefore, the total number of data storage cells utilized is equal to the number of pixels in three quarters of a row of one of the focal planes in this example. The above examples illustrate how the data storage requirements of an imager array can vary based upon the number of active focal planes. In many embodiments, the total number of storage cells within an imager array is less than a quarter of a line of image data. In several embodiments, the total number of storage cells within an imager array is equal to a line of image data. In several embodiments, the total number of data storage cells is between a quarter of a line of image data and a full line of image data. In a number of embodiments, the total number of storage cells is equal to or greater than a line of image data. When the array camera module transmits the captured image data, the
incorporation of additional data describing the image data enables a peripheral device receiving the image data to reconstruct the images captured by each active camera in the imager array 102.
[0093] Imager arrays in accordance with many embodiments of the invention are configured to output image data via an interface format that accommodates the transfer of image data captured via multiple focal planes. In several embodiments, the imager array is configured to transmit captured image data in accordance with an interface format that is compatible with standard interface formats, such as (but not limited to) the MIPI CSI-2 interface format (MIPI interface format), the Camera Link interface format, and any of the Universal Serial Bus (USB) interface formats or FireWire interface formats. When image data captured from multiple focal planes is output by the imager array, the device receiving the image data is faced with the task of assembling the image data into a plurality of images of a scene.
[0094] Although specific array camera system architectures are discussed above for constructing array cameras including 1 x N arrays of cameras, any of a variety of system architectures for array cameras including 1 x N arrays of cameras can be utilized as appropriate to the requirements of a specific application in accordance with embodiments of the invention. Imager array architectures are discussed below in greater detail.
IMAGER ARRAY ARCHITECTURES
[0095] An imager array in accordance with an embodiment of the invention is illustrated in FIG. 2. The imager array 200 includes a focal plane array core 202 that includes a 1 x N array of focal planes 204 and all analog signal processing, pixel level control logic, signaling, and analog-to-digital conversion circuitry. The imager array also includes focal plane timing and control circuitry 206 that is responsible for controlling the capture of image information using the pixels. For example, in some embodiments, the focal plane timing and control circuitry 206 can synchronize the capture of image data by the focal planes such that active focal planes capture image data from a scene simultaneously. In many embodiments, the focal plane timing and control circuitry 206 causes the active focal planes to capture image data from a scene in a particular
controlled sequence. In a number of embodiments, the focal plane timing and control circuitry 206 utilizes reset and read-out signals to control the integration time of the pixels. In several embodiments, any of a variety of techniques can be utilized to control integration time of pixels and/or to capture image information using pixels. In many embodiments, the focal plane timing and control circuitry 206 provides flexibility of image information capture control, which enables features including (but not limited to) high dynamic range imaging, high speed video, and electronic image stabilization. In various embodiments, the imager array 200 includes power management and bias generation circuitry 208. The power management and bias generation circuitry 208 provides current and voltage references to analog circuitry such as the reference voltages against which an ADC would measure the signal to be converted against. In many embodiments, the power management and bias circuitry also includes logic that turns off the current/voltage references to certain circuits when they are not in use for power saving reasons. In several embodiments, the imager array includes dark current and fixed pattern (FPN) correction circuitry 210 that increases the consistency of the black level of the image data captured by the imager array and can reduce the appearance of row temporal noise and column fixed pattern noise. In several embodiments, each focal plane includes reference pixels for the purpose of calibrating the dark current and FPN of the focal plane and the control circuitry can keep the reference pixels active when the rest of the pixels of the focal plane are powered down in order to increase the speed with which the imager array can be powered up by reducing the need for calibration of dark current and FPN. In many embodiments, the SOC imager includes focal plane framing circuitry 212 that packages the data captured from the focal planes into a container file and can prepare the captured image data for transmission. In several embodiments, the focal plane framing circuitry 212 includes information identifying the focal plane and/or group of pixels from which the captured image data originated. In a number of embodiments, the imager array 200 also includes an interface for transmission of captured image data to external devices. In the illustrated embodiment, the interface is a MIPI CSI 2 output interface supporting four lanes that can support read-out of video at 30 fps from the imager array and incorporating data output interface circuitry 214, interface control circuitry 216 and
interface input circuitry 218. Typically, the bandwidth of each lane is optimized for the total number of pixels in the imager array and the desired frame rate. The use of various interfaces including the MIPI CSI 2 interface to transmit image data captured by an array of imagers within an imager array to an external device in accordance with embodiments of the invention is described in in U.S. patent application Ser. No. 13/470,252, cited to and incorporated by reference above.
[0096] An imager array in accordance with embodiments of the invention can include a single controller that can separately sequence and control each focal plane. Having a common controller and I/O circuitry can provide important system advantages including lowering the cost of the system due to the use of less silicon area, decreasing power consumption due to resource sharing and reduced system interconnects, simpler system integration due to the host system only communicating with a single controller rather than M x N controllers and read-out I/O paths, simpler array synchronization due to the use of a common controller, and improved system reliability due to the reduction in the number of interconnects.
[0097] Additionally, an imager array in accordance with embodiments of the invention may include a parallax disparity resolution module 220 that can determine disparity between pixels in different images captured by the camera array using parallax detection processes similar to those described in U.S. Provisional Patent Application Serial No. 61/691 ,666 entitled "Systems and Methods for Parallax Detection and Correction in Images Captured Using Array Cameras" to Venkataraman et al., the disclosure of which is incorporated by reference herein in its entirety. In particular, as will be elaborated on below in the section on "One-Dimensional Array Camera Modules", in some embodiments, the processing requirements for a parallax disparity resolution calculation may be sufficiently low that the process may be computed by the imager array circuitry.
[0098] Although specific components of an imager array architecture are discussed above with respect to FIG. 2, any of a variety of imager arrays can be constructed in accordance with embodiments of the invention that enable the capture of images of a scene at a plurality of focal planes in accordance with embodiments of the invention. Array camera modules that utilize imager arrays are discussed below.
ARRAY CAMERA MODULES
[0099] Array camera modules in accordance with many embodiments of the invention include the combination of an optic array including a 1 x N array of lens stacks and an imager array that includes a 1 x N array of focal planes. Each lens stack in the optic array defines a separate optical channel. The optic array may be mounted to an imager array that includes a focal plane for each of the optical channels, where each focal plane includes an array of pixels or sensor elements configured to capture an image. When the optic array and the imager array are combined with sufficient precision, the array camera module can be utilized to capture image data from multiple images of a scene that can be read out to a processor for further processing, e.g. to synthesize a high resolution image using super-resolution processing. For example, each of the cameras in an array camera module can capture image data of a scene reflecting a sub-pixel shifted view of the scene - i.e. relative to the corresponding image formed by at least one other camera (e.g. the lens stack of each camera can have a field-of-view that is shifted with respect to the field-of-view of each other camera so that each shift includes a sub-pixel shifted view of the scene); hence, the aggregated image data can embody sufficient sampling diversity to enable the implementation of super- resolution processes that can be used construct an enhanced image of the scene using the aggregated image data. In other words, each lens stack can form an image of a scene onto a corresponding focal plane, and thereby generate image data, from a slightly different viewpoint relative to an image formed by each of the other lens stacks, such that the images formed of the scene by each of the lens stacks contain non- redundant information of about the scene. Hence, the non-redundant information can be used in the construction of a super-resolved image.
[00100] In many embodiments, the optics in an array camera module are designed to be able to resolve images to a sufficient extent such that the super-resolution processes can be implemented. For example, in many instances, the MTF of the optics is able to resolve variation in intensity at the spatial resolution of the image that is to result from implemented super-resolution processes (e.g. as opposed to the spatial resolution of
the image that can be formed by a single respective camera within an array camera module).
[00101] It should be noted that although 'arrays of lens stacks' and 'arrays of focal planes' are referenced, it is not meant to be suggested that such arrays are necessarily monolithic structures. In many instances a plurality of distinct lens stacks are disposed relative to one-another to form a 1 xN array of lens stacks; similarly, in many instances a plurality of distinct focal planes are disposed relative to one-another to form a 1 xN array of focal planes. In general, a plurality of lens stacks, and a plurality of focal planes can be adjoined in any suitable way to construct a 1 xN array camera module in accordance with embodiments of the invention. In some instances, the focal planes and/or lens stacks are embodied within monolithic structures.
[00102] An exploded view of an array camera module formed by combining a lens stack array with a monolithic sensor including an array of focal planes in accordance with an embodiment of the invention is illustrated in FIG. 3. The array camera module 300 includes an optic array 310 including 1 x N distinct lens stacks forming N separate apertures and an imager array 330 that includes a 1 x N array of focal planes 340. Each lens stack 320 in the optic array 310 creates an optical channel that resolves an image on one of the focal planes 340 on the imager array 330. Each of the lens stacks 320 may be of a different type. In several embodiments, the optical channels are used to capture images of different portions of the wavelength of light spectrum (e.g. using color filters, located either within the lens stack or on the sensor) and the lens stack in each optical channel is specifically optimized for the portion of the spectrum imaged by the focal plane associated with the optical channel.
[00103] In many embodiments, the array camera module 300 includes lens stacks 320 having one or multiple separate optical lens elements axially arranged with respect to each other. Optic arrays of lens stacks 310 in accordance with several embodiments of the invention include one or more adaptive optical elements that can enable the independent adjustment of the focal length of each lens stack and/or later shifting of the centration of the refractive power distribution of the adaptive optical element. The use of adaptive optical elements is described in U.S. Patent Application No. 13/650,039,
entitled "Lens Stack Arrays Including Adaptive Optical Elements", filed October 1 1 , 2012, the disclosure of which is incorporated by reference herein in its entirety.
[00104] In several embodiments, the array camera module employs wafer level optics (WLO) technology. WLO is a technology that encompasses a number of processes, including, for example, molding of lens arrays on glass wafers, stacking of those wafers (including wafers having lenses replicated on either side of the substrate) with appropriate spacers, followed by packaging of the optics directly with the imager into a monolithic integrated module. The WLO procedure may involve, among other procedures, using a diamond-turned mold to create each plastic lens element on a glass substrate. More specifically, the process chain in WLO generally includes producing a diamond turned lens master (both on an individual and array level), then producing a negative mold for replication of that master (also called a stamp or tool), and then finally forming a polymer replica on a glass substrate, which has been structured with appropriate supporting optical elements, such as, for example, apertures (transparent openings in light blocking material layers), and filters. Although the construction of lens stack arrays using WLO is discussed above, any of a variety of techniques can be used to construct lens stack arrays, for instance those involving precision glass molding, polymer injection molding or wafer level polymer monolithic lens processes.
[00105] Although certain array camera module configurations have been discussed above, any of a variety of array camera modules that utilize lens stacks and focal planes may be implemented in accordance with embodiments of the invention. One- dimensional array camera modules are discussed below.
ONE-DIMENSIONAL ARRAY CAMERA MODULES
[00106] In many embodiments, one-dimensional (or 1 x N) array camera modules are utilized in the construction of array cameras. One-dimensional array camera modules can provide a number of benefits. For instance, one-dimensional array camera modules can enable the construction of array cameras having distinctly thin form factors. Such array cameras may be useful in a host of applications. For example, array cameras having a thin form factor may be incorporated within the bezel of a consumer electronics
device such as a laptop, a tablet, or a smart phone, and may further be incorporated within a pair of eye glasses.
[00107] Additionally, array cameras that incorporate one-dimensional array camera modules are advantageous insofar as they may require less processing and/or memory requirements as compared to two-dimensional (or M x N) array cameras. For example, array cameras typically employ a parallax detection and correction process in order to facilitate the imaging of a scene. Generally, the process is meant to address the fact that the relative positioning of objects in a scene may appear to vary from the respective viewpoints of different cameras within an array camera module. In two-dimensional array cameras, this technique can be processor intensive and involve significant data storage requirements related to searches for corresponding pixels along epipolar lines (other than just horizontal or vertical) between cameras located in different rows and/or columns within the array camera module. Array camera modules typically pass image data to a processor by starting with image data captured by pixels in a first row of a focal plane and then advancing to the next row of pixels and reading out image data from pixels within the next row of pixels. The read out of image data from pixels within a focal plane can also be interspersed with the readout of image data from pixels within other focal planes. Note that with this technique, because image data is being passed to the processor along the rows of the focal planes, searches for corresponding pixels along vertical or diagonal epipolar lines, for example during a parallax detection and correction process of a two-dimensional array camera, involve the processor storing substantial amounts of image data across multiple rows of image data captured by a focal plane. In other words, whereas a parallax detection and correction process may be employed along the 'row' direction as soon as the image data from a respective row of focal planes has been read out to a processor, the parallax detection and correction process along the column direction cannot be employed until multiple rows of image data has been read out to the processor. Consequently, image data across multiple rows of pixels must be stored in order to complete parallax detection and correction processes. This may result in larger storage requirements that may be prohibitive of a system-on-a-chip (SOC) type solution, e.g. where the parallax disparity resolution is built into the imager array. However, because one-dimensional array cameras do not
necessarily employ parallax correction and detection processes in two directions, the processing and/or memory requirements can be substantially reduced. Thus, with lesser processing and/or memory requirements, system-on-a-chip (SOC) type solutions may be enabled.
[00108] Additionally, one-dimensional array camera modules may provide greater manufacturing yield as compared with two dimensional array camera modules, because one-dimensional array camera modules may have less cameras. Generally, the more cameras an array camera module has, the more difficult it is to directly manufacture because it is more likely to have faulty sensors and/or faulty lens stacks.
[00109] A 1 x 5 array camera module in accordance with embodiments of the invention is illustrated in FIG. 4A. In particular, the array camera module includes a central narrow spectral band green camera (G), adjacent narrow spectral band blue cameras (B), and periphery narrow spectral band red cameras (R). Color filters may be employed to achieve the respective narrow spectral band cameras. The color filters may be located either within the lens stack or on the sensor. A narrow spectral band green camera may be centrally placed to accommodate the fact that humans are most sensitive to green light. Narrow spectral band red and blue cameras may be placed on either side of the central narrow spectral band green camera - this configuration may counteract any occlusion that may occur as a result of any obstructing foreground objects. For example, in the case of an obstructing foreground object, areas of the scene immediately surrounding the foreground object as seen by the central camera may not be seen by the cameras on one of the two sides of the central green camera. However, if both narrow spectral band red and blue cameras are placed on either side of the central green camera, color imaging data can be obtained from the scene irrespective of such obstruction caused by the foreground object, and uniform spectral coverage is thereby provided. FIG. 4B is similar to FIG. 4A except that the narrow spectral band red cameras are adjacent to a central narrow spectral band green camera, and narrow spectral band blue cameras enclose the configuration. Note that although two particular configurations of 1 x 5 array camera modules are illustrated, any number of configurations may be employed all in accordance with embodiments of the invention. For example, in some embodiments near-IR cameras (N), which facilitate the
imaging of scenes with low-lighting, may be employed, and in a number of embodiments, full visual spectrum cameras (P) are employed. Note that where full visual spectrum cameras are employed, Bayer filters, which are typically implemented on the sensor, may be utilized to obtain color information.
[00110] By increasing the number of a particular type of narrow spectral band camera (e.g. Green), super-resolution processes can be employed to greater effect. A 1 x 7 array camera module in accordance with embodiments of the invention is illustrated in FIGS. 5A - 5C. As illustrated, a 1 x 7 array camera module may employ more narrow spectral band green cameras than narrow spectral band blue or narrow spectral band red cameras. This may be to accommodate the fact that humans are most sensitive to green light. In the illustrated embodiments, the array camera module includes a central narrow spectral band green camera and periphery narrow spectral band green cameras, and narrow spectral band red and blue cameras. The cameras may be symmetrically distributed or they may be asymmetrically distributed. In the embodiments illustrated in FIGS. 5A and 5B, the narrow spectral band cameras are symmetrically distributed. In the embodiment illustrated in FIG. 5C, the narrow spectral band cameras are asymmetrically distributed. The inclusion of multiple red and blue cameras uniformly distributed around the central green camera reduces the likelihood of color artifacts related to occlusions by foreground objects. The presence of multiple green cameras in an array having sub-pixel shifted views of the scene to provide sampling diversity enables the application of super-resolution processes to the captured image data to recover a higher resolution image of the scene. As before, although three particular configurations of 1 x 7 array camera modules are illustrated, any number of configurations may be employed all in accordance with embodiments of the invention. For example, in some embodiments near-IR cameras may be employed, and in a number of embodiments, full visual spectrum cameras are employed. As before, where full visual spectrum cameras are employed, Bayer filters may be utilized to obtain color information.
[00111] A 1 x 9 array camera module in accordance with embodiments of the invention is illustrated in FIGS. 6A - 6F. A 1 x 9 array camera module may be more preferable than either a 1 x 7 array camera module or a 1 x 5 array camera module
since it provides more image data. As before, a 1 x 9 array camera module may employ more narrow spectral band green cameras than narrow spectral band blue or narrow spectral band red cameras. The inclusion of multiple red and blue cameras distributed around the central green camera reduces the likelihood of color artifacts related to occlusions by foreground objects. The presence of multiple green cameras in an array having sub-pixel shifted views of the scene to provide sampling diversity enables the application of super-resolution processes to the captured image data to recover a higher resolution image of the scene. Also as before, although six particular configurations of 1 x 9 array camera modules are illustrated, any number of configurations may be employed all in accordance with embodiments of the invention. For example, in some embodiments, narrow spectral band green cameras are not disposed along the periphery of the array camera module.
[00112] Although particular one-dimensional array camera modules have been discussed, an array camera module with any number of cameras may be implemented in accordance with embodiments of the invention. For instance, 1 x 4 array camera modules and 1 x 5 array camera modules may be implemented. Sub-array modules that may be used to construct one-dimensional array camera modules are discussed below.
SUB-ARRAY MODULES
[00113] Much of the discussion above describes the construction of array cameras using a single monolithic array camera module. In many embodiments, sub-array modules are used in the construction of array cameras. Sub-array modules may be configured to interface with other sub-array modules so that data can pass between the sub-array modules, thereby enabling a processor to interact with multiple coupled sub- array modules via an interface with one of the sub-array modules. In this way, sub-array modules can couple with other sub-array modules to enable the fabrication of array cameras of any number of specified dimensions and characteristics. In many embodiments, sub-array modules do not couple with one-another, but instead interact directly or indirectly (e.g. via a bus) with a receiving device (e.g. a processor). Accordingly, sub-array modules of this variety can also enable the modular construction of an array camera of any number of specified dimensions and characteristics.
[00114] The use of sub-array modules in the construction of array cameras can provide a number of benefits. For example, the use of sub-array modules to construct array cameras can improve manufacturing yield relative to the direct fabrication of an array camera module. In particular, although one-dimensional array camera modules may be beneficial in numerous applications, their manufacture can be challenging. Specifically, components for one-dimensional array cameras (e.g. the lenses and the corresponding sensor) are typically manufactured on wafers, but the elongated nature of the components may not be conducive to optimizing wafer space. In many instances, in the manufacture of a one-dimensional lens array, the periphery of the wafer used in the manufacture may contain significant unused space that, because of the elongated shape of a lens array, cannot accommodate further lens arrays. In other words, wafers are may be more efficient in the manufacture of components that are more 'square' in shape than 'elongated.' However, sub-array modules that are used in the construction of an array camera module may be less elongated than the array camera module. Hence, sub-array modules can better optimize wafer space during manufacture.
[00115] Moreover, the manufacture of sub-array modules is also beneficial since they comprise a relatively fewer number of cameras compared to an array camera module: the more cameras an array camera module has, the more difficult it is to directly manufacture since it is more likely to have a critical number of faulty cameras. Furthermore, the manufacturing processes disclosed in prior U.S. Patent Application Ser. No. 13/050,429 disclosure entitled "Fabrication process for mastering imaging lens arrays" can be more beneficially applied if the array to be generated is smaller like those discussed in this application. The 1 x N master structure, for the sub-array, can be more optimally fine-tuned for homogeneity either by multiple attempts to directly diamond-turn the 1 x N arrays of the template or by multiple attempts to step-and-repeat the 1 x N array of the template from single lens pins before using the final small-variation 1 x N template to fully populate, for example, a 8" wafer scale master. As a result, the array- internal performance variation and in particular BFL-variation can be reduced. Resulting variations from array to array on the full wafer scale master can be compensated by the approach presented under the method described above.
[00116] Moreover, array camera modules constructed from sub-array modules may be further advantageous in that each individual sub-array module may incorporate custom spacers to counteract back focal length variation. U.S. Patent Application Ser. No. 61/666,852 entitled "Systems and Methods for Manufacturing Camera Modules Using Active Alignment of Lens Stack Arrays and Sensors" discusses the issues related to back focal length (BFL) misalignment in the construction of array camera modules, and is hereby incorporated by reference. In many embodiments, the distribution of the average BFL for a 1 x N sub-array module fabricated in a wafer stack is determined over a sufficient number of stacks to establish the repeatable array-average BFL variation. A spacer wafer may then be machined with steps in thickness that correspond to the pattern of the average-BFL over the wafer stack, and the spacers may thereafter be incorporated into the sub array module. The standard deviation of the BFL of sub- array modules within a wafer stack is expected to be small given the relatively small number of cameras in a sub-array module; accordingly, the incorporation of the customized spacers into the sub-array modules is expected to result in sufficient focusing.
[00117] A sub-array module architecture in accordance with embodiments of the invention is illustrated in FIG. 7A. The sub-array module 700 includes a focal plane array core 702 that includes a 1 x 3 array of focal planes 704 and all analog signal processing, pixel level control logic, signaling, and analog-to-digital conversion circuitry. Although a 1 x 3 array of focal planes is illustrated, any number of focal planes can be used in accordance with embodiments of the invention. The sub-array module includes lens stacks 706, and the combination of a lens stack 706 and its corresponding focal plane 704 can be configured to implement any type of camera including but not limited to narrow spectral band red cameras, narrow spectral band blue cameras, narrow spectral band green cameras, near-IR cameras, and full visual spectrum cameras. Bayer-filters may be employed to facilitate imaging. The sub-array module may utilize focal plane timing and control circuitry 708 that is responsible for controlling the capture of image information using the focal plane's constituent pixels. In a number of embodiments, the focal plane timing and control circuitry 708 provides flexibility of image information capture control which enables features including, but not limited to,
high dynamic range imaging, high speed video, and electronic imaging stabilization. The focal plane timing and control circuitry can have inputs 720 and outputs 722 related to the timing of image capture, so that the sub-array module timing can be controlled by an external device (e.g. a processor, or alternatively another sub-array module). In various embodiments, the sub-array module 700 includes power management and bias generation circuitry 710. The power management and bias generation circuitry 710 provides current and voltage references to analog circuitry such as the reference voltages against which an ADC would measure the signal to be converted against. In many embodiments, the power management and bias circuitry 710 also includes logic that turns off the current/voltage references to certain circuits when they are not in use for power saving reasons. In several embodiments, the imager array includes dark current and fixed pattern (FPN) correction circuitry 712 that increases the consistency of the black level of the image data captured by the imager array and can reduce the appearance of row temporal noise and column fixed pattern noise. In several embodiments, each focal plane includes reference pixels for the purpose of calibrating the dark current and FPN of the focal plane and the control circuitry can keep the reference pixels active when the rest of the pixels of the focal plane are powered down in order to increase the speed with which the imager array can be powered up by reducing the need for calibration of dark current and FPN. In many embodiments, the sub-array module includes focal plane framing circuitry 714 that packages the data captured from the focal planes into a container file and can prepare the captured image data for transmission. In several embodiments, the focal plane framing circuitry 714 includes information identifying the focal plane and/or group of pixels from which the captured image data originated. In a number of embodiments, the sub-array module 700 also includes an interface for transmission and reception of data to and from external device(s). For example, the interface can allow for the transmission and reception of image data. In the illustrated embodiment, the interface is a MIPI CSI 2 output interface supporting four lanes that can support read-out of video at 30 fps from the imager array and incorporating interface control circuitry 716, and two sets of data input/output interface circuitry 718. In the illustrated embodiment, each set of interface circuitry is capable of both sending and receiving data. The interface circuitry, the
interface control circuitry, and the focal plane timing and control inputs/outputs can allow the sub-array module to be controlled by a processor (either directly or indirectly), and/or can also allow the sub-array module to receive/transmit captured image data. Typically, the bandwidth of each input/output lane is optimized for the total number of pixels in the imager array and the desired frame rate. The input/output interface circuitry is configured to interface with any receiving device such as another sub-array module or a processor. Note that although the illustrated embodiment depicts a MIPI CSI 2 protocol, any interface protocol may be used including a Standard Mobile Imaging Architecture ("SMIA") format. The use of various interfaces including the MIPI CSI 2 interface to transmit image data captured by an array of imagers within an imager array to an external device in accordance with embodiments of the invention is described in in U.S. Patent Application Serial No. 13/470,252, cited to and incorporated by reference above. The sub-array module may also include pins that can be used to establish a unique slave address for the sub-array module in the case where the sub-array module interfaces with a master device (e.g. a processor, or a master sub-array module) via a bus as discussed below. In this way, each slave device can be independently controlled by the master device.
[00118] A sub-array module in accordance with several embodiments of the invention is illustrated in FIG. 7B. The sub-array module 750 is similar to that seen in FIG. 7A, except that it does not include two sets of interface circuitry that allow both the transmission and reception of data; instead the illustrated embodiment depicts a sub- array module that includes receive interface circuitry 752 configured to receive image data from another sub-array module for forwarding, and transmit interface circuitry 754 configured to transmit forwarded image data and image data captured by the sub-array module. Such a design may be more efficiently manufactured.
[00119] As alluded to above, in many embodiments, sub-array modules are implemented that are not required to couple with other sub-array modules; instead they each interface - either directly or indirectly - with a receiving device, such as a processor, and thereby provide image data. As can be appreciated, any suitable way for transmitting the data can be implemented. For example, image data can be transmitted in parallel, or it can be transmitted in a serial fashion. In many embodiments, sub-array
modules are configured to output image data to a bus; subsequently, the image data carried by the bus (e.g. from each of many sub-array modules) can be processed into a single MIPI output that can be more easily handled by a receiving device. The image data can be transmitted to the bus in a parallel fashion, or as serial data, e.g. via low voltage differential signaling. Additionally, any suitable I/O device may be used to relay image data to a receiving device, not just a conventional bus. In this way, sub-array modules can be implemented that do not have to have, for example, distinct MIPI processing circuitry; instead, the processing of image data from many sub-array modules into a single MIPI output can be accomplished separately and more efficiently. Accordingly, the manufacture of sub-array modules can become less intricate, and their manufacturing yield may increase as a result. Further, with this modular construction, I/O devices can be easily swapped if desired. Although a particular architecture is described above, any suitable architecture can be implemented in accordance with embodiments of the invention.
[00120] Although particular sub-array modules have been illustrated and discussed, any of a variety of sub-array modules that can allow for transmission and reception of data may be implemented in accordance with embodiments of the invention. For example, 1 x 4, 1 x 2, and even 1 x 1 sub-array modules may be implemented. Furthermore, 2-dimensional sub-array modules may also be implemented in accordance with embodiments of the invention; for example 2 x 3, 2 x 2, and 3 x 3 sub- array modules may be implemented. Two-dimensional sub-array modules may be used to construct two-dimensional array camera modules. Sub-array module lens configurations and the construction of one-dimensional array camera modules using sub-array modules are discussed below.
SUB-ARRAY MODULE CONFIGURATIONS AND THE CONSTRUCTION OF ONE- DIMENSIONAL ARRAY MODULES
[00121] Sub-array modules may include cameras arranged in a variety of configurations in accordance with embodiments of the invention. The exact configurations employed in sub-array modules depend on the particular design of the array camera to be formed. For example, in the case where a GNRBGBRNG 1 x 9 array
camera is desired (like the one illustrated in FIG. 6E), three 1 x 3 sub-array modules may be used to form the corresponding array camera module having the following respective camera arrangement configurations: GNR, BGB, and RNG. FIGS. 8A-8K depict ten examples of sub-array module configurations that are similar to those shown in FIG. 7B in accordance with embodiments of the invention. Although ten examples are provided in FIGS. 8A-8K, any number of configurations of sub-array modules using any of a variety of color filter patterns may be implemented in accordance with embodiments of the invention. The sub-array modules 800 are illustrated as having corresponding interface circuitry 802, represented by arrows. The direction of the arrows is meant to indicate the direction in which image data is passed when the interface circuitry is operational.
[00122] The direction in which image data is passed in a sub-array module is configurable in accordance with many embodiments of the invention. For instance, a BGR sub-array module may be reconfigured so that it acts as a RGB sub-array module. FIG. 9 illustrates how a BGR sub-array module may be reconfigured to act as a RGB sub-array module. In particular, the BGR sub-array module 900 may be rotated 180° 902, and its corresponding interface circuitry may be reconfigured 904 such that the transmission/reception protocols in the interface circuitry are reversed. Where sub- array modules are rotated 180° the data read from the sub-array module can include a flag and/or additional data indicating the orientation of the sub-array module to enable a processor to map the relative position of pixel addresses to corresponding locations in other cameras in an array camera. Alternatively, in the case where a BGR sub-array module is mounted on a printed circuit board (PCB), the BGR sub-array module may be rotated 180° and positioned on a PCB (or laminated chip carrier or other similar such interconnector), and the configuration of the PCB (or laminated chip carrier or other similar such interconnector) may invert the routing of the data transmitted to/from the sub-array module, such that the sub-array module acts as a RGB sub-array module. Of course, the above description does not apply only to 1 x 3 BGR sub-array modules; the direction in which data is passed in any sub-array module may be reconfigured in accordance with embodiments of the invention.
[00123] Sub-array modules may be coupled to form an array camera module in accordance with embodiments of the invention. In particular, sub-array modules may be coupled via their respective interface circuitry such that data may be passed from one sub-array module to the coupled sub-array module. FIGS. 10A-10C illustrate the construction of three respective 1 x 9 array camera modules using three 1 x 3 sub-array modules. For example, FIG. 10A illustrates a GNRBGBRNG array camera module 1000 made from a GNR sub-array module 1002, a BGB sub-array module 1004, and a RNG sub-array module 1006. Note that data received by one sub-array module can of course be transmitted to another sub-array module. As data is transmitted, a respective sub- array module can include within the transmission information regarding the type of data and its origination and/or the orientation of the sub-array module within the array (i.e. standard or inverted/rotated). For example, where the BGB sub-array module 1004 transmits data to the RNG sub-array module 1006, the BGB can also transmit information regarding what type of data is being transmitted - e.g. image data - and where it originated from - e.g. which pixel of which focal plane of which sub-array module (e.g., the GNR sub-array module or the BGB sub-array module itself). Generally, any type of information can be transmitted between sub-array modules that facilitates their coupling. The RNG sub-array module 1006 can read out the data to an external device. For example, the GNR sub-array module 1002 can transmit image data to the BGB sub-array module 1004, which can then transmit image data (including the image data received from the GNR sub-array module) to the RNG sub-array module 1006; the RNG sub-array module 1006 may then read out image data (including the image data received from the BGB sub-array module, which itself includes image data received from the GNR sub-array module) to an external device. Additionally, the manner in which the sub-array modules interface with each other and with a receiving device may be different. For example, the manner in which the RNG sub-array module 1006 interfaces with a receiving device may be in accordance with the MIPI interface format, whereas the manner in which the GNR sub-array module 1002, the BGB sub- array module 1004, and the RNG sub-array module 1006 interface with one another in a different manner, e.g., via simple analog voltages or serial interfaces.
[00124] The array camera module 1000 can couple with a receiving device, e.g. a processor, such that the receiving device can synchronize the capture of images from each of the sub-array modules. In some embodiments, each of the sub-array modules has inputs and outputs that can be used to control the respective sub-array module's internal timing engine, and that can allow a processor to synchronize the capture of images. A processor can thus provide a driving signal to each of the sub-array modules that synchronizes the capture of images of the focal planes in the sub-array modules. For example, the processor can provide the signal via a bus-type architecture, where the processor is set as a master, and each of the sub-arrays is set as a slave. The processor can also provide the driving signal to a directly coupled sub-array module, and the sub-array module can then relay the driving signal to an adjacent sub-array module, and this relaying process can continue until each sub-array module is provided with a driving signal. Thus, as each of the sub-array modules is provided with the driving signal, the capture of images by the focal planes in the sub-array module can be synchronized. In many embodiments, the processor does not provide a driving signal to each sub-array module; instead, the processor provides a driving signal to a master sub-array module. The master sub-array module can then controls the slave sub-array modules so that the capture of images from the cameras of the sub-array modules is synchronized.
[00125] The driving signal can constitute a 'horizontal sync pulse' and a 'vertical sync pulse' to help facilitate the precise capture of image data. For example, when the focal planes capture image data, the image data may be captured by the pixels of the focal plane by advancing along the rows of pixels of the focal plane - i.e. image data is captured by a first row of pixels in a particular direction (e.g. left-to-right), then image data is captured by a next row of pixels, etc. Thus, a constituent horizontal sync pulse within a driving signal can synchronize the sampling and readout of a particular row of pixels within a focal plane (whichever row the vertical timing controller is pointing to at that time). The vertical sync pulse indicates to a vertical timing controller associated with a focal plane that the vertical timing controller should start at the beginning of the frame (i.e. row zero). In the case where the sub-array modules are being used to capture video, the vertical sync pulse can synchronize the capture of individual frames from
each sub-array module within the video. In many embodiments, one of the sub-arrays is configured as a master that outputs the horizontal and vertical sync pulses to the other sub-arrays in the array cameras, which are designated as slaves synchronized to the control signals issued by the master sub-array. Although, a particular form of driving signal has been described, any driving signal can be used to synchronize the capture of image data in accordance with embodiments of the invention. In addition to providing inputs for receiving a 'horizontal sync pulse' and a 'vertical sync pulse' the sub-array modules can also include outputs that provide information concerning the state of the internal timing engine of the sub-array camera module. In many embodiments, the timing information is also provided using a 'horizontal sync pulse' and a 'vertical sync pulse'. Similarly, although the construction of particular array camera modules is illustrated in FIGS. 10A-10C, any number of array camera modules can be constructed using sub-array modules in accordance with embodiments of the invention. For example, array camera modules of any length may be constructed using sub-array modules in accordance with embodiments of the invention.
[00126] Furthermore, as mentioned above, in many embodiments, sub-array modules do not couple with one another, and instead interface - either directly or indirectly - with a receiving device. For example, FIG. 1 1A illustrates a 1 x 9 array camera fabricated from three 1 x 3 sub-array modules that do not couple with one another in accordance with embodiments of the invention. In particular, the array camera 1 100 corresponds with that seen in FIG. 10A, except that each sub-array module, 1 102, 1 104, and 1 106, outputs image data to a bus 1 108, and thereby transmits image data to a processor 1 108. In a number of embodiments, intermediary circuitry is used to convert received image data to a single MIPI output, which is then transmitted to a processor 1 1 10. Thus, array cameras can be implemented whereby sub-array modules do not couple with one another.
[00127] In many embodiments, multiple I/O devices are used in adjoining multiple sub-array modules. For example, Fig. 1 1 B illustrates a 1 x9 array camera similar to that seen in FIG. 1 1 A, except that each sub-array module is associated with a respective I/O device, that itself interfaces with an I/O block which processes the received image data and provides an output to a processor. In particular, a 1 x9 array camera 1 150 includes
three sub-array modules 1 152, 1 154, and 1 156, that are each affiliated with a respective I/O device, 1 158, 1 160, and 1 162. Accordingly, the respective I/O devices interface with a separate I/O block 1 164 that can aggregate the image data and thereby provide a single MIPI output. The I/O block 1 164 can provide the output in a MIPI container to a processor 1 166 for further processing. As this architecture includes multiple I/O devices, each affiliated with certain cameras, image data may be processed more effectively and efficiently. For example, using this architecture, the length of circuit traces can be reduced, and correspondingly, the signal to noise ratio can be enhanced. Consequently, the increased efficiency can help mitigate a host of issues that may otherwise be present including those relating to: image data synchronization; power consumption; and cross-talk. Additionally, as multiple I/O devices are used, they each may be adapted to have a smaller footprint, and can thereby facilitate the implementation of an advantageous physical layout of the sub-array modules. As can be appreciated, each of multiple I/O devices can be affiliated with any number of cameras in accordance with embodiments of the invention. For example, in many embodiments, 2 I/O devices are incorporated whereby one I/O device is affiliated with 6 cameras, and the other I/O device is affiliated with 3 cameras. The I/O devices may then interface with a separate I/O block that receives image data, aggregates it, and outputs it to a processor for further processing. Additionally, as will be elaborated on below, two-dimensional sub- array modules may also be implemented in accordance with embodiments of the invention; accordingly, I/O devices may also be affiliated with any number of cameras in an arrangement of two-dimensional sub-array modules in accordance with embodiments of the invention. Generally, I/O blocks may be affiliated with cameras within sub-array modules of any dimensions in accordance with embodiments of the invention.
[00128] Note that sub-array modules of different types may be coupled to form array camera modules. For example, 1 x 3 sub-array modules may be combined with 1 x 2 sub-array modules, 1 x 4 sub-array modules, or even 1 x 1 sub-array modules. This flexibility is advantageous insofar as it can alleviate unwieldy manufacturing processes. For instance, the manufacture of sub-array modules that include near-IR cameras (e.g. a GRN sub-array module as shown in FIG. 8D) may require the imposition of an IR cut-
off filter (that can be a structured dielectric coating), which may then be selectively removed in the areas of the sub-array module where a near-IR camera is desired (e.g. the N camera of a GRN sub-array module). Subsequently, an organic near-IR pass filter or another multilayer dielectric coating can then be applied at the position of the near-IR channels. This manufacturing process may be cumbersome. Thus, in accordance with embodiments of the invention, a 1 x 1 near-IR sub-array module may be coupled with another sub-array module of any type, thereby resulting in an array camera module that includes a near-IR camera. This technique may be advantageous in that cumbersome manufacturing processes may be avoided. For example, instead of forming sub-array modules that include near-IR cameras and color cameras, 1 x 1 sub-array modules that include near-IR cameras can be produced separately on a single wafer that does not include any other color channels and later coupled with a sub-array module that includes color cameras constituting different color channels. Consequently, the step of selectively removing an IR cut-off filter and then applying an organic near-IR pass filter or other dielectric coating may be avoided. Thus, for example a 1 x 2 GR sub-array module may be coupled to a 1 x 1 near-IR camera to form a 1 x 3 GRN array camera module in accordance with embodiments of the invention.
[00129] Similarly, the particular lens fabrication technique employed in the fabrication of a sub-array module (e.g. WLO manufacturing, precision glass molding, or polymer injection molding) may be selected to accommodate the particular sub-array module's functionality and/or its manufacturing process. Of course, any number of sub-array modules, which can each be of different types, can be coupled to form an array camera module in accordance with embodiments of the invention. More generally, as an array camera module can be formed from different types of sub-array modules that can be coupled using a variety of techniques in accordance with embodiments of the invention, the constituent sub-array modules may be designed to accommodate any number of different manufacturing processes.
[00130] Moreover, sub-array modules may be combined using a single substrate that includes interconnects. For example, sub-array modules may be coupled to a substrate that has interconnects, such that when the sub-array modules are coupled to the substrate, the sub-array modules can thereby interface with each other and/or with a
receiving device (e.g. a processor) via the substrate's interconnects. The interconnection of three sub-array modules coupled to a glass substrate in accordance with an embodiment of the invention is illustrated in FIG. 12. In the illustrated embodiment, three sub-array modules are coupled to a glass substrate that includes interconnects, thereby allowing the sub-array modules to interface with one another and with a receiving device. Specifically, the array camera module 1200 is constructed from a glass substrate 1202 that includes interconnects 1204, upon which sub-array modules 1206 can couple. The sub-array modules can include electrical pads to couple with the glass substrate's interconnects. The electrical pads can include the same interface functionality discussed above with respect to FIGS. 7A and 7B (e.g. interface circuitry 718, 752, 754, inputs/outputs, 720, 722). The interconnects 1204 can allow the sub- array modules to interface with one another and with a receiving device such as, but not limited to, an appropriately configured microprocessor and/or an application specific device that is configured to read in the serial data from the independent sub-array modules and synthesize a cohesive output data stream (e.g. a MIPI serial output data stream). As can be appreciated, the interconnects can be configured so as to allow each sub-array module to interface - either directly or indirectly - with a receiving device such that each sub-array module can provide image data to a receiving device without having to couple with another sub-array module. Thus, for example, the array camera seen in FIG. 1 1 can be constructed using a single substrate. Additionally, where a glass substrate is used, the lenses of a sub-array module may also be bonded to the glass substrate. For example, the sensors that include the sub-arrays of focal planes may be coupled with the glass substrate on one side of it that includes interconnects, and the corresponding lenses that combine with the sensors to form an imager array may be bonded to the other side of the glass substrate such that the complete functionality of the sub-array module is achieved. Because the glass substrate is optically transparent, the sub-array module can still function even though the glass substrate lies between the sensor dies and the corresponding lenses. In many embodiments, the lens for each sensor in a sub-array module can be independently mounted to the glass substrate. In a number of embodiments, arrays of lens stacks can be mounted to the glass substrate and the number of lens stacks in the array need not
correspond with the number of focal planes on the sensors mounted to the glass substrate.
[00131] Using a substrate to facilitate the coupling of sub-array modules can be advantageous in that the specific configuration of the substrate can govern the spacing between the sub-array modules, and the spacing between sub-array modules can control the array camera module's imaging ability. Specifically, the manner in which the interconnects are situated can govern the sub-array module spacing. Hence, sub-array modules that are coupled need not be within immediate proximity of one another when a substrate is used to enable their coupling. Although much of the discussion above refers to the use of glass substrates, any of a variety of optically transparent substrate materials can be utilized as appropriate to the requirements of specific applications in accordance with embodiments of the invention. Furthermore, substrates in which openings are formed to permit transmission of light through the substrate can also be utilized including (but not limited to) ceramic substrates in which through holes are formed. Thus, for example, a single sensor or multiple sensors can be fixed to one side of the ceramic carrier to form the focal planes of the array camera module and lens barrels containing lens stacks can be affixed to the other side of the ceramic carrier so that the lens stacks direct light onto the focal planes of the one or more sensors through the openings in the ceramic carrier. In many instances, the ceramic carrier is rigid and has a coefficient of thermal expansion that matches that of the sensor. Thus, the likelihood that mismatches in thermal expansion will result in changes in the alignment between the lens stacks and corresponding focal planes that deteriorate the quality of the images that can be synthesized using the image data captured by the focal planes. U.S. Provisional Patent Application No. 61/904,947 to Mark Rodda et al. discloses the incorporation of ceramic substrates in the context of array cameras, and is hereby incorporated by reference in its entirety.
[00132] One-dimensional array camera modules constructed from sub-array modules may also be coupled to a parallax disparity resolution module in accordance with embodiments of the invention. The parallax disparity resolution module may either a hardware parallax disparity resolution module or may be a software parallax disparity resolution module. FIG. 13A illustrates a 1 x 9 array camera module constructed from
three constituent 1 x 3 sub array modules, where the array camera module 1300 outputs the data to a hardware parallax disparity resolution module 1302. Similarly, FIG. 13B illustrates a 1 x 9 array camera module constructed from three constituent 1 x 3 sub-array modules, where the array camera module 1350 outputs the data to a software parallax disparity resolution module 1352. Either parallax disparity resolution module 1302, 1352 can receive the data and implement processes to detect parallax within image data (using processes similar to, but not limited to, those described in U.S. Provisional Patent Application Serial No. 61/691 ,666) and implement processes to account for the detected parallax in the further processing of the image data.
[00133] Although particular one-dimensional array camera modules constructed from sub-array modules have been described, many other such configurations exist in accordance with embodiments of the invention. Hence, the descriptions and corresponding figures should not be construed as limiting the scope of the invention, and are instead merely illustrative. Two-dimensional array camera modules may also be constructed from sub-array modules in accordance with embodiments of the invention, and this is discussed below.
THE CONSTRUCTION OF TWO-DIMENSIONAL ARRAY CAMERAS USING SUB- ARRAY MODULES
[00134] Sub-array modules may be coupled to form two-dimensional array cameras in accordance with embodiments of the invention. A 3 x 9 two-dimensional array camera constructed from sub-array modules in accordance with embodiments of the invention is illustrated in FIG 14A. In particular nine 1 x 3 sub-array modules are coupled so as to form three array camera module sub-assemblies 1402. Each array camera module subassembly 1402 is then coupled to a parallax disparity resolution module 1404 (either hardware or software). In the illustrated embodiment, an interconnection module interfaces with a processor 1406 and one of the sub-arrays in each of the rows of the camera array to enable communication between the processor and each of the sub- arrays. In other embodiments, the processor is configured to directly interface with multiple sub-arrays, e.g. similar to the arrangement seen in FIG. 1 1 . In several embodiments, each sub-array module is configured to interface with circuitry that
receives image data from each sub-array module and converts the image data to a single MIPI output, which is thereby provided to a processor. Note that in the illustrated embodiment, the three 1 x 9 array camera module sub-assemblies are adjacent to each other such that a 3 x 9 array camera module can be achieved. However, any arrangement may be implemented in order to achieve a two-dimensional array camera module in accordance with embodiments of the invention. In many embodiments, the processor 1406 is made aware of the relative location of the cameras, and uses this information in processing received data.
[00135] In many embodiments, a two-dimensional array camera is formed from sub- array modules where a single sub-array module reads out data to a processor. FIG. 14B illustrates a two-dimensional 3 x 9 array camera where a single constituent sub-array module reads out data to a processor. In the illustrated embodiment, the array camera 1450 is formed from nine 1 x 3 sub-array modules that are coupled, where data from the sub-array modules is read out by a single sub-array module 1452 to a processor 1454, which can then process the image data. Again, in the illustrated embodiment, the sub array modules are arranged such that a 3 x 9 array camera module is achieved. However, as before, any arrangement may be implemented in order to achieve a two- dimensional array camera module in accordance with embodiments of the invention. In many embodiments, the processor 1454 is made aware of the relative location of the cameras, and uses this information in processing received data. As before, the manner in which the sub-array modules interface with one another and with a receiving device may all be different.
[00136] Additionally, similar to before with respect to FIG. 12, sub-array modules may be coupled via a substrate to form an array camera. FIG. 15 illustrates a two- dimensional array camera formed from sub-array modules coupled to a substrate. Specifically, the array camera 1500 includes a glass substrate 1502 with interconnects 1504, sub-array modules 1506, and a processor 1508. As before, the sub-array modules 1506 can connect to the glass substrate 1502 via electrical pads, and as before the imager arrays of a sub-array module 1506 may be coupled to one-side of the glass substrate that includes interconnects 1504, and corresponding lenses may be bonded to the other side of the glass substrate 1502. Again, using substrates to
facilitate the coupling of sub-array modules - either to one another or to independent circuitry - can be advantageous in that the substrate can control the spacing between sub-array modules, and this affects the array camera's imaging ability.
[00137] In constructing an array camera, an array camera module may be patterned with "π filter groups", or alternatively "Pi filter groups." The term Pi filter groups refers to a pattern of narrow spectral band cameras within the array camera module. Processes for patterning array cameras with Pi filter groups are described in U.S. Provisional Patent Application Serial No. 61/641 ,164, entitled "Camera Modules Patterned with π Filter Groups", Venkataraman et al. The disclosure of U.S. Provisional Patent Application Serial No. 61/641 ,164 is incorporated by reference herein in its entirety. A single Pi filter group is illustrated in FIG. 16, wherein 5 cameras are configured to receive green light, 2 cameras are configured to receive red light, and 2 cameras are configured to receive blue light. The Pi filter patterns may facilitate the efficient capturing of color image data.
[00138] In many embodiments of the invention, two-dimensional array cameras are constructed using sub-array modules wherein the sub-array modules are arranged such that Pi filter groups are implemented within the array camera. FIGS. 17A and 17B are similar to FIGS. 14A and 14B except that the sub-array modules are configured to implement Pi filter groups.
[00139] Although the above discussion has largely focused on 1 x 3 sub-array modules and their implementation in the construction of array camera modules and array cameras, in many embodiments, sub-array modules have other dimensions. FIGS. 18A-18B illustrate 1 x 4 sub-array modules in accordance with some embodiments. It should be repeated that although only narrow spectral band blue, green and red cameras are illustrated in FIGS. 18A-18B, any type of camera may of course be implemented in sub-array modules in accordance with embodiments of the invention.
[00140] Sub-array modules of any dimension can be used in the construction of array cameras in accordance with embodiments of the invention. FIGS. 19A and 19B illustrate the construction of a 4 x 4 array camera using 1 x 4 sub-array modules in accordance with many embodiments. FIGS. 19A and 19B are similar to FIGS. 14A and 14B except
that 1 x 4 sub-array modules are used to form the array camera. The illustrated embodiment includes an array camera, sub-array module sub-assemblies 1902, an interconnection module 1904, and a processor 1906, 1908. In the illustrated embodiment, Pi filter groups are patterned on the array camera. Similarly, FIGS. 20A- 20D illustrate 1 x 5 sub-array modules, and FIGS. 21A-21 B illustrate the construction of 5 x 5 array cameras using 1 x 5 sub-array modules. The illustrated embodiment includes an array camera 2100, sub-array modules sub-assemblies 2102, an interconnection module 2104, and a processor 2106, 2108. Again, in the illustrated embodiments, Pi filter groups are implemented on the two dimensional array cameras. A particular benefit of utilizing 1 x 5 sub-array modules to build a 5 x 5 array camera module is that the 5 x 5 array camera can be constructed using two different types of 1 x 5 sub-array modules (i.e. GRGRG and BGBGB or GBGBG and RGRGR). Similarly, any square array patterned with Pi filter groups including an odd number of rows and columns can be constructed using only two different types of sub-arrays.
[00141] Furthermore, as alluded to above, two-dimensional sub-array modules may also be implemented to construct two-dimensional array cameras in accordance with embodiments of the invention. For example, FIG. 22 illustrates the construction of a 4x4 array camera using 2x2 sub-array modules. In particular, the 4x4 array camera 2200 is similar to that seen in FIG. 19, except that it includes four 2x2 sub-array modules 2202. In the illustrated embodiment, each sub-array module 2202 interfaces with circuitry 2204 that receives image data from each of the sub-array modules and outputs the aggregated image data to a processor 2206. As can be appreciated from the above discussion, it should be understood that the sub-array modules can provide image data to a processor in any suitable fashion in accordance with embodiments of the invention. For example, in some embodiments, the two-dimensional sub-arrays include interface circuitry that allow them to interface with other sub-array modules, and thereby transmit image data to (and otherwise interact with) a processor. In many instances, modular array cameras include both two-dimensional and one-dimensional sub-array modules. In general, modular array cameras of any dimension can be constructed from one- dimensional and/or two-dimensional sub-array modules in accordance with embodiments of the invention.
[00142] As mentioned previously, 1 x 1 sub-array modules may also be used to construct array cameras, and this is discussed below.
1 x 1 SUB-ARRAY MODULES
[00143] In accordance with many embodiments of the invention, 1 x 1 sub-array modules may be used to construct array cameras. Thus, for example, 1 x 1 sub-array modules may be used to construct either one dimensional array cameras or two- dimensional array cameras. 1 x 1 sub-array modules are similar to the sub-array modules discussed above except that they do not include multiple lens stacks and multiple focal planes. Instead, a 1 x 1 sub-array module includes a single lens stack and a sensor including single focal plane. Accordingly, the above-mentioned techniques regarding constructing array cameras from sub-array modules may also be used to construct array cameras from 1 x 1 sub-array modules. Using 1 x 1 sub-array modules to construct array cameras may confer a host of benefits. For example, Array cameras of any dimension may be constructed using 1 x 1 sub-array modules, and many different types of 1 x 1 sub-array modules may be used in the construction. For example, 1 x 1 sub-array modules that have different F numbers, focal lengths, image sensor formats and/or fields of view, may be used, particularly because slightly different heights of different types of 1 x 1 sub-array modules can be accommodated. Similarly, the different substrates and spacer thicknesses within a lens stack may be accommodated. In many embodiments, these sub-array modules are used to construct array cameras that can provide optical zoom with no moving parts. Array cameras may also incorporate 1 x 1 sub-array modules that are configured for near-IR sensitivity and far-IR sensitivity. Additionally, sub-array modules that implement a time-of-f light camera to provide additional depth information, may also be used in accordance with embodiments of the invention. As already discussed above, 1 x 1 sub-array modules are also beneficial insofar as 1 x 1 sub-array modules of the same type (e.g., near-IR cameras) may be constructed on the same wafer, thereby increasing manufacturing efficiencies.
[00144] In several embodiments, 1 x 1 sub-array modules may be assembled to form an array camera module using a variety of technique appropriate to the specific 1 x 1
sub-array module constructions, including any of the above discussed techniques, in accordance with embodiments of the invention. In some embodiments, the sensor of a 1 x 1 sub-array module is adjoined to a printed circuit board using reflow soldering. Subsequently, the respective lenses of the sub-array module may be adjoined to the sensor. Note that the lenses may be affixed to the sensor using the active alignment processes U.S. Patent Application Ser. No. 61/666,852. In a number of embodiments, the sensors of a 1 x 1 sub-array module are bonded to a glass substrate that includes interconnects that allow the sub-array modules and other components to interface. The corresponding lenses may also be bonded to the glass substrate. This technique is similar to that already described above.
[00145] In numerous embodiments, each sub-array module is first independently formed such that it is inclusive of the sensor and the lens stack array, and is then reflow soldered to a printed circuit board. In these embodiments, both the lens and the sensor are adapted to be capable of undergoing a reflow soldering process. This method of manufacture may be advantageous insofar as the individual sub-array modules can be evaluated prior to construction of the array camera. It may be further advantageous, as the formed sub-array modules may be easily rearranged to provide different types of array cameras.
[00146] As already alluded to above, one-dimensional array camera modules and two-dimensional array camera modules may be formed from 1 x 1 sub-array modules in accordance with embodiments of the invention. Of course, the particular arrangement of the 1 x 1 sub-array modules will govern whether a one-dimensional or a two- dimensional array camera module is achieved.
[00147] Note that when the individual sub-array modules are assembled to form an array camera, the sub-array modules may be oriented in slightly different directions with respect to one another, for example due to manufacturing tolerances and corrections for alignment. As a result, the epipolar lines of the resulting array camera may deviate with respect to the scanlines of the individual cameras. Consequently, in many embodiments, the array camera includes a processor that can perform an affine transformation in conjunction with parallax disparity resolution, in processing the images provided by the sub-array modules, to resolve the discrepancies in camera orientation.
[00148] In many embodiments, an array camera that is constructed from 1 x 1 sub- array modules also utilizes an external hardware block that can read in serial data from the independent 1 x 1 sub-array modules, and synthesize a cohesive output data stream (e.g. a MIPI serial output data stream) that can be transmitted to a receiving device, e.g. a processor. In a number of embodiments, the external hardware block can interact with the sub-array modules through a custom I2C interface to, for example, command and control the individual sub-array modules. Moreover, in several embodiments, the external hardware block includes sufficient buffer space so that it can read out all the data from the sub-array modules to the receiving device simultaneously. This may improve array camera performance, since it can mitigate any delay that results from the transmission of data to the receiving device. For example, the rolling shutter performance of the array camera may be improved, since it would be governed by the size of a single sub-array module as opposed to the size of the entire array camera. In several embodiments, the external hardware block includes circuitry to encrypt the data being read out from the camera array to enable digital rights management control. In a plethora of embodiments, the external hardware block includes circuitry to compress the data being read out from the camera array to reduce the data bandwidth requirements in the resulting output stream. Although the external hardware blocks described above is discussed in the context of constructing array cameras using 1 x 1 sub-array modules, similar external hardware blocks can be utilized in the construction of array cameras using a variety of sub-array modules including sub-array modules having different dimensions. Furthermore, array camera modules can be constructed using any of a variety of techniques involving fixing sub- array modules of any dimension to a substrate appropriate to the requirements of a specific application in accordance with embodiments of the invention.
[00149] Although the present invention has been described in certain specific aspects, many additional modifications and variations would be apparent to those skilled in the art. For example, sub-array modules of different types (e.g. 1 x 3 and 1 x 4) may be coupled to form an array camera module. It is therefore to be understood that the present invention may be practiced otherwise than specifically described. Thus,
embodiments of the present invention should be considered in all respects as illustrative and not restrictive.
Claims
WHAT IS CLAIMED IS:
1 . A 1 xN array camera module comprising:
a 1 xN arrangement of focal planes, wherein:
N is greater than or equal to 2;
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and a 1xN arrangement of lens stacks, the 1 xN arrangement of lens stacks being disposed relative to the 1 xN arrangement of focal planes so as to form a 1 xN arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein:
each lens stack has a field of view that is shifted with respect to the field- of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
2. The array camera module of claim 1 wherein N is greater than or equal to 3.
3. The array camera module of claim 2, wherein N is 5.
4. The array camera module of claim 3, wherein the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum.
5. The array camera module of claim 4, wherein the green camera is centrally disposed relative to the 1 xN arrangement of cameras.
6. The array camera of claim 5, wherein the lens stack of the green camera is configured to focus light corresponding with the green band of the visible spectrum onto the corresponding focal plane.
7. The array camera of claim 5, wherein a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
8. The array camera module of claim 2, wherein N is 7.
9. The array camera module of claim 8, wherein the 1xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1 xN arrangement of cameras.
10. The array camera module of claim 9, wherein a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
1 1 . The array camera module of claim 2, wherein N is 9.
12. The array camera module of claim 1 1 , wherein the 1 xN arrangement of cameras includes a green camera that is configured to image light corresponding with the green band of the visible spectrum, and that is centrally disposed relative to the 1 xN arrangement of cameras.
13. The array camera module of claim 12, wherein a red camera that is configured to image light corresponding with the red band of the visible spectrum and a blue camera that is configured to image light corresponding with the blue band of the visible spectrum are each disposed on either side of the centrally disposed green camera.
14. The array camera module of claim 1 , wherein the 1 xN arrangement of focal planes is embodied within a monolithic structure.
15. The array camera module of claim 14, wherein the 1 xN arrangement of lens stacks is embodied within a monolithic structure.
16. The array camera module of claim 15, wherein the 1 xN arrangement of focal planes and the 1 xN arrangement of lens stacks are each embodied within the same monolithic structure.
17. The array camera module of claim 1 , wherein at least one camera is embodied within a single sub-array module, the sub-array module comprising:
a 1 xX arrangement of focal planes, wherein:
X is greater than or equal to 1 ;
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1xX arrangement of lens stacks being disposed relative to the 1xX arrangement of focal planes so as to form a 1 xX arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
18. The array camera module of claim 17, wherein the sub-array module further comprises interface circuitry that can allow the sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
19. The array camera of claim 17, wherein the 1 xX arrangement of cameras is embodied within a single monolithic structure.
20. The array camera module of claim 17, wherein N is 9, and X is 3.
21 . The array camera module of claim 19, wherein the 1 x9 arrangement of cameras are embodied within three 1x3 sub-array modules, each 1 x3 sub-array module comprising:
a 1 x3 arrangement of focal planes, wherein:
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and a 1 x3 arrangement of lens stacks, the 1x3 arrangement of lens stacks being disposed relative to the 1 x3 arrangement of focal planes so as to form a 1x3 arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
22. The array camera module of claim 21 , wherein each sub-array module further comprises interface circuitry that can allow the sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
23. The array camera module of claim 17, comprising at least two sub-array modules, wherein each sub-array module comprises:
a 1 xX arrangement of focal planes, wherein:
X is greater than or equal to 1 ;
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and
a 1xX arrangement of lens stacks, the 1 xX arrangement of lens stacks being disposed relative to the 1 xX arrangement of focal planes so as to form a 1xX arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; wherein each of the at least two sub-array modules are adjoined to the interconnects of a single substrate, and can thereby interface with at least one other sub-array module.
24. The array camera module of claim 23, wherein each of the at least two sub-array modules further comprises interface circuitry that can allow the respective sub- array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
25. The array camera module of claim 24, wherein the substrate is optically transparent.
26. The array camera module of claim 25, wherein the substrate is glass.
27. A 1 xX sub-array module comprising:
a 1 xX arrangement of focal planes, wherein:
X is greater than or equal to 1 ;
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and a 1 xX arrangement of lens stacks, the 1xX arrangement of lens stacks being disposed relative to the 1xX arrangement of focal planes so as to form a 1 xX
arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene.
The 1xX sub-array module of claim 27, further comprising interface circuitry that can allow the sub-array module to interface with another sub-array module so that it can at least transmit image data to another sub-array module or receive image data from another sub-array module.
The sub-array module of claim 26, wherein the interface circuitry implements MIPI CSI 2 interface.
A 1 xN array camera comprising:
a 1 xN arrangement of focal planes, wherein:
N is greater than or equal to 2;
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and a 1xN arrangement of lens stacks, the 1 xN arrangement of lens stacks being disposed relative to the 1 xN arrangement of focal planes so as to form a 1 xN arrangement of cameras, each of which being configured to independently capture an image of a scene, where each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and
a processor that is configured to construct an image of the scene using image data generated by the 1 xN array camera module.
An XxY sub-array module comprising:
an XxY arrangement of focal planes, wherein:
X and Y are each greater than or equal to 1
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and an XxY arrangement of lens stacks, the XxY arrangement of lens stacks being disposed relative to the XxY arrangement of focal planes so as to form an XxY arrangement of cameras, each of which being configured to independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and
image data output circuitry that is configured to output image data from the XxY sub-array module that can be aggregated with image data from other sub-array modules so that an image of the scene can be constructed.
32. The XxY sub-array module of claim 31 , wherein X is 1 .
33. The XxY sub-array module of claim 31 , wherein X and Y are each greater than 1 .
34. The XxY sub-array module of claim 31 , wherein the arrangement of cameras are embodied within a single monolithic structure
35. An MxN array camera comprising:
a plurality of XxY sub-array modules, each comprising:
an XxY arrangement of focal planes, wherein:
X and Y are each greater than or equal to 1 ;
each focal plane comprises a plurality of rows of pixels that also form a plurality of columns of pixels; and
each focal plane does not include pixels from another focal plane; and
an XxY arrangement of lens stacks, the XxY arrangement of lens stacks being disposed relative to the XxY arrangement of focal planes so as to form an XxY arrangement of cameras, each of which being configured to
independently capture an image of a scene, wherein each lens stack has a field of view that is shifted with respect to the field-of-views of each other lens stack so that each shift includes a sub-pixel shifted view of the scene; and
image data output circuitry that is configured to output image data from the sub-array module that can be aggregated with image data from other sub- array modules so that an image of the scene can be constructed;
wherein the plurality of XxY sub-array modules define at least some of the cameras in an MxN arrangement of cameras; and
a processor;
wherein the processor is configured to construct an image of the scene using image data generated by each of the sub-array modules.
36. The array camera of claim 35, wherein X is 1 and M is 1 .
37. The array camera of claim 35, wherein the plurality of XxY sub-array modules define an MxN arrangement of cameras.
38. The array camera of claim 35, further comprising circuitry that aggregates the image data generated by each of the sub-array modules into a single MIPI output, and provides the MIPI output to the processor so that the processor can construct an image of the scene.
39. The array camera of claim 35, further comprising a parallax disparity resolution module, wherein the parallax disparity resolution module is configured to receive image data captured by each sub-array module, implement a parallax detection and correction process on the received image data, and output the result for further processing.
40. The array camera of claim 39, further comprising circuitry that converts the output of the parallax disparity resolution module into a single MIPI output, and
provides the MIPI output to the processor so that the processor can construct an image of the scene.
41 . The array camera of claim 40, wherein the parallax disparity resolution module comprises a processor and memory, wherein the memory contains software to configure the processor to act as a parallax disparity resolution module.
42. The array camera of claim 40, wherein the parallax disparity resolution module is a hardware parallax disparity resolution module.
43. The array camera of claim 35, wherein M and N are each greater than or equal to 2.
44. The array camera of claim 35, wherein at least two of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and can thereby output image data through the interconnects.
45. The array camera of claim 44, wherein each of the plurality of sub-array modules are adjoined to the interconnects of a single substrate, and can thereby output image data through the interconnects.
46. The array camera of claim 45, wherein the substrate is optically transparent.
47. The array camera of claim 46, wherein the substrate is glass.
48. The array camera of claim 45, wherein the substrate is ceramic with through- holes that clear the optical path.
49. The array camera of claim 35, wherein at least one sub-array module is embodied within a single monolithic structure.
50. The array camera of claim 35, wherein each sub-array module is embodied within a single respective monolithic structure.
51 . The array camera of claim 35, further comprising:
a plurality of I/O devices, wherein each of the plurality of I/O devices interfaces with at least one camera: and
a separate I/O block that includes circuitry configured to receive image data, aggregate the received image data, and output the aggregated image data to the processor so that the processor can construct an image of the scene; and
wherein each of the plurality of I/O devices interfaces with the I/O block.
52. The array camera of claim 51 , wherein the number of I/O devices equals the number of sub-array modules, and wherein each I/O device interfaces with a corresponding sub-array module.
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Cited By (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8885059B1 (en) | 2008-05-20 | 2014-11-11 | Pelican Imaging Corporation | Systems and methods for measuring depth using images captured by camera arrays |
US9025894B2 (en) | 2011-09-28 | 2015-05-05 | Pelican Imaging Corporation | Systems and methods for decoding light field image files having depth and confidence maps |
US9041824B2 (en) | 2010-12-14 | 2015-05-26 | Pelican Imaging Corporation | Systems and methods for dynamic refocusing of high resolution images generated using images captured by a plurality of imagers |
US9049411B2 (en) | 2008-05-20 | 2015-06-02 | Pelican Imaging Corporation | Camera arrays incorporating 3×3 imager configurations |
US9100586B2 (en) | 2013-03-14 | 2015-08-04 | Pelican Imaging Corporation | Systems and methods for photometric normalization in array cameras |
US9100635B2 (en) | 2012-06-28 | 2015-08-04 | Pelican Imaging Corporation | Systems and methods for detecting defective camera arrays and optic arrays |
US9123118B2 (en) | 2012-08-21 | 2015-09-01 | Pelican Imaging Corporation | System and methods for measuring depth using an array camera employing a bayer filter |
US9124864B2 (en) | 2013-03-10 | 2015-09-01 | Pelican Imaging Corporation | System and methods for calibration of an array camera |
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US9210392B2 (en) | 2012-05-01 | 2015-12-08 | Pelican Imaging Coporation | Camera modules patterned with pi filter groups |
US9214013B2 (en) | 2012-09-14 | 2015-12-15 | Pelican Imaging Corporation | Systems and methods for correcting user identified artifacts in light field images |
US9247117B2 (en) | 2014-04-07 | 2016-01-26 | Pelican Imaging Corporation | Systems and methods for correcting for warpage of a sensor array in an array camera module by introducing warpage into a focal plane of a lens stack array |
US9253380B2 (en) | 2013-02-24 | 2016-02-02 | Pelican Imaging Corporation | Thin form factor computational array cameras and modular array cameras |
US9264610B2 (en) | 2009-11-20 | 2016-02-16 | Pelican Imaging Corporation | Capturing and processing of images including occlusions captured by heterogeneous camera arrays |
US9412206B2 (en) | 2012-02-21 | 2016-08-09 | Pelican Imaging Corporation | Systems and methods for the manipulation of captured light field image data |
US9426361B2 (en) | 2013-11-26 | 2016-08-23 | Pelican Imaging Corporation | Array camera configurations incorporating multiple constituent array cameras |
US9438888B2 (en) | 2013-03-15 | 2016-09-06 | Pelican Imaging Corporation | Systems and methods for stereo imaging with camera arrays |
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US9497429B2 (en) | 2013-03-15 | 2016-11-15 | Pelican Imaging Corporation | Extended color processing on pelican array cameras |
US9516222B2 (en) | 2011-06-28 | 2016-12-06 | Kip Peli P1 Lp | Array cameras incorporating monolithic array camera modules with high MTF lens stacks for capture of images used in super-resolution processing |
US9521319B2 (en) | 2014-06-18 | 2016-12-13 | Pelican Imaging Corporation | Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor |
US9578259B2 (en) | 2013-03-14 | 2017-02-21 | Fotonation Cayman Limited | Systems and methods for reducing motion blur in images or video in ultra low light with array cameras |
US9633442B2 (en) | 2013-03-15 | 2017-04-25 | Fotonation Cayman Limited | Array cameras including an array camera module augmented with a separate camera |
US9733486B2 (en) | 2013-03-13 | 2017-08-15 | Fotonation Cayman Limited | Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing |
US9741118B2 (en) | 2013-03-13 | 2017-08-22 | Fotonation Cayman Limited | System and methods for calibration of an array camera |
US9749568B2 (en) | 2012-11-13 | 2017-08-29 | Fotonation Cayman Limited | Systems and methods for array camera focal plane control |
US9766380B2 (en) | 2012-06-30 | 2017-09-19 | Fotonation Cayman Limited | Systems and methods for manufacturing camera modules using active alignment of lens stack arrays and sensors |
US9774789B2 (en) | 2013-03-08 | 2017-09-26 | Fotonation Cayman Limited | Systems and methods for high dynamic range imaging using array cameras |
US9794476B2 (en) | 2011-09-19 | 2017-10-17 | Fotonation Cayman Limited | Systems and methods for controlling aliasing in images captured by an array camera for use in super resolution processing using pixel apertures |
US9800856B2 (en) | 2013-03-13 | 2017-10-24 | Fotonation Cayman Limited | Systems and methods for synthesizing images from image data captured by an array camera using restricted depth of field depth maps in which depth estimation precision varies |
US9813616B2 (en) | 2012-08-23 | 2017-11-07 | Fotonation Cayman Limited | Feature based high resolution motion estimation from low resolution images captured using an array source |
US9866739B2 (en) | 2011-05-11 | 2018-01-09 | Fotonation Cayman Limited | Systems and methods for transmitting and receiving array camera image data |
US9888194B2 (en) | 2013-03-13 | 2018-02-06 | Fotonation Cayman Limited | Array camera architecture implementing quantum film image sensors |
US9898856B2 (en) | 2013-09-27 | 2018-02-20 | Fotonation Cayman Limited | Systems and methods for depth-assisted perspective distortion correction |
US9936148B2 (en) | 2010-05-12 | 2018-04-03 | Fotonation Cayman Limited | Imager array interfaces |
US9942474B2 (en) | 2015-04-17 | 2018-04-10 | Fotonation Cayman Limited | Systems and methods for performing high speed video capture and depth estimation using array cameras |
US9955070B2 (en) | 2013-03-15 | 2018-04-24 | Fotonation Cayman Limited | Systems and methods for synthesizing high resolution images using image deconvolution based on motion and depth information |
US10009538B2 (en) | 2013-02-21 | 2018-06-26 | Fotonation Cayman Limited | Systems and methods for generating compressed light field representation data using captured light fields, array geometry, and parallax information |
US10089740B2 (en) | 2014-03-07 | 2018-10-02 | Fotonation Limited | System and methods for depth regularization and semiautomatic interactive matting using RGB-D images |
US10119808B2 (en) | 2013-11-18 | 2018-11-06 | Fotonation Limited | Systems and methods for estimating depth from projected texture using camera arrays |
US10122993B2 (en) | 2013-03-15 | 2018-11-06 | Fotonation Limited | Autofocus system for a conventional camera that uses depth information from an array camera |
US10250871B2 (en) | 2014-09-29 | 2019-04-02 | Fotonation Limited | Systems and methods for dynamic calibration of array cameras |
US10390005B2 (en) | 2012-09-28 | 2019-08-20 | Fotonation Limited | Generating images from light fields utilizing virtual viewpoints |
US10475838B2 (en) * | 2017-09-25 | 2019-11-12 | Omnivision Technologies, Inc. | Multi-pixel detector and associated method for increasing angular sensitivity |
US10482618B2 (en) | 2017-08-21 | 2019-11-19 | Fotonation Limited | Systems and methods for hybrid depth regularization |
US11270110B2 (en) | 2019-09-17 | 2022-03-08 | Boston Polarimetrics, Inc. | Systems and methods for surface modeling using polarization cues |
US11290658B1 (en) | 2021-04-15 | 2022-03-29 | Boston Polarimetrics, Inc. | Systems and methods for camera exposure control |
US11302012B2 (en) | 2019-11-30 | 2022-04-12 | Boston Polarimetrics, Inc. | Systems and methods for transparent object segmentation using polarization cues |
US11525906B2 (en) | 2019-10-07 | 2022-12-13 | Intrinsic Innovation Llc | Systems and methods for augmentation of sensor systems and imaging systems with polarization |
US11580667B2 (en) | 2020-01-29 | 2023-02-14 | Intrinsic Innovation Llc | Systems and methods for characterizing object pose detection and measurement systems |
US11689813B2 (en) | 2021-07-01 | 2023-06-27 | Intrinsic Innovation Llc | Systems and methods for high dynamic range imaging using crossed polarizers |
US11792538B2 (en) | 2008-05-20 | 2023-10-17 | Adeia Imaging Llc | Capturing and processing of images including occlusions focused on an image sensor by a lens stack array |
US11797863B2 (en) | 2020-01-30 | 2023-10-24 | Intrinsic Innovation Llc | Systems and methods for synthesizing data for training statistical models on different imaging modalities including polarized images |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9270885B2 (en) * | 2012-10-26 | 2016-02-23 | Google Inc. | Method, system, and computer program product for gamifying the process of obtaining panoramic images |
US9716819B2 (en) * | 2014-09-29 | 2017-07-25 | Samsung Electronics Co., Ltd. | Imaging device with 4-lens time-of-flight pixels and interleaved readout thereof |
US10180340B2 (en) * | 2014-10-09 | 2019-01-15 | Invensense, Inc. | System and method for MEMS sensor system synchronization |
EP3286914B1 (en) | 2015-04-19 | 2019-12-25 | FotoNation Limited | Multi-baseline camera array system architectures for depth augmentation in vr/ar applications |
US11002856B2 (en) * | 2015-08-07 | 2021-05-11 | King Abdullah University Of Science And Technology | Doppler time-of-flight imaging |
US11525735B2 (en) | 2016-01-11 | 2022-12-13 | Carrier Corporation | Infrared presence detector system |
US10474148B2 (en) * | 2016-07-27 | 2019-11-12 | General Electric Company | Navigating an unmanned aerial vehicle |
ES2866975T3 (en) * | 2016-10-18 | 2021-10-20 | Photonic Sensors & Algorithms S L | Device and method for obtaining distance information from views |
WO2023224884A1 (en) * | 2022-05-16 | 2023-11-23 | Seek Thermal, Inc. | Thermal imaging camera module configured for integration into a host system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009151903A2 (en) * | 2008-05-20 | 2009-12-17 | Pelican Imaging Corporation | Capturing and processing of images using monolithic camera array with hetergeneous imagers |
US20120287291A1 (en) * | 2011-05-11 | 2012-11-15 | Pelican Imaging Corporation | Systems and methods for transmitting and receiving array camera image data |
Family Cites Families (728)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4124798A (en) | 1965-12-09 | 1978-11-07 | Thompson Kenneth B | Optical viewing apparatus |
US4198646A (en) | 1978-10-13 | 1980-04-15 | Hughes Aircraft Company | Monolithic imager for near-IR |
JPS5925483Y2 (en) | 1979-05-22 | 1984-07-26 | 株式会社東芝 | Kitchen waste processing machine |
US4323925A (en) | 1980-07-07 | 1982-04-06 | Avco Everett Research Laboratory, Inc. | Method and apparatus for arraying image sensor modules |
JPS5769476A (en) | 1980-10-16 | 1982-04-28 | Fuji Xerox Co Ltd | Reader control system |
JPS5925483A (en) | 1982-08-04 | 1984-02-09 | Hitachi Denshi Ltd | Solid state image pickup device |
US4652909A (en) | 1982-09-14 | 1987-03-24 | New York Institute Of Technology | Television camera and recording system for high definition television having imagers of different frame rate |
US4460449A (en) | 1983-01-03 | 1984-07-17 | Amerace Corporation | Apparatus for making a tool |
EP0289885A1 (en) | 1987-05-08 | 1988-11-09 | Siemens Aktiengesellschaft | Aperture system for production of several partical probes with changeable cross-section |
JPS6437177A (en) | 1987-08-03 | 1989-02-07 | Canon Kk | Image pickup device |
EP0342419B1 (en) | 1988-05-19 | 1992-10-28 | Siemens Aktiengesellschaft | Method for the observation of a scene and apparatus therefor |
JPH02285772A (en) | 1989-04-26 | 1990-11-26 | Toshiba Corp | Picture reader |
US5070414A (en) | 1988-09-20 | 1991-12-03 | Kabushiki Kaisha Toshiba | Method and apparatus for reading image information formed on material |
US5157499A (en) | 1990-06-29 | 1992-10-20 | Kabushiki Kaisha N A C | High-speed video camera using solid-state image sensor |
US5144448A (en) | 1990-07-31 | 1992-09-01 | Vidar Systems Corporation | Scanning apparatus using multiple CCD arrays and related method |
FR2680976B1 (en) | 1991-09-10 | 1998-12-31 | Hospal Ind | ARTIFICIAL KIDNEY PROVIDED WITH BLOOD CHARACTERISTIC MEANS OF DETERMINATION AND CORRESPONDING DETERMINATION METHOD. |
US5325449A (en) | 1992-05-15 | 1994-06-28 | David Sarnoff Research Center, Inc. | Method for fusing images and apparatus therefor |
JP3032382B2 (en) | 1992-07-13 | 2000-04-17 | シャープ株式会社 | Digital signal sampling frequency converter |
US5659424A (en) | 1993-05-25 | 1997-08-19 | Hitachi, Ltd. | Projecting lens and image display device |
JPH0715457A (en) | 1993-06-18 | 1995-01-17 | Hitachi Ltd | Digital communication switchover system |
EP0677821A3 (en) | 1994-04-14 | 1996-03-06 | Hewlett Packard Co | Magnify a digital image using feedback. |
US20020195548A1 (en) | 2001-06-06 | 2002-12-26 | Dowski Edward Raymond | Wavefront coding interference contrast imaging systems |
US5629524A (en) | 1995-02-21 | 1997-05-13 | Advanced Scientific Concepts, Inc. | High speed crystallography detector |
EP0739039A3 (en) | 1995-04-18 | 1998-03-04 | Interuniversitair Micro-Elektronica Centrum Vzw | Pixel structure, image sensor using such pixel, structure and corresponding peripheric circuitry |
US6005607A (en) | 1995-06-29 | 1999-12-21 | Matsushita Electric Industrial Co., Ltd. | Stereoscopic computer graphics image generating apparatus and stereoscopic TV apparatus |
WO1997018633A1 (en) | 1995-11-07 | 1997-05-22 | California Institute Of Technology | Capacitively coupled successive approximation ultra low power analog-to-digital converter |
JPH09181913A (en) | 1995-12-26 | 1997-07-11 | Olympus Optical Co Ltd | Camera system |
US5973844A (en) | 1996-01-26 | 1999-10-26 | Proxemics | Lenslet array systems and methods |
US6124974A (en) | 1996-01-26 | 2000-09-26 | Proxemics | Lenslet array systems and methods |
US6493465B2 (en) | 1996-02-21 | 2002-12-10 | Canon Kabushiki Kaisha | Matching point extracting method and apparatus therefor |
US5832312A (en) | 1996-02-22 | 1998-11-03 | Eastman Kodak Company | Watertight body for accommodating a photographic camera |
MY118360A (en) | 1996-04-30 | 2004-10-30 | Nippon Telegraph & Telephone | Scheme for detecting shot boundaries in compressed video data using inter-frame/inter field prediction coding and intra-frame/intra-field coding |
US6002743A (en) | 1996-07-17 | 1999-12-14 | Telymonde; Timothy D. | Method and apparatus for image acquisition from a plurality of cameras |
GB9616262D0 (en) | 1996-08-02 | 1996-09-11 | Philips Electronics Nv | Post-processing generation of focus/defocus effects for computer graphics images |
US6141048A (en) | 1996-08-19 | 2000-10-31 | Eastman Kodak Company | Compact image capture device |
US6137535A (en) | 1996-11-04 | 2000-10-24 | Eastman Kodak Company | Compact digital camera with segmented fields of view |
US5808350A (en) | 1997-01-03 | 1998-09-15 | Raytheon Company | Integrated IR, visible and NIR sensor and methods of fabricating same |
JPH10232626A (en) | 1997-02-20 | 1998-09-02 | Canon Inc | Stereoscopic image display device |
US6097394A (en) | 1997-04-28 | 2000-08-01 | Board Of Trustees, Leland Stanford, Jr. University | Method and system for light field rendering |
US6515701B2 (en) | 1997-07-24 | 2003-02-04 | Polaroid Corporation | Focal plane exposure control system for CMOS area image sensors |
US6563537B1 (en) | 1997-07-31 | 2003-05-13 | Fuji Photo Film Co., Ltd. | Image signal interpolation |
JP3430935B2 (en) | 1997-10-20 | 2003-07-28 | 富士ゼロックス株式会社 | Image reading device and lens |
NO305728B1 (en) | 1997-11-14 | 1999-07-12 | Reidar E Tangen | Optoelectronic camera and method of image formatting in the same |
JP4243779B2 (en) | 1997-11-14 | 2009-03-25 | 株式会社ニコン | Diffusion plate manufacturing method, diffusion plate, microlens array manufacturing method, and microlens array |
US6069365A (en) | 1997-11-25 | 2000-05-30 | Alan Y. Chow | Optical processor based imaging system |
JPH11242189A (en) | 1997-12-25 | 1999-09-07 | Olympus Optical Co Ltd | Method and device for forming image |
US6721008B2 (en) | 1998-01-22 | 2004-04-13 | Eastman Kodak Company | Integrated CMOS active pixel digital camera |
JPH11223708A (en) | 1998-02-09 | 1999-08-17 | Nikon Corp | Indentator and production of micro-optical element array |
US6054703A (en) | 1998-03-20 | 2000-04-25 | Syscan, Inc. | Sensing module for accelerating signal readout from image sensors |
US6160909A (en) | 1998-04-01 | 2000-12-12 | Canon Kabushiki Kaisha | Depth control for stereoscopic images |
JP3931936B2 (en) | 1998-05-11 | 2007-06-20 | セイコーエプソン株式会社 | Microlens array substrate, method for manufacturing the same, and display device |
US6205241B1 (en) | 1998-06-01 | 2001-03-20 | Canon Kabushiki Kaisha | Compression of stereoscopic images |
US6137100A (en) | 1998-06-08 | 2000-10-24 | Photobit Corporation | CMOS image sensor with different pixel sizes for different colors |
US6069351A (en) | 1998-07-16 | 2000-05-30 | Intel Corporation | Focal plane processor for scaling information from image sensors |
US6903770B1 (en) | 1998-07-27 | 2005-06-07 | Sanyo Electric Co., Ltd. | Digital camera which produces a single image based on two exposures |
US6340994B1 (en) | 1998-08-12 | 2002-01-22 | Pixonics, Llc | System and method for using temporal gamma and reverse super-resolution to process images for use in digital display systems |
US6269175B1 (en) | 1998-08-28 | 2001-07-31 | Sarnoff Corporation | Method and apparatus for enhancing regions of aligned images using flow estimation |
US6879735B1 (en) | 1998-09-14 | 2005-04-12 | University Of Utah Reasearch Foundation | Method of digital image enhancement and sharpening |
US6310650B1 (en) | 1998-09-23 | 2001-10-30 | Honeywell International Inc. | Method and apparatus for calibrating a tiled display |
GB2343320B (en) | 1998-10-31 | 2003-03-26 | Ibm | Camera system for three dimentional images and video |
JP3596314B2 (en) | 1998-11-02 | 2004-12-02 | 日産自動車株式会社 | Object edge position measuring device and moving object traffic judging device |
US6611289B1 (en) | 1999-01-15 | 2003-08-26 | Yanbin Yu | Digital cameras using multiple sensors with multiple lenses |
JP3875423B2 (en) | 1999-01-19 | 2007-01-31 | 日本放送協会 | Solid-state imaging device and video signal output device therefor |
US6603513B1 (en) | 1999-02-16 | 2003-08-05 | Micron Technology, Inc. | Using a single control line to provide select and reset signals to image sensors in two rows of a digital imaging device |
US6563540B2 (en) | 1999-02-26 | 2003-05-13 | Intel Corporation | Light sensor with increased dynamic range |
US20020063807A1 (en) | 1999-04-19 | 2002-05-30 | Neal Margulis | Method for Performing Image Transforms in a Digital Display System |
US6819358B1 (en) | 1999-04-26 | 2004-11-16 | Microsoft Corporation | Error calibration for digital image sensors and apparatus using the same |
JP2001008235A (en) | 1999-06-25 | 2001-01-12 | Minolta Co Ltd | Image input method for reconfiguring three-dimensional data and multiple-lens data input device |
JP2001042042A (en) | 1999-07-27 | 2001-02-16 | Canon Inc | Image pickup device |
US7015954B1 (en) * | 1999-08-09 | 2006-03-21 | Fuji Xerox Co., Ltd. | Automatic video system using multiple cameras |
US6647142B1 (en) | 1999-08-19 | 2003-11-11 | Mitsubishi Electric Research Laboratories, Inc. | Badge identification system |
US6771833B1 (en) | 1999-08-20 | 2004-08-03 | Eastman Kodak Company | Method and system for enhancing digital images |
US6628330B1 (en) | 1999-09-01 | 2003-09-30 | Neomagic Corp. | Color interpolator and horizontal/vertical edge enhancer using two line buffer and alternating even/odd filters for digital camera |
US6358862B1 (en) | 1999-09-02 | 2002-03-19 | Micron Technology, Inc | Passivation integrity improvements |
US6639596B1 (en) | 1999-09-20 | 2003-10-28 | Microsoft Corporation | Stereo reconstruction from multiperspective panoramas |
US6774941B1 (en) | 1999-10-26 | 2004-08-10 | National Semiconductor Corporation | CCD output processing stage that amplifies signals from colored pixels based on the conversion efficiency of the colored pixels |
US6671399B1 (en) | 1999-10-27 | 2003-12-30 | Canon Kabushiki Kaisha | Fast epipolar line adjustment of stereo pairs |
JP2001195050A (en) | 1999-11-05 | 2001-07-19 | Mitsubishi Electric Corp | Graphic accelerator |
WO2001039512A1 (en) | 1999-11-26 | 2001-05-31 | Sanyo Electric Co., Ltd. | Device and method for converting two-dimensional video to three-dimensional video |
JP3950926B2 (en) | 1999-11-30 | 2007-08-01 | エーユー オプトロニクス コーポレイション | Image display method, host device, image display device, and display interface |
JP3728160B2 (en) | 1999-12-06 | 2005-12-21 | キヤノン株式会社 | Depth image measuring apparatus and method, and mixed reality presentation system |
US7068851B1 (en) | 1999-12-10 | 2006-06-27 | Ricoh Co., Ltd. | Multiscale sharpening and smoothing with wavelets |
FI107680B (en) | 1999-12-22 | 2001-09-14 | Nokia Oyj | Procedure for transmitting video images, data transmission systems, transmitting video terminal and receiving video terminal |
US6502097B1 (en) | 1999-12-23 | 2002-12-31 | Microsoft Corporation | Data structure for efficient access to variable-size data objects |
US6476805B1 (en) | 1999-12-23 | 2002-11-05 | Microsoft Corporation | Techniques for spatial displacement estimation and multi-resolution operations on light fields |
JP2001194114A (en) | 2000-01-14 | 2001-07-19 | Sony Corp | Image processing apparatus and method and program providing medium |
US6523046B2 (en) | 2000-02-25 | 2003-02-18 | Microsoft Corporation | Infrastructure and method for supporting generic multimedia metadata |
JP2001264033A (en) | 2000-03-17 | 2001-09-26 | Sony Corp | Three-dimensional shape-measuring apparatus and its method, three-dimensional modeling device and its method, and program providing medium |
US6571466B1 (en) | 2000-03-27 | 2003-06-03 | Amkor Technology, Inc. | Flip chip image sensor package fabrication method |
JP2001277260A (en) | 2000-03-30 | 2001-10-09 | Seiko Epson Corp | Micro-lens array, its production method, and original board and display for producing it |
KR20020084288A (en) | 2000-04-04 | 2002-11-04 | 주식회사 아도반테스토 | Multibeam exposure apparatus comprising multiaxis electron lens and method for manufacturing semiconductor device |
WO2001082593A1 (en) | 2000-04-24 | 2001-11-01 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Apparatus and method for color image fusion |
JP2001337263A (en) | 2000-05-25 | 2001-12-07 | Olympus Optical Co Ltd | Range-finding device |
WO2002009424A2 (en) | 2000-07-21 | 2002-01-31 | The Trustees Of Columbia University In The City Of New York | Method and apparatus for image mosaicing |
US7154546B1 (en) | 2000-08-07 | 2006-12-26 | Micron Technology, Inc. | Pixel optimization for color |
DE60115789T2 (en) | 2000-08-25 | 2006-08-31 | Fuji Photo Film Co., Ltd., Minami-Ashigara | Apparatus for parallax image acquisition and parallax image processing |
US7085409B2 (en) | 2000-10-18 | 2006-08-01 | Sarnoff Corporation | Method and apparatus for synthesizing new video and/or still imagery from a collection of real video and/or still imagery |
US6734905B2 (en) | 2000-10-20 | 2004-05-11 | Micron Technology, Inc. | Dynamic range extension for CMOS image sensors |
US7262799B2 (en) | 2000-10-25 | 2007-08-28 | Canon Kabushiki Kaisha | Image sensing apparatus and its control method, control program, and storage medium |
US6476971B1 (en) | 2000-10-31 | 2002-11-05 | Eastman Kodak Company | Method of manufacturing a microlens array mold and a microlens array |
JP3918499B2 (en) | 2000-11-01 | 2007-05-23 | セイコーエプソン株式会社 | Gap measuring method, gap measuring device, shape measuring method, shape measuring device, and liquid crystal device manufacturing method |
US6788338B1 (en) | 2000-11-20 | 2004-09-07 | Petko Dimitrov Dinev | High resolution video camera apparatus having two image sensors and signal processing |
US7490774B2 (en) | 2003-11-13 | 2009-02-17 | Metrologic Instruments, Inc. | Hand-supportable imaging based bar code symbol reader employing automatic light exposure measurement and illumination control subsystem integrated therein |
JP2002171537A (en) | 2000-11-30 | 2002-06-14 | Canon Inc | Compound image pickup system, image pickup device and electronic device |
US7260274B2 (en) | 2000-12-01 | 2007-08-21 | Imax Corporation | Techniques and systems for developing high-resolution imagery |
US7596281B2 (en) | 2000-12-05 | 2009-09-29 | Yeda Research And Development Co. Ltd. | Apparatus and method for alignment of spatial or temporal non-overlapping images sequences |
JP2002252338A (en) | 2000-12-18 | 2002-09-06 | Canon Inc | Imaging device and imaging system |
JP2002195910A (en) | 2000-12-26 | 2002-07-10 | Omron Corp | System for testing optical part |
JP2002209226A (en) | 2000-12-28 | 2002-07-26 | Canon Inc | Image pickup device |
US7805680B2 (en) | 2001-01-03 | 2010-09-28 | Nokia Corporation | Statistical metering and filtering of content via pixel-based metadata |
JP3957460B2 (en) | 2001-01-15 | 2007-08-15 | 沖電気工業株式会社 | Transmission header compression apparatus, moving picture encoding apparatus, and moving picture transmission system |
US6635941B2 (en) | 2001-03-21 | 2003-10-21 | Canon Kabushiki Kaisha | Structure of semiconductor device with improved reliability |
JP2002324743A (en) | 2001-04-24 | 2002-11-08 | Canon Inc | Exposing method and equipment thereof |
US6443579B1 (en) | 2001-05-02 | 2002-09-03 | Kenneth Myers | Field-of-view controlling arrangements |
US20020167537A1 (en) | 2001-05-11 | 2002-11-14 | Miroslav Trajkovic | Motion-based tracking with pan-tilt-zoom camera |
US7235785B2 (en) | 2001-05-11 | 2007-06-26 | Irvine Sensors Corp. | Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array |
AU2002305780A1 (en) | 2001-05-29 | 2002-12-09 | Transchip, Inc. | Patent application cmos imager for cellular applications and methods of using such |
US7738013B2 (en) | 2001-05-29 | 2010-06-15 | Samsung Electronics Co., Ltd. | Systems and methods for power conservation in a CMOS imager |
US6482669B1 (en) | 2001-05-30 | 2002-11-19 | Taiwan Semiconductor Manufacturing Company | Colors only process to reduce package yield loss |
US6525302B2 (en) | 2001-06-06 | 2003-02-25 | The Regents Of The University Of Colorado | Wavefront coding phase contrast imaging systems |
US20030025227A1 (en) | 2001-08-02 | 2003-02-06 | Zograph, Llc | Reproduction of relief patterns |
EP1289309B1 (en) | 2001-08-31 | 2010-04-21 | STMicroelectronics Srl | Noise filter for Bayer pattern image data |
JP3978706B2 (en) | 2001-09-20 | 2007-09-19 | セイコーエプソン株式会社 | Manufacturing method of fine structure |
JP2003139910A (en) | 2001-10-30 | 2003-05-14 | Sony Corp | Optical element, method and device for manufacturing the same, and liquid crystal display device and image projection type display device using the same |
DE10153237A1 (en) | 2001-10-31 | 2003-05-15 | Lfk Gmbh | Method and device for the automated determination of the modulation transfer function (MTF) of focal plane array (FPA) cameras |
JP3705766B2 (en) | 2001-11-28 | 2005-10-12 | 独立行政法人科学技術振興機構 | Image input device |
JP4249627B2 (en) | 2001-12-18 | 2009-04-02 | ザ ユニバーシティ オブ ロチェスター | Imaging to obtain an extended focal length using a multifocal aspheric lens |
US7302118B2 (en) | 2002-02-07 | 2007-11-27 | Microsoft Corporation | Transformation of images |
US20030179418A1 (en) | 2002-03-19 | 2003-09-25 | Eastman Kodak Company | Producing a defective pixel map from defective cluster pixels in an area array image sensor |
US8369607B2 (en) | 2002-03-27 | 2013-02-05 | Sanyo Electric Co., Ltd. | Method and apparatus for processing three-dimensional images |
JP2003298920A (en) | 2002-03-29 | 2003-10-17 | Fuji Photo Film Co Ltd | Digital camera |
US20030188659A1 (en) | 2002-04-05 | 2003-10-09 | Canadian Bank Note Company Limited | Method and apparatus for reproducing a color image based on monochrome images derived therefrom |
US6856314B2 (en) | 2002-04-18 | 2005-02-15 | Stmicroelectronics, Inc. | Method and system for 3D reconstruction of multiple views with altering search path and occlusion modeling |
JP3567327B2 (en) | 2002-05-08 | 2004-09-22 | 富士写真光機株式会社 | Imaging lens |
US6783900B2 (en) | 2002-05-13 | 2004-08-31 | Micron Technology, Inc. | Color filter imaging array and method of formation |
JP2004048644A (en) | 2002-05-21 | 2004-02-12 | Sony Corp | Information processor, information processing system and interlocutor display method |
JP2003347192A (en) | 2002-05-24 | 2003-12-05 | Toshiba Corp | Energy beam exposure method and exposure device |
US7129981B2 (en) | 2002-06-27 | 2006-10-31 | International Business Machines Corporation | Rendering system and method for images having differing foveal area and peripheral view area resolutions |
JP2004088713A (en) | 2002-06-27 | 2004-03-18 | Olympus Corp | Image pickup lens unit and image pickup device |
JP4147059B2 (en) | 2002-07-03 | 2008-09-10 | 株式会社トプコン | Calibration data measuring device, measuring method and measuring program, computer-readable recording medium, and image data processing device |
JP2004037924A (en) | 2002-07-04 | 2004-02-05 | Minolta Co Ltd | Imaging apparatus |
WO2004008403A2 (en) | 2002-07-15 | 2004-01-22 | Magna B.S.P. Ltd. | Method and apparatus for implementing multipurpose monitoring system |
US20040012689A1 (en) | 2002-07-16 | 2004-01-22 | Fairchild Imaging | Charge coupled devices in tiled arrays |
JP2004078296A (en) | 2002-08-09 | 2004-03-11 | Victor Co Of Japan Ltd | Picture generation device |
US7447380B2 (en) | 2002-09-12 | 2008-11-04 | Inoe Technologies, Llc | Efficient method for creating a viewpoint from plurality of images |
US20040050104A1 (en) | 2002-09-18 | 2004-03-18 | Eastman Kodak Company | Forming information transfer lens array |
US20040207836A1 (en) | 2002-09-27 | 2004-10-21 | Rajeshwar Chhibber | High dynamic range optical inspection system and method |
US7084904B2 (en) | 2002-09-30 | 2006-08-01 | Microsoft Corporation | Foveated wide-angle imaging system and method for capturing and viewing wide-angle images in real time |
US7477781B1 (en) | 2002-10-10 | 2009-01-13 | Dalsa Corporation | Method and apparatus for adaptive pixel correction of multi-color matrix |
JP4171786B2 (en) | 2002-10-25 | 2008-10-29 | コニカミノルタホールディングス株式会社 | Image input device |
US7742088B2 (en) | 2002-11-19 | 2010-06-22 | Fujifilm Corporation | Image sensor and digital camera |
EP1570683A1 (en) | 2002-11-21 | 2005-09-07 | Vision III Imaging, Inc. | Critical alignment of parallax images for autostereoscopic display |
US20040105021A1 (en) | 2002-12-02 | 2004-06-03 | Bolymedia Holdings Co., Ltd. | Color filter patterns for image sensors |
US20040114807A1 (en) | 2002-12-13 | 2004-06-17 | Dan Lelescu | Statistical representation and coding of light field data |
US6878918B2 (en) | 2003-01-09 | 2005-04-12 | Dialdg Semiconductor Gmbh | APS pixel with reset noise suppression and programmable binning capability |
US7340099B2 (en) | 2003-01-17 | 2008-03-04 | University Of New Brunswick | System and method for image fusion |
DE10301941B4 (en) | 2003-01-20 | 2005-11-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Camera and method for optical recording of a screen |
US7379592B2 (en) | 2003-01-21 | 2008-05-27 | United States Of America As Represented By The Secretary Of The Navy | System and method for significant dust detection and enhancement of dust images over land and ocean |
US7005637B2 (en) | 2003-01-31 | 2006-02-28 | Intevac, Inc. | Backside thinning of image array devices |
JP4214409B2 (en) | 2003-01-31 | 2009-01-28 | 国立大学法人東京工業大学 | High resolution color image generation method, high resolution color image generation apparatus, and high resolution color image generation program |
US7308157B2 (en) | 2003-02-03 | 2007-12-11 | Photon Dynamics, Inc. | Method and apparatus for optical inspection of a display |
US7595817B1 (en) | 2003-02-12 | 2009-09-29 | The Research Foundation Of State University Of New York | Linear system based, qualitative independent motion detection from compressed MPEG surveillance video |
US20040165090A1 (en) | 2003-02-13 | 2004-08-26 | Alex Ning | Auto-focus (AF) lens and process |
JP2004266369A (en) | 2003-02-21 | 2004-09-24 | Sony Corp | Solid-state image pickup unit and its driving method |
US7106914B2 (en) | 2003-02-27 | 2006-09-12 | Microsoft Corporation | Bayesian image super resolution |
US7148861B2 (en) | 2003-03-01 | 2006-12-12 | The Boeing Company | Systems and methods for providing enhanced vision imaging with decreased latency |
US8218052B2 (en) | 2003-03-07 | 2012-07-10 | Iconix Video, Inc. | High frame rate high definition imaging system and method |
US7218320B2 (en) | 2003-03-13 | 2007-05-15 | Sony Corporation | System and method for capturing facial and body motion |
US6801719B1 (en) | 2003-03-14 | 2004-10-05 | Eastman Kodak Company | Camera using beam splitter with micro-lens image amplification |
US7206449B2 (en) | 2003-03-19 | 2007-04-17 | Mitsubishi Electric Research Laboratories, Inc. | Detecting silhouette edges in images |
US7425984B2 (en) | 2003-04-04 | 2008-09-16 | Stmicroelectronics, Inc. | Compound camera and methods for implementing auto-focus, depth-of-field and high-resolution functions |
US7373005B2 (en) | 2003-04-10 | 2008-05-13 | Micron Technology, Inc. | Compression system for integrated sensor devices |
US7097311B2 (en) | 2003-04-19 | 2006-08-29 | University Of Kentucky Research Foundation | Super-resolution overlay in multi-projector displays |
US6958862B1 (en) | 2003-04-21 | 2005-10-25 | Foveon, Inc. | Use of a lenslet array with a vertically stacked pixel array |
US7428330B2 (en) | 2003-05-02 | 2008-09-23 | Microsoft Corporation | Cyclopean virtual imaging via generalized probabilistic smoothing |
SE525665C2 (en) | 2003-05-08 | 2005-03-29 | Forskarpatent I Syd Ab | Matrix of pixels and electronic imaging device comprising said matrix of pixels |
US7800683B2 (en) | 2003-05-13 | 2010-09-21 | Xceed Imaging Ltd. | Optical method and system for enhancing image resolution |
JP2004348674A (en) | 2003-05-26 | 2004-12-09 | Noritsu Koki Co Ltd | Region detection method and its device |
US20040240052A1 (en) | 2003-06-02 | 2004-12-02 | Pentax Corporation | Multiple-focal imaging device, and a mobile device having the multiple-focal-length imaging device |
JP2004363478A (en) | 2003-06-06 | 2004-12-24 | Sanyo Electric Co Ltd | Manufacturing method of semiconductor device |
KR100539234B1 (en) | 2003-06-11 | 2005-12-27 | 삼성전자주식회사 | A CMOS type image sensor module having transparent polymeric encapsulation material |
US7362918B2 (en) | 2003-06-24 | 2008-04-22 | Microsoft Corporation | System and method for de-noising multiple copies of a signal |
US6818934B1 (en) | 2003-06-24 | 2004-11-16 | Omnivision International Holding Ltd | Image sensor having micro-lens array separated with trench structures and method of making |
US7090135B2 (en) | 2003-07-07 | 2006-08-15 | Symbol Technologies, Inc. | Imaging arrangement and barcode imager for imaging an optical code or target at a plurality of focal planes |
US7388609B2 (en) | 2003-07-07 | 2008-06-17 | Zoran Corporation | Dynamic identification and correction of defective pixels |
US20050007461A1 (en) | 2003-07-11 | 2005-01-13 | Novatek Microelectronic Co. | Correction system and method of analog front end |
JP3731589B2 (en) | 2003-07-18 | 2006-01-05 | ソニー株式会社 | Imaging device and synchronization signal generator |
US7233737B2 (en) | 2003-08-12 | 2007-06-19 | Micron Technology, Inc. | Fixed-focus camera module and associated method of assembly |
US7643703B2 (en) | 2003-09-03 | 2010-01-05 | Battelle Energy Alliance, Llc | Image change detection systems, methods, and articles of manufacture |
US7161606B2 (en) | 2003-09-08 | 2007-01-09 | Honda Motor Co., Ltd. | Systems and methods for directly generating a view using a layered approach |
JP4020850B2 (en) | 2003-10-06 | 2007-12-12 | 株式会社東芝 | Magnetic recording medium manufacturing method, manufacturing apparatus, imprint stamper and manufacturing method thereof |
EP2466871A3 (en) | 2003-10-22 | 2017-05-03 | Panasonic Intellectual Property Management Co., Ltd. | Imaging apparatus and method for producing the same, portable equipment, and imaging sensor and method for producing the same. |
US7840067B2 (en) | 2003-10-24 | 2010-11-23 | Arcsoft, Inc. | Color matching and color correction for images forming a panoramic image |
EP1686810A4 (en) | 2003-11-11 | 2009-06-03 | Olympus Corp | Multi-spectrum image pick up device |
JP4235539B2 (en) | 2003-12-01 | 2009-03-11 | 独立行政法人科学技術振興機構 | Image composition apparatus and image composition method |
US7453510B2 (en) | 2003-12-11 | 2008-11-18 | Nokia Corporation | Imaging device |
US7328288B2 (en) | 2003-12-11 | 2008-02-05 | Canon Kabushiki Kaisha | Relay apparatus for relaying communication from CPU to peripheral device |
US20050128509A1 (en) | 2003-12-11 | 2005-06-16 | Timo Tokkonen | Image creating method and imaging device |
JP3859158B2 (en) | 2003-12-16 | 2006-12-20 | セイコーエプソン株式会社 | Microlens concave substrate, microlens substrate, transmissive screen, and rear projector |
US7123298B2 (en) | 2003-12-18 | 2006-10-17 | Avago Technologies Sensor Ip Pte. Ltd. | Color image sensor with imaging elements imaging on respective regions of sensor elements |
US7511749B2 (en) | 2003-12-18 | 2009-03-31 | Aptina Imaging Corporation | Color image sensor having imaging element array forming images on respective regions of sensor elements |
US7376250B2 (en) | 2004-01-05 | 2008-05-20 | Honda Motor Co., Ltd. | Apparatus, method and program for moving object detection |
US7496293B2 (en) | 2004-01-14 | 2009-02-24 | Elbit Systems Ltd. | Versatile camera for various visibility conditions |
US7773143B2 (en) | 2004-04-08 | 2010-08-10 | Tessera North America, Inc. | Thin color camera having sub-pixel resolution |
US8134637B2 (en) | 2004-01-28 | 2012-03-13 | Microsoft Corporation | Method and system to increase X-Y resolution in a depth (Z) camera using red, blue, green (RGB) sensing |
US20050185711A1 (en) | 2004-02-20 | 2005-08-25 | Hanspeter Pfister | 3D television system and method |
SE527889C2 (en) | 2004-03-17 | 2006-07-04 | Thomas Jeff Adamo | Apparatus for imaging an object |
JP2006047944A (en) | 2004-03-24 | 2006-02-16 | Fuji Photo Film Co Ltd | Photographing lens |
WO2005096218A1 (en) | 2004-03-31 | 2005-10-13 | Canon Kabushiki Kaisha | Imaging system performance measurement |
US7633511B2 (en) | 2004-04-01 | 2009-12-15 | Microsoft Corporation | Pop-up light field |
JP4665422B2 (en) | 2004-04-02 | 2011-04-06 | ソニー株式会社 | Imaging device |
US8634014B2 (en) | 2004-04-05 | 2014-01-21 | Hewlett-Packard Development Company, L.P. | Imaging device analysis systems and imaging device analysis methods |
US7091531B2 (en) | 2004-04-07 | 2006-08-15 | Micron Technology, Inc. | High dynamic range pixel amplifier |
US8049806B2 (en) | 2004-09-27 | 2011-11-01 | Digitaloptics Corporation East | Thin camera and associated methods |
US7620265B1 (en) | 2004-04-12 | 2009-11-17 | Equinox Corporation | Color invariant image fusion of visible and thermal infrared video |
JP2005303694A (en) | 2004-04-13 | 2005-10-27 | Konica Minolta Holdings Inc | Compound eye imaging device |
US7292735B2 (en) | 2004-04-16 | 2007-11-06 | Microsoft Corporation | Virtual image artifact detection |
US7773404B2 (en) | 2005-01-07 | 2010-08-10 | Invisage Technologies, Inc. | Quantum dot optical devices with enhanced gain and sensitivity and methods of making same |
US8218625B2 (en) | 2004-04-23 | 2012-07-10 | Dolby Laboratories Licensing Corporation | Encoding, decoding and representing high dynamic range images |
US20060034531A1 (en) | 2004-05-10 | 2006-02-16 | Seiko Epson Corporation | Block noise level evaluation method for compressed images and control method of imaging device utilizing the evaluation method |
US7355793B2 (en) | 2004-05-19 | 2008-04-08 | The Regents Of The University Of California | Optical system applicable to improving the dynamic range of Shack-Hartmann sensors |
US20050265633A1 (en) | 2004-05-25 | 2005-12-01 | Sarnoff Corporation | Low latency pyramid processor for image processing systems |
JP2005354124A (en) | 2004-06-08 | 2005-12-22 | Seiko Epson Corp | Production of high pixel density image from a plurality of low pixel density images |
US7330593B2 (en) | 2004-06-25 | 2008-02-12 | Stmicroelectronics, Inc. | Segment based image matching method and system |
JP4408755B2 (en) | 2004-06-28 | 2010-02-03 | Necエレクトロニクス株式会社 | Deinterleaving device, mobile communication terminal, and deinterleaving method |
JP4479373B2 (en) | 2004-06-28 | 2010-06-09 | ソニー株式会社 | Image sensor |
US7447382B2 (en) | 2004-06-30 | 2008-11-04 | Intel Corporation | Computing a higher resolution image from multiple lower resolution images using model-based, robust Bayesian estimation |
JP2006033228A (en) | 2004-07-14 | 2006-02-02 | Victor Co Of Japan Ltd | Picture imaging apparatus |
JP2006033493A (en) | 2004-07-16 | 2006-02-02 | Matsushita Electric Ind Co Ltd | Imaging apparatus |
US7189954B2 (en) | 2004-07-19 | 2007-03-13 | Micron Technology, Inc. | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers |
JP2006033570A (en) | 2004-07-20 | 2006-02-02 | Olympus Corp | Image generating device |
US8027531B2 (en) | 2004-07-21 | 2011-09-27 | The Board Of Trustees Of The Leland Stanford Junior University | Apparatus and method for capturing a scene using staggered triggering of dense camera arrays |
GB0416496D0 (en) | 2004-07-23 | 2004-08-25 | Council Of The Central Lab Of | Imaging device |
US7068432B2 (en) | 2004-07-27 | 2006-06-27 | Micron Technology, Inc. | Controlling lens shape in a microlens array |
US20060023197A1 (en) | 2004-07-27 | 2006-02-02 | Joel Andrew H | Method and system for automated production of autostereoscopic and animated prints and transparencies from digital and non-digital media |
DE102004036469A1 (en) | 2004-07-28 | 2006-02-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Camera module, array based thereon and method for its production |
US20060028476A1 (en) | 2004-08-03 | 2006-02-09 | Irwin Sobel | Method and system for providing extensive coverage of an object using virtual cameras |
JP2006050263A (en) | 2004-08-04 | 2006-02-16 | Olympus Corp | Image generation method and device |
US7430339B2 (en) | 2004-08-09 | 2008-09-30 | Microsoft Corporation | Border matting by dynamic programming |
US7609302B2 (en) | 2004-08-11 | 2009-10-27 | Micron Technology, Inc. | Correction of non-uniform sensitivity in an image array |
US7645635B2 (en) | 2004-08-16 | 2010-01-12 | Micron Technology, Inc. | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages |
US7061693B2 (en) | 2004-08-16 | 2006-06-13 | Xceed Imaging Ltd. | Optical method and system for extended depth of focus |
WO2006036398A2 (en) | 2004-08-23 | 2006-04-06 | Sarnoff Corporation | Method and apparatus for producing a fused image |
US7795577B2 (en) | 2004-08-25 | 2010-09-14 | Richard Ian Olsen | Lens frame and optical focus assembly for imager module |
US8124929B2 (en) | 2004-08-25 | 2012-02-28 | Protarius Filo Ag, L.L.C. | Imager module optical focus and assembly method |
US7916180B2 (en) | 2004-08-25 | 2011-03-29 | Protarius Filo Ag, L.L.C. | Simultaneous multiple field of view digital cameras |
US7564019B2 (en) | 2005-08-25 | 2009-07-21 | Richard Ian Olsen | Large dynamic range cameras |
CN101427372B (en) | 2004-08-25 | 2012-12-12 | 普罗塔里斯菲洛有限责任公司 | Apparatus for multiple camera devices and method of operating same |
CN100489599C (en) | 2004-08-26 | 2009-05-20 | 财团法人秋田企业活性化中心 | Liquid crystal lens |
JP4057597B2 (en) | 2004-08-26 | 2008-03-05 | 独立行政法人科学技術振興機構 | Optical element |
US20060046204A1 (en) | 2004-08-31 | 2006-03-02 | Sharp Laboratories Of America, Inc. | Directly patternable microlens |
US20060055811A1 (en) | 2004-09-14 | 2006-03-16 | Frtiz Bernard S | Imaging system having modules with adaptive optical elements |
US7145124B2 (en) | 2004-09-15 | 2006-12-05 | Raytheon Company | Multispectral imaging chip using photonic crystals |
JP3977368B2 (en) | 2004-09-30 | 2007-09-19 | クラリオン株式会社 | Parking assistance system |
DE102004049676A1 (en) | 2004-10-12 | 2006-04-20 | Infineon Technologies Ag | Method for computer-aided motion estimation in a plurality of temporally successive digital images, arrangement for computer-aided motion estimation, computer program element and computer-readable storage medium |
JP2006119368A (en) | 2004-10-21 | 2006-05-11 | Konica Minolta Opto Inc | Wide-angle optical system, imaging lens device, monitor camera and digital equipment |
JP4534715B2 (en) | 2004-10-22 | 2010-09-01 | 株式会社ニコン | Imaging apparatus and image processing program |
DE102004052994C5 (en) | 2004-11-03 | 2010-08-26 | Vistec Electron Beam Gmbh | Multi-beam modulator for a particle beam and use of the multi-beam modulator for maskless substrate structuring |
US7598996B2 (en) | 2004-11-16 | 2009-10-06 | Aptina Imaging Corporation | System and method for focusing a digital camera |
CN101111748B (en) | 2004-12-03 | 2014-12-17 | 弗卢克公司 | Visible light and ir combined image camera with a laser pointer |
US7483065B2 (en) | 2004-12-15 | 2009-01-27 | Aptina Imaging Corporation | Multi-lens imaging systems and methods using optical filters having mosaic patterns |
US8854486B2 (en) | 2004-12-17 | 2014-10-07 | Mitsubishi Electric Research Laboratories, Inc. | Method and system for processing multiview videos for view synthesis using skip and direct modes |
US7430312B2 (en) | 2005-01-07 | 2008-09-30 | Gesturetek, Inc. | Creating 3D images of objects by illuminating with infrared patterns |
US7073908B1 (en) | 2005-01-11 | 2006-07-11 | Anthony Italo Provitola | Enhancement of depth perception |
US7767949B2 (en) | 2005-01-18 | 2010-08-03 | Rearden, Llc | Apparatus and method for capturing still images and video using coded aperture techniques |
US7671321B2 (en) | 2005-01-18 | 2010-03-02 | Rearden, Llc | Apparatus and method for capturing still images and video using coded lens imaging techniques |
US7602997B2 (en) | 2005-01-19 | 2009-10-13 | The United States Of America As Represented By The Secretary Of The Army | Method of super-resolving images |
US7408627B2 (en) | 2005-02-08 | 2008-08-05 | Canesta, Inc. | Methods and system to quantify depth data accuracy in three-dimensional sensors using single frame capture |
US7965314B1 (en) | 2005-02-09 | 2011-06-21 | Flir Systems, Inc. | Foveal camera systems and methods |
US7561191B2 (en) | 2005-02-18 | 2009-07-14 | Eastman Kodak Company | Camera phone using multiple lenses and image sensors to provide an extended zoom range |
EP2230482B1 (en) | 2005-03-11 | 2013-10-30 | Creaform Inc. | Auto-referenced system and apparatus for three-dimensional scanning |
JP2006258930A (en) | 2005-03-15 | 2006-09-28 | Nikon Corp | Method for manufacturing microlens and method for manufacturing die for microlens |
WO2006102181A1 (en) | 2005-03-21 | 2006-09-28 | Massachusetts Institute Of Technology (Mit) | Real-time, continuous-wave terahertz imaging using a microbolometer focal-plane array |
WO2006100903A1 (en) | 2005-03-23 | 2006-09-28 | Matsushita Electric Industrial Co., Ltd. | On-vehicle imaging device |
US7880794B2 (en) | 2005-03-24 | 2011-02-01 | Panasonic Corporation | Imaging device including a plurality of lens elements and a imaging sensor |
US7297917B2 (en) | 2005-03-24 | 2007-11-20 | Micron Technology, Inc. | Readout technique for increasing or maintaining dynamic range in image sensors |
US7683950B2 (en) | 2005-04-26 | 2010-03-23 | Eastman Kodak Company | Method and apparatus for correcting a channel dependent color aberration in a digital image |
US7656428B2 (en) | 2005-05-05 | 2010-02-02 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Imaging device employing optical motion sensor as gyroscope |
EP1882449A4 (en) | 2005-05-18 | 2010-05-05 | Hitachi Medical Corp | Radiograph and image processing program |
US8411182B2 (en) | 2005-06-02 | 2013-04-02 | Xerox Corporation | System for controlling integration times of photosensors in an imaging device |
US7968888B2 (en) | 2005-06-08 | 2011-06-28 | Panasonic Corporation | Solid-state image sensor and manufacturing method thereof |
JP2006345233A (en) | 2005-06-09 | 2006-12-21 | Fujifilm Holdings Corp | Imaging device and digital camera |
KR100813961B1 (en) | 2005-06-14 | 2008-03-14 | 삼성전자주식회사 | Method and apparatus for transmitting and receiving of video, and transport stream structure thereof |
US7364306B2 (en) | 2005-06-20 | 2008-04-29 | Digital Display Innovations, Llc | Field sequential light source modulation for a digital display system |
JP4826152B2 (en) * | 2005-06-23 | 2011-11-30 | 株式会社ニコン | Image composition method and imaging apparatus |
US20070102622A1 (en) | 2005-07-01 | 2007-05-10 | Olsen Richard I | Apparatus for multiple camera devices and method of operating same |
JP4577126B2 (en) | 2005-07-08 | 2010-11-10 | オムロン株式会社 | Projection pattern generation apparatus and generation method for stereo correspondence |
US20090268983A1 (en) | 2005-07-25 | 2009-10-29 | The Regents Of The University Of California | Digital imaging system and method using multiple digital image sensors to produce large high-resolution gapless mosaic images |
US8384763B2 (en) | 2005-07-26 | 2013-02-26 | Her Majesty the Queen in right of Canada as represented by the Minster of Industry, Through the Communications Research Centre Canada | Generating a depth map from a two-dimensional source image for stereoscopic and multiview imaging |
JP4903705B2 (en) | 2005-07-26 | 2012-03-28 | パナソニック株式会社 | Compound-eye imaging device and manufacturing method thereof |
US7969488B2 (en) | 2005-08-03 | 2011-06-28 | Micron Technologies, Inc. | Correction of cluster defects in imagers |
US7929801B2 (en) | 2005-08-15 | 2011-04-19 | Sony Corporation | Depth information for auto focus using two pictures and two-dimensional Gaussian scale space theory |
US20070041391A1 (en) | 2005-08-18 | 2007-02-22 | Micron Technology, Inc. | Method and apparatus for controlling imager output data rate |
US20070040922A1 (en) | 2005-08-22 | 2007-02-22 | Micron Technology, Inc. | HDR/AB on multi-way shared pixels |
US20070258006A1 (en) | 2005-08-25 | 2007-11-08 | Olsen Richard I | Solid state camera optics frame and assembly |
US7964835B2 (en) | 2005-08-25 | 2011-06-21 | Protarius Filo Ag, L.L.C. | Digital cameras with direct luminance and chrominance detection |
US20070083114A1 (en) | 2005-08-26 | 2007-04-12 | The University Of Connecticut | Systems and methods for image resolution enhancement |
JP4804856B2 (en) | 2005-09-29 | 2011-11-02 | 富士フイルム株式会社 | Single focus lens |
WO2007036055A1 (en) | 2005-09-30 | 2007-04-05 | Simon Fraser University | Methods and apparatus for detecting defects in imaging arrays by image analysis |
WO2007044725A2 (en) | 2005-10-07 | 2007-04-19 | The Board Of Trustees Of The Leland Stanford Junior University | Microscopy arrangements and approaches |
JP4773179B2 (en) | 2005-10-14 | 2011-09-14 | 富士フイルム株式会社 | Imaging device |
US7806604B2 (en) | 2005-10-20 | 2010-10-05 | Honeywell International Inc. | Face detection and tracking in a wide field of view |
KR100730406B1 (en) | 2005-11-16 | 2007-06-19 | 광운대학교 산학협력단 | Three-dimensional display apparatus using intermediate elemental images |
JP4389865B2 (en) | 2005-11-17 | 2009-12-24 | ソニー株式会社 | SIGNAL PROCESSING DEVICE FOR SOLID-STATE IMAGING ELEMENT, SIGNAL PROCESSING METHOD, AND IMAGING DEVICE |
JP4887374B2 (en) | 2005-11-30 | 2012-02-29 | テレコム・イタリア・エッセ・ピー・アー | A method for obtaining scattered parallax field in stereo vision |
JP4516516B2 (en) | 2005-12-07 | 2010-08-04 | 本田技研工業株式会社 | Person detection device, person detection method, and person detection program |
JP4501855B2 (en) | 2005-12-22 | 2010-07-14 | ソニー株式会社 | Image signal processing apparatus, imaging apparatus, image signal processing method, and computer program |
JP2007180730A (en) | 2005-12-27 | 2007-07-12 | Eastman Kodak Co | Digital camera and data management method |
US7855786B2 (en) | 2006-01-09 | 2010-12-21 | Bae Systems Spectral Solutions Llc | Single camera multi-spectral imager |
US7675080B2 (en) | 2006-01-10 | 2010-03-09 | Aptina Imaging Corp. | Uniform color filter arrays in a moat |
WO2007083579A1 (en) | 2006-01-20 | 2007-07-26 | Matsushita Electric Industrial Co., Ltd. | Compound eye camera module and method of producing the same |
DE102006004802B4 (en) | 2006-01-23 | 2008-09-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Image acquisition system and method for producing at least one image capture system |
JP4834412B2 (en) | 2006-02-03 | 2011-12-14 | 富士フイルム株式会社 | Solid-state imaging device and electronic endoscope using the same |
US8133194B2 (en) | 2006-02-22 | 2012-03-13 | Henry Ford Health System | System and method for delivery of regional citrate anticoagulation to extracorporeal blood circuits |
US20070201859A1 (en) | 2006-02-24 | 2007-08-30 | Logitech Europe S.A. | Method and system for use of 3D sensors in an image capture device |
US7391572B2 (en) | 2006-03-01 | 2008-06-24 | International Business Machines Corporation | Hybrid optical/electronic structures fabricated by a common molding process |
US7924483B2 (en) | 2006-03-06 | 2011-04-12 | Smith Scott T | Fused multi-array color image sensor |
US7616254B2 (en) | 2006-03-16 | 2009-11-10 | Sony Corporation | Simple method for calculating camera defocus from an image scene |
US8360574B2 (en) | 2006-03-20 | 2013-01-29 | High Performance Optics, Inc. | High performance selective light wavelength filtering providing improved contrast sensitivity |
JP4615468B2 (en) | 2006-03-23 | 2011-01-19 | 富士フイルム株式会社 | Imaging device |
US7606484B1 (en) | 2006-03-23 | 2009-10-20 | Flir Systems, Inc. | Infrared and near-infrared camera hyperframing |
US7342212B2 (en) | 2006-03-31 | 2008-03-11 | Micron Technology, Inc. | Analog vertical sub-sampling in an active pixel sensor (APS) image sensor |
US7916934B2 (en) | 2006-04-04 | 2011-03-29 | Mitsubishi Electric Research Laboratories, Inc. | Method and system for acquiring, encoding, decoding and displaying 3D light fields |
US8044994B2 (en) | 2006-04-04 | 2011-10-25 | Mitsubishi Electric Research Laboratories, Inc. | Method and system for decoding and displaying 3D light fields |
CN101064780B (en) | 2006-04-30 | 2012-07-04 | 台湾新力国际股份有限公司 | Method and apparatus for improving image joint accuracy using lens distortion correction |
US20070263114A1 (en) | 2006-05-01 | 2007-11-15 | Microalign Technologies, Inc. | Ultra-thin digital imaging device of high resolution for mobile electronic devices and method of imaging |
US7580620B2 (en) | 2006-05-08 | 2009-08-25 | Mitsubishi Electric Research Laboratories, Inc. | Method for deblurring images using optimized temporal coding patterns |
US9736346B2 (en) | 2006-05-09 | 2017-08-15 | Stereo Display, Inc | Imaging system improving image resolution of the system with low resolution image sensor |
US7889264B2 (en) | 2006-05-12 | 2011-02-15 | Ricoh Co., Ltd. | End-to-end design of superresolution electro-optic imaging systems |
US7916362B2 (en) | 2006-05-22 | 2011-03-29 | Eastman Kodak Company | Image sensor with improved light sensitivity |
US8139142B2 (en) | 2006-06-01 | 2012-03-20 | Microsoft Corporation | Video manipulation of red, green, blue, distance (RGB-Z) data including segmentation, up-sampling, and background substitution techniques |
IES20070229A2 (en) | 2006-06-05 | 2007-10-03 | Fotonation Vision Ltd | Image acquisition method and apparatus |
US20070177004A1 (en) | 2006-06-08 | 2007-08-02 | Timo Kolehmainen | Image creating method and imaging device |
JP4631811B2 (en) | 2006-06-12 | 2011-02-16 | 株式会社日立製作所 | Imaging device |
JP5106870B2 (en) | 2006-06-14 | 2012-12-26 | 株式会社東芝 | Solid-state image sensor |
FR2902530A1 (en) | 2006-06-19 | 2007-12-21 | St Microelectronics Rousset | Polymer lens fabricating method for e.g. complementary MOS imager, involves realizing opaque zones on convex lens by degrading molecular structure of polymer material, where zones form diaphragm and diffraction network that forms filter |
TWI362550B (en) | 2007-06-21 | 2012-04-21 | Ether Precision Inc | The method for manufacturing the image captures unit |
US7925117B2 (en) | 2006-06-27 | 2011-04-12 | Honeywell International Inc. | Fusion of sensor data and synthetic data to form an integrated image |
KR100793369B1 (en) | 2006-07-06 | 2008-01-11 | 삼성전자주식회사 | Image sensor for improving the resolution and method of sensing the image for improving it |
US20080024683A1 (en) | 2006-07-31 | 2008-01-31 | Niranjan Damera-Venkata | Overlapped multi-projector system with dithering |
JP2008039852A (en) | 2006-08-01 | 2008-02-21 | Agc Techno Glass Co Ltd | Glass optical element and its manufacturing method |
US20080030592A1 (en) | 2006-08-01 | 2008-02-07 | Eastman Kodak Company | Producing digital image with different resolution portions |
US8406562B2 (en) | 2006-08-11 | 2013-03-26 | Geo Semiconductor Inc. | System and method for automated calibration and correction of display geometry and color |
EP1892688B1 (en) | 2006-08-24 | 2010-09-01 | Valeo Vision | Method for determining the passing of a vehicle in a bottleneck |
US8687087B2 (en) | 2006-08-29 | 2014-04-01 | Csr Technology Inc. | Digital camera with selectively increased dynamic range by control of parameters during image acquisition |
US8306063B2 (en) | 2006-08-29 | 2012-11-06 | EXFO Services Assurance, Inc. | Real-time transport protocol stream detection system and method |
KR100746360B1 (en) | 2006-08-31 | 2007-08-06 | 삼성전기주식회사 | Manufacturing method of stamper |
NO326372B1 (en) | 2006-09-21 | 2008-11-17 | Polight As | Polymer Lens |
WO2008039802A2 (en) | 2006-09-25 | 2008-04-03 | Ophthonix, Incorporated | Method for correction of chromatic aberration and achromatic lens |
JP4403162B2 (en) | 2006-09-29 | 2010-01-20 | 株式会社東芝 | Stereoscopic image display device and method for producing stereoscopic image |
US20080080028A1 (en) | 2006-10-02 | 2008-04-03 | Micron Technology, Inc. | Imaging method, apparatus and system having extended depth of field |
US8031258B2 (en) | 2006-10-04 | 2011-10-04 | Omnivision Technologies, Inc. | Providing multiple video signals from single sensor |
CN101600976B (en) | 2006-10-11 | 2011-11-09 | 珀莱特公司 | Design of compact adjustable lens |
EP2074445B1 (en) | 2006-10-11 | 2017-04-12 | poLight AS | Method for manufacturing adjustable lens |
US8073196B2 (en) | 2006-10-16 | 2011-12-06 | University Of Southern California | Detection and tracking of moving objects from a moving platform in presence of strong parallax |
US7702229B2 (en) | 2006-10-18 | 2010-04-20 | Eastman Kodak Company | Lens array assisted focus detection |
JP4349456B2 (en) | 2006-10-23 | 2009-10-21 | ソニー株式会社 | Solid-state image sensor |
US20100103175A1 (en) | 2006-10-25 | 2010-04-29 | Tokyo Institute Of Technology | Method for generating a high-resolution virtual-focal-plane image |
US7888159B2 (en) | 2006-10-26 | 2011-02-15 | Omnivision Technologies, Inc. | Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating |
JP4452951B2 (en) | 2006-11-02 | 2010-04-21 | 富士フイルム株式会社 | Distance image generation method and apparatus |
KR20080043106A (en) | 2006-11-13 | 2008-05-16 | 삼성전자주식회사 | Optical lens and manufacturing method thereof |
US8059162B2 (en) | 2006-11-15 | 2011-11-15 | Sony Corporation | Imaging apparatus and method, and method for designing imaging apparatus |
US20080118241A1 (en) | 2006-11-16 | 2008-05-22 | Tekolste Robert | Control of stray light in camera systems employing an optics stack and associated methods |
US8538166B2 (en) | 2006-11-21 | 2013-09-17 | Mantisvision Ltd. | 3D geometric modeling and 3D video content creation |
KR20080047002A (en) | 2006-11-24 | 2008-05-28 | 엘지이노텍 주식회사 | Lens assembly and method manufacturing the same for camera module |
US8559705B2 (en) | 2006-12-01 | 2013-10-15 | Lytro, Inc. | Interactive refocusing of electronic images |
US20100265385A1 (en) | 2009-04-18 | 2010-10-21 | Knight Timothy J | Light Field Camera Image, File and Configuration Data, and Methods of Using, Storing and Communicating Same |
JP4406937B2 (en) | 2006-12-01 | 2010-02-03 | 富士フイルム株式会社 | Imaging device |
JP5040493B2 (en) | 2006-12-04 | 2012-10-03 | ソニー株式会社 | Imaging apparatus and imaging method |
US8242426B2 (en) | 2006-12-12 | 2012-08-14 | Dolby Laboratories Licensing Corporation | Electronic camera having multiple sensors for capturing high dynamic range images and related methods |
US7646549B2 (en) | 2006-12-18 | 2010-01-12 | Xceed Imaging Ltd | Imaging system and method for providing extended depth of focus, range extraction and super resolved imaging |
US8213500B2 (en) | 2006-12-21 | 2012-07-03 | Sharp Laboratories Of America, Inc. | Methods and systems for processing film grain noise |
TWI324015B (en) | 2006-12-22 | 2010-04-21 | Ind Tech Res Inst | Autofocus searching method |
US8103111B2 (en) | 2006-12-26 | 2012-01-24 | Olympus Imaging Corp. | Coding method, electronic camera, recording medium storing coded program, and decoding method |
US20080158259A1 (en) | 2006-12-28 | 2008-07-03 | Texas Instruments Incorporated | Image warping and lateral color correction |
US7973823B2 (en) | 2006-12-29 | 2011-07-05 | Nokia Corporation | Method and system for image pre-processing |
US20080158698A1 (en) | 2006-12-29 | 2008-07-03 | Chao-Chi Chang | Lens barrel array and lens array and the method of making the same |
US20080165257A1 (en) | 2007-01-05 | 2008-07-10 | Micron Technology, Inc. | Configurable pixel array system and method |
US8655052B2 (en) | 2007-01-26 | 2014-02-18 | Intellectual Discovery Co., Ltd. | Methodology for 3D scene reconstruction from 2D image sequences |
JP5024992B2 (en) | 2007-02-02 | 2012-09-12 | 株式会社ジャパンディスプレイセントラル | Display device |
US7792423B2 (en) | 2007-02-06 | 2010-09-07 | Mitsubishi Electric Research Laboratories, Inc. | 4D light field cameras |
CN100585453C (en) | 2007-02-09 | 2010-01-27 | 奥林巴斯映像株式会社 | Decoding method and decoding apparatus |
JP4386083B2 (en) | 2007-02-27 | 2009-12-16 | トヨタ自動車株式会社 | Parking assistance device |
JP4153013B1 (en) | 2007-03-06 | 2008-09-17 | シャープ株式会社 | Imaging lens, imaging unit, and portable information terminal including the same |
US7755679B2 (en) | 2007-03-07 | 2010-07-13 | Altasens, Inc. | Apparatus and method for reducing edge effect in an image sensor |
US7729602B2 (en) | 2007-03-09 | 2010-06-01 | Eastman Kodak Company | Camera using multiple lenses and image sensors operable in a default imaging mode |
US7859588B2 (en) | 2007-03-09 | 2010-12-28 | Eastman Kodak Company | Method and apparatus for operating a dual lens camera to augment an image |
US7683962B2 (en) | 2007-03-09 | 2010-03-23 | Eastman Kodak Company | Camera using multiple lenses and image sensors in a rangefinder configuration to provide a range map |
US7676146B2 (en) | 2007-03-09 | 2010-03-09 | Eastman Kodak Company | Camera using multiple lenses and image sensors to provide improved focusing capability |
JP4915859B2 (en) | 2007-03-26 | 2012-04-11 | 船井電機株式会社 | Object distance deriving device |
JP2008242658A (en) | 2007-03-26 | 2008-10-09 | Funai Electric Co Ltd | Three-dimensional object imaging apparatus |
US7738017B2 (en) | 2007-03-27 | 2010-06-15 | Aptina Imaging Corporation | Method and apparatus for automatic linear shift parallax correction for multi-array image systems |
US8165418B2 (en) | 2007-03-30 | 2012-04-24 | Brother Kogyo Kabushiki Kaisha | Image processor |
US8493496B2 (en) | 2007-04-02 | 2013-07-23 | Primesense Ltd. | Depth mapping using projected patterns |
US8098941B2 (en) | 2007-04-03 | 2012-01-17 | Aptina Imaging Corporation | Method and apparatus for parallelization of image compression encoders |
US8213711B2 (en) | 2007-04-03 | 2012-07-03 | Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Industry, Through The Communications Research Centre Canada | Method and graphical user interface for modifying depth maps |
CN101281282A (en) | 2007-04-04 | 2008-10-08 | 鸿富锦精密工业(深圳)有限公司 | Lens module |
JP2008258885A (en) | 2007-04-04 | 2008-10-23 | Texas Instr Japan Ltd | Imaging apparatus and driving method of imaging apparatus |
EP2432015A1 (en) | 2007-04-18 | 2012-03-21 | Invisage Technologies, Inc. | Materials, systems and methods for optoelectronic devices |
WO2009023044A2 (en) | 2007-04-24 | 2009-02-19 | 21 Ct, Inc. | Method and system for fast dense stereoscopic ranging |
KR100869219B1 (en) | 2007-05-03 | 2008-11-18 | 동부일렉트로닉스 주식회사 | Image Sensor and Method for Manufacturing thereof |
US8462220B2 (en) | 2007-05-09 | 2013-06-11 | Aptina Imaging Corporation | Method and apparatus for improving low-light performance for small pixel image sensors |
US7812869B2 (en) | 2007-05-11 | 2010-10-12 | Aptina Imaging Corporation | Configurable pixel array system and method |
JP4341695B2 (en) | 2007-05-17 | 2009-10-07 | ソニー株式会社 | Image input processing device, imaging signal processing circuit, and imaging signal noise reduction method |
JP4337911B2 (en) | 2007-05-24 | 2009-09-30 | ソニー株式会社 | Imaging device, imaging circuit, and imaging method |
US20080298674A1 (en) | 2007-05-29 | 2008-12-04 | Image Masters Inc. | Stereoscopic Panoramic imaging system |
US7733575B2 (en) | 2007-05-31 | 2010-06-08 | Artificial Muscle, Inc. | Optical systems employing compliant electroactive materials |
US8290358B1 (en) | 2007-06-25 | 2012-10-16 | Adobe Systems Incorporated | Methods and apparatus for light-field imaging |
KR101545008B1 (en) | 2007-06-26 | 2015-08-18 | 코닌클리케 필립스 엔.브이. | Method and system for encoding a 3d video signal, enclosed 3d video signal, method and system for decoder for a 3d video signal |
US8125619B2 (en) | 2007-07-25 | 2012-02-28 | Eminent Electronic Technology Corp. | Integrated ambient light sensor and distance sensor |
JP5006727B2 (en) | 2007-07-26 | 2012-08-22 | 株式会社リコー | Image processing apparatus and digital camera |
US8559756B2 (en) | 2007-08-06 | 2013-10-15 | Adobe Systems Incorporated | Radiance processing by demultiplexing in the frequency domain |
EP2034338A1 (en) | 2007-08-11 | 2009-03-11 | ETH Zurich | Liquid Lens System |
EP2026563A1 (en) | 2007-08-14 | 2009-02-18 | Deutsche Thomson OHG | System and method for detecting defective pixels |
US7782364B2 (en) | 2007-08-21 | 2010-08-24 | Aptina Imaging Corporation | Multi-array sensor with integrated sub-array for parallax detection and photometer functionality |
AT505690B1 (en) | 2007-08-31 | 2012-09-15 | Zentrum Fuer Biomedizinische Technologie Der Donau Uni Krems | METHOD OF DETERMINING ION CONCENTRATION IN CITRATE ANTICOAGULATED EXTRACORPORAL BLOOD CLEANING |
US7973834B2 (en) | 2007-09-24 | 2011-07-05 | Jianwen Yang | Electro-optical foveated imaging and tracking system |
US20090086074A1 (en) | 2007-09-27 | 2009-04-02 | Omnivision Technologies, Inc. | Dual mode camera solution apparatus, system, and method |
US7940311B2 (en) | 2007-10-03 | 2011-05-10 | Nokia Corporation | Multi-exposure pattern for enhancing dynamic range of images |
JP5172267B2 (en) | 2007-10-09 | 2013-03-27 | 富士フイルム株式会社 | Imaging device |
US8049289B2 (en) | 2007-10-11 | 2011-11-01 | Dongbu Hitek Co., Ltd. | Image sensor and method for manufacturing the same |
US7956924B2 (en) | 2007-10-18 | 2011-06-07 | Adobe Systems Incorporated | Fast computational camera based on two arrays of lenses |
US7920193B2 (en) | 2007-10-23 | 2011-04-05 | Aptina Imaging Corporation | Methods, systems and apparatuses using barrier self-calibration for high dynamic range imagers |
US7777804B2 (en) | 2007-10-26 | 2010-08-17 | Omnivision Technologies, Inc. | High dynamic range sensor with reduced line memory for color interpolation |
WO2009061814A2 (en) | 2007-11-05 | 2009-05-14 | University Of Florida Research Foundation, Inc. | Lossless data compression and real-time decompression |
US20090128644A1 (en) | 2007-11-15 | 2009-05-21 | Camp Jr William O | System and method for generating a photograph |
US7852461B2 (en) | 2007-11-15 | 2010-12-14 | Microsoft International Holdings B.V. | Dual mode depth imaging |
US8351685B2 (en) | 2007-11-16 | 2013-01-08 | Gwangju Institute Of Science And Technology | Device and method for estimating depth map, and method for generating intermediate image and method for encoding multi-view video using the same |
US8126279B2 (en) | 2007-11-19 | 2012-02-28 | The University Of Arizona | Lifting-based view compensated compression and remote visualization of volume rendered images |
JP5010445B2 (en) | 2007-11-29 | 2012-08-29 | パナソニック株式会社 | Manufacturing method of mold for microlens array |
KR20090055803A (en) | 2007-11-29 | 2009-06-03 | 광주과학기술원 | Method and apparatus for generating multi-viewpoint depth map, method for generating disparity of multi-viewpoint image |
GB2455316B (en) | 2007-12-04 | 2012-08-15 | Sony Corp | Image processing apparatus and method |
US8384803B2 (en) | 2007-12-13 | 2013-02-26 | Keigo Iizuka | Camera system and method for amalgamating images to create an omni-focused image |
TWI353778B (en) | 2007-12-21 | 2011-12-01 | Ind Tech Res Inst | Moving object detection apparatus and method |
US7880807B2 (en) | 2007-12-26 | 2011-02-01 | Sony Ericsson Mobile Communications Ab | Camera system with mirror arrangement for generating self-portrait panoramic pictures |
TWI362628B (en) | 2007-12-28 | 2012-04-21 | Ind Tech Res Inst | Methof for producing an image with depth by using 2d image |
US20110031381A1 (en) | 2007-12-28 | 2011-02-10 | Hiok-Nam Tay | Light guide array for an image sensor |
JP4413261B2 (en) | 2008-01-10 | 2010-02-10 | シャープ株式会社 | Imaging apparatus and optical axis control method |
JP5198295B2 (en) | 2008-01-15 | 2013-05-15 | 富士フイルム株式会社 | Image sensor position adjustment method, camera module manufacturing method and apparatus, and camera module |
US7962033B2 (en) | 2008-01-23 | 2011-06-14 | Adobe Systems Incorporated | Methods and apparatus for full-resolution light-field capture and rendering |
US8189065B2 (en) | 2008-01-23 | 2012-05-29 | Adobe Systems Incorporated | Methods and apparatus for full-resolution light-field capture and rendering |
JP4956452B2 (en) | 2008-01-25 | 2012-06-20 | 富士重工業株式会社 | Vehicle environment recognition device |
US8824833B2 (en) | 2008-02-01 | 2014-09-02 | Omnivision Technologies, Inc. | Image data fusion systems and methods |
GB0802290D0 (en) | 2008-02-08 | 2008-03-12 | Univ Kent Canterbury | Camera adapter based optical imaging apparatus |
US8319301B2 (en) | 2008-02-11 | 2012-11-27 | Omnivision Technologies, Inc. | Self-aligned filter for an image sensor |
JP2009206922A (en) | 2008-02-28 | 2009-09-10 | Funai Electric Co Ltd | Compound-eye imaging apparatus |
CN101520532A (en) | 2008-02-29 | 2009-09-02 | 鸿富锦精密工业(深圳)有限公司 | Composite lens |
DE112009000480T5 (en) | 2008-03-03 | 2011-04-07 | VideoIQ, Inc., Bedford | Dynamic object classification |
WO2009119229A1 (en) | 2008-03-26 | 2009-10-01 | コニカミノルタホールディングス株式会社 | Three-dimensional imaging device and method for calibrating three-dimensional imaging device |
US8497905B2 (en) | 2008-04-11 | 2013-07-30 | nearmap australia pty ltd. | Systems and methods of capturing large area images in detail including cascaded cameras and/or calibration features |
US8259208B2 (en) | 2008-04-15 | 2012-09-04 | Sony Corporation | Method and apparatus for performing touch-based adjustments within imaging devices |
US7843554B2 (en) | 2008-04-25 | 2010-11-30 | Rockwell Collins, Inc. | High dynamic range sensor system and method |
US8280194B2 (en) | 2008-04-29 | 2012-10-02 | Sony Corporation | Reduced hardware implementation for a two-picture depth map algorithm |
US8155456B2 (en) | 2008-04-29 | 2012-04-10 | Adobe Systems Incorporated | Method and apparatus for block-based compression of light-field images |
US8724921B2 (en) | 2008-05-05 | 2014-05-13 | Aptina Imaging Corporation | Method of capturing high dynamic range images with objects in the scene |
EP2283644A4 (en) | 2008-05-09 | 2011-10-26 | Ecole Polytech | Image sensor having nonlinear response |
US8208543B2 (en) | 2008-05-19 | 2012-06-26 | Microsoft Corporation | Quantization and differential coding of alpha image data |
US8866920B2 (en) | 2008-05-20 | 2014-10-21 | Pelican Imaging Corporation | Capturing and processing of images using monolithic camera array with heterogeneous imagers |
US8125559B2 (en) | 2008-05-25 | 2012-02-28 | Avistar Communications Corporation | Image formation for large photosensor array surfaces |
US8131097B2 (en) | 2008-05-28 | 2012-03-06 | Aptina Imaging Corporation | Method and apparatus for extended depth-of-field image restoration |
US8244058B1 (en) | 2008-05-30 | 2012-08-14 | Adobe Systems Incorporated | Method and apparatus for managing artifacts in frequency domain processing of light-field images |
JP2009300268A (en) | 2008-06-13 | 2009-12-24 | Nippon Hoso Kyokai <Nhk> | Three-dimensional information detection device |
KR20100002032A (en) | 2008-06-24 | 2010-01-06 | 삼성전자주식회사 | Image generating method, image processing method, and apparatus thereof |
US7710667B2 (en) | 2008-06-25 | 2010-05-04 | Aptina Imaging Corp. | Imaging module with symmetrical lens system and method of manufacture |
JPWO2009157273A1 (en) | 2008-06-25 | 2011-12-08 | コニカミノルタオプト株式会社 | Imaging optical system and manufacturing method of imaging lens |
KR101000531B1 (en) | 2008-06-26 | 2010-12-14 | 에스디씨마이크로 주식회사 | CCTV Management System Supporting Extended Data Transmission Coverage with Wireless LAN |
US7916396B2 (en) | 2008-06-27 | 2011-03-29 | Micron Technology, Inc. | Lens master devices, lens structures, imaging devices, and methods and apparatuses of making the same |
US8326069B2 (en) | 2008-06-30 | 2012-12-04 | Intel Corporation | Computing higher resolution images from multiple lower resolution images |
US7773317B2 (en) | 2008-07-01 | 2010-08-10 | Aptina Imaging Corp. | Lens system with symmetrical optics |
US7920339B2 (en) | 2008-07-02 | 2011-04-05 | Aptina Imaging Corporation | Method and apparatus providing singlet wafer lens system with field flattener |
US8456517B2 (en) | 2008-07-09 | 2013-06-04 | Primesense Ltd. | Integrated processor for 3D mapping |
KR101445185B1 (en) | 2008-07-10 | 2014-09-30 | 삼성전자주식회사 | Flexible Image Photographing Apparatus with a plurality of image forming units and Method for manufacturing the same |
CN101656259A (en) | 2008-08-20 | 2010-02-24 | 鸿富锦精密工业(深圳)有限公司 | Image sensor packaging structure, packaging method and camera module |
JP5105482B2 (en) | 2008-09-01 | 2012-12-26 | 船井電機株式会社 | Optical condition design method and compound eye imaging apparatus |
EP2329315A4 (en) | 2008-09-01 | 2012-01-18 | Lensvector Inc | Wafer-level fabrication of liquid crystal optoelectronic devices |
US8098297B2 (en) | 2008-09-03 | 2012-01-17 | Sony Corporation | Pre- and post-shutter signal image capture and sort for digital camera |
KR20100028344A (en) | 2008-09-04 | 2010-03-12 | 삼성전자주식회사 | Method and apparatus for editing image of portable terminal |
JP5238429B2 (en) | 2008-09-25 | 2013-07-17 | 株式会社東芝 | Stereoscopic image capturing apparatus and stereoscopic image capturing system |
US8553093B2 (en) | 2008-09-30 | 2013-10-08 | Sony Corporation | Method and apparatus for super-resolution imaging using digital imaging devices |
US9064476B2 (en) | 2008-10-04 | 2015-06-23 | Microsoft Technology Licensing, Llc | Image super-resolution using gradient profile prior |
US8310525B2 (en) | 2008-10-07 | 2012-11-13 | Seiko Epson Corporation | One-touch projector alignment for 3D stereo display |
US8355534B2 (en) | 2008-10-15 | 2013-01-15 | Spinella Ip Holdings, Inc. | Digital processing method and system for determination of optical flow |
JP2010096723A (en) | 2008-10-20 | 2010-04-30 | Funai Electric Co Ltd | Device for deriving distance of object |
US8436909B2 (en) | 2008-10-21 | 2013-05-07 | Stmicroelectronics S.R.L. | Compound camera sensor and related method of processing digital images |
US8913657B2 (en) | 2008-10-27 | 2014-12-16 | Lg Electronics Inc. | Virtual view image synthesis method and apparatus |
US8063975B2 (en) | 2008-10-29 | 2011-11-22 | Jabil Circuit, Inc. | Positioning wafer lenses on electronic imagers |
KR101502597B1 (en) | 2008-11-13 | 2015-03-13 | 삼성전자주식회사 | Wide depth of field 3d display apparatus and method |
WO2010057081A1 (en) | 2008-11-14 | 2010-05-20 | The Scripps Research Institute | Image analysis platform for identifying artifacts in samples and laboratory consumables |
AU2008246243B2 (en) | 2008-11-19 | 2011-12-22 | Canon Kabushiki Kaisha | DVC as generic file format for plenoptic camera |
US8279325B2 (en) | 2008-11-25 | 2012-10-02 | Lytro, Inc. | System and method for acquiring, editing, generating and outputting video data |
US8289440B2 (en) | 2008-12-08 | 2012-10-16 | Lytro, Inc. | Light field data acquisition devices, and methods of using and manufacturing same |
US8013904B2 (en) | 2008-12-09 | 2011-09-06 | Seiko Epson Corporation | View projection matrix based high performance low latency display pipeline |
US8149323B2 (en) | 2008-12-18 | 2012-04-03 | Qualcomm Incorporated | System and method to autofocus assisted by autoexposure control |
JP4631966B2 (en) | 2008-12-22 | 2011-02-16 | ソニー株式会社 | Image processing apparatus, image processing method, and program |
CN101770060B (en) | 2008-12-27 | 2014-03-26 | 鸿富锦精密工业(深圳)有限公司 | Camera module and assembly method thereof |
US8405742B2 (en) | 2008-12-30 | 2013-03-26 | Massachusetts Institute Of Technology | Processing images having different focus |
US20100177411A1 (en) | 2009-01-09 | 2010-07-15 | Shashikant Hegde | Wafer level lens replication on micro-electrical-mechanical systems |
WO2010081010A2 (en) | 2009-01-09 | 2010-07-15 | New York University | Methods, computer-accessible medium and systems for facilitating dark flash photography |
US8315476B1 (en) | 2009-01-20 | 2012-11-20 | Adobe Systems Incorporated | Super-resolution with the focused plenoptic camera |
US8189089B1 (en) | 2009-01-20 | 2012-05-29 | Adobe Systems Incorporated | Methods and apparatus for reducing plenoptic camera artifacts |
US8300108B2 (en) | 2009-02-02 | 2012-10-30 | L-3 Communications Cincinnati Electronics Corporation | Multi-channel imaging devices comprising unit cells |
US8290301B2 (en) | 2009-02-06 | 2012-10-16 | Raytheon Company | Optimized imaging system for collection of high resolution imagery |
KR101776955B1 (en) | 2009-02-10 | 2017-09-08 | 소니 주식회사 | Solid-state imaging device, method of manufacturing the same, and electronic apparatus |
WO2010095440A1 (en) | 2009-02-20 | 2010-08-26 | パナソニック株式会社 | Recording medium, reproduction device, and integrated circuit |
US8520970B2 (en) | 2010-04-23 | 2013-08-27 | Flir Systems Ab | Infrared resolution and contrast enhancement with fusion |
KR20100099896A (en) | 2009-03-04 | 2010-09-15 | 삼성전자주식회사 | Metadata generating method and apparatus, and image processing method and apparatus using the metadata |
US8207759B2 (en) | 2009-03-12 | 2012-06-26 | Fairchild Semiconductor Corporation | MIPI analog switch for automatic selection of multiple inputs based on clock voltages |
WO2010108119A2 (en) | 2009-03-19 | 2010-09-23 | Flextronics Ap, Llc | Dual sensor camera |
US8450821B2 (en) | 2009-03-26 | 2013-05-28 | Micron Technology, Inc. | Method and apparatus providing combined spacer and optical lens element |
US8106949B2 (en) | 2009-03-26 | 2012-01-31 | Seiko Epson Corporation | Small memory footprint light transport matrix capture |
JP4529010B1 (en) | 2009-03-30 | 2010-08-25 | シャープ株式会社 | Imaging device |
WO2010116367A1 (en) | 2009-04-07 | 2010-10-14 | Nextvision Stabilized Systems Ltd | Continuous electronic zoom for an imaging system with multiple imaging devices having different fixed fov |
US20100259610A1 (en) | 2009-04-08 | 2010-10-14 | Celsia, Llc | Two-Dimensional Display Synced with Real World Object Movement |
US8294099B2 (en) | 2009-04-10 | 2012-10-23 | Bae Systems Information And Electronic Systems Integration Inc. | On-wafer butted microbolometer imaging array |
US8717417B2 (en) | 2009-04-16 | 2014-05-06 | Primesense Ltd. | Three-dimensional mapping and imaging |
JP5463718B2 (en) | 2009-04-16 | 2014-04-09 | ソニー株式会社 | Imaging device |
US8908058B2 (en) | 2009-04-18 | 2014-12-09 | Lytro, Inc. | Storage and transmission of pictures including multiple frames |
US20120249550A1 (en) | 2009-04-18 | 2012-10-04 | Lytro, Inc. | Selective Transmission of Image Data Based on Device Attributes |
EP2244484B1 (en) | 2009-04-22 | 2012-03-28 | Raytrix GmbH | Digital imaging method for synthesizing an image using data recorded with a plenoptic camera |
CN101527046B (en) | 2009-04-28 | 2012-09-05 | 青岛海信数字多媒体技术国家重点实验室有限公司 | Motion detection method, device and system |
KR101671021B1 (en) | 2009-04-30 | 2016-11-10 | 삼성전자주식회사 | Apparatus and method for transmitting stereoscopic image effectively |
US8271544B2 (en) | 2009-05-01 | 2012-09-18 | Creative Technology Ltd | Data file having more than one mode of operation |
US8203633B2 (en) | 2009-05-27 | 2012-06-19 | Omnivision Technologies, Inc. | Four-channel color filter array pattern |
KR20100130423A (en) | 2009-06-03 | 2010-12-13 | 삼성전자주식회사 | Wafer-level lens module and image module including the same |
US8766808B2 (en) | 2010-03-09 | 2014-07-01 | Flir Systems, Inc. | Imager with multiple sensor arrays |
CN101931742B (en) | 2009-06-18 | 2013-04-24 | 鸿富锦精密工业(深圳)有限公司 | Image sensing module and image capture module |
US20100321640A1 (en) | 2009-06-22 | 2010-12-23 | Industrial Technology Research Institute | Projection display chip |
WO2011008443A2 (en) | 2009-06-29 | 2011-01-20 | Lensvector Inc. | Wafer level camera module with active optical element |
JP2011030184A (en) | 2009-07-01 | 2011-02-10 | Sony Corp | Image processing apparatus, and image processing method |
US8212197B2 (en) | 2009-07-02 | 2012-07-03 | Xerox Corporation | Image sensor with integration time compensation |
JP2011017764A (en) | 2009-07-07 | 2011-01-27 | Konica Minolta Opto Inc | Imaging lens, imaging apparatus and portable terminal |
US8345144B1 (en) | 2009-07-15 | 2013-01-01 | Adobe Systems Incorporated | Methods and apparatus for rich image capture with focused plenoptic cameras |
US20110019243A1 (en) | 2009-07-21 | 2011-01-27 | Constant Jr Henry J | Stereoscopic form reader |
CN101964866B (en) | 2009-07-24 | 2013-03-20 | 鸿富锦精密工业(深圳)有限公司 | Computation and image pickup type digital camera |
US8436893B2 (en) | 2009-07-31 | 2013-05-07 | 3Dmedia Corporation | Methods, systems, and computer-readable storage media for selecting image capture positions to generate three-dimensional (3D) images |
US8577183B2 (en) | 2009-08-05 | 2013-11-05 | Raytheon Company | Resolution on demand |
WO2011018678A1 (en) | 2009-08-11 | 2011-02-17 | Ether Precision, Inc. | Method and device for aligning a lens with an optical system |
WO2011017806A1 (en) | 2009-08-14 | 2011-02-17 | Genesis Group Inc. | Real-time image and video matting |
JP2011044801A (en) | 2009-08-19 | 2011-03-03 | Toshiba Corp | Image processor |
US8154632B2 (en) | 2009-08-24 | 2012-04-10 | Lifesize Communications, Inc. | Detection of defective pixels in an image sensor |
KR101680300B1 (en) | 2009-08-31 | 2016-11-28 | 삼성전자주식회사 | Liquid lens and method for manufacturing the same |
US9274699B2 (en) | 2009-09-03 | 2016-03-01 | Obscura Digital | User interface for a large scale multi-user, multi-touch system |
US8411146B2 (en) | 2009-09-04 | 2013-04-02 | Lockheed Martin Corporation | Single camera color and infrared polarimetric imaging |
FR2950153B1 (en) | 2009-09-15 | 2011-12-23 | Commissariat Energie Atomique | OPTICAL DEVICE WITH DEFORMABLE MEMBRANE WITH PIEZOELECTRIC ACTUATION |
US20140076336A1 (en) | 2009-09-17 | 2014-03-20 | Ascentia Health, Inc. | Ear insert for relief of tmj discomfort and headaches |
BR112012007115A2 (en) | 2009-10-02 | 2020-02-27 | Koninklijke Philips Electronics N.V. | METHOD OF ENCODING A 3D VIDEO DATA SIGNAL, METHOD OF DECODING A 3D VIDEO SIGNAL, ENCODER FOR ENCODING A 3D VIDEO DATA SIGNAL, DECODER FOR DECODING A 3D VIDEO DATA SIGNAL, COMPUTER PROGRAM PRODUCT FOR PRODUCT ENCODE A VIDEO DATA SIGNAL, COMPUTER PROGRAM PRODUCT TO DECODE A VIDEO SIGNAL, 3D VIDEO DATA SIGNAL, AND DIGITAL DATA HOLDER |
US8199165B2 (en) | 2009-10-14 | 2012-06-12 | Hewlett-Packard Development Company, L.P. | Methods and systems for object segmentation in digital images |
DE102009049387B4 (en) | 2009-10-14 | 2016-05-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Apparatus, image processing apparatus and method for optical imaging |
BR112012008988B1 (en) | 2009-10-14 | 2022-07-12 | Dolby International Ab | METHOD, NON-TRANSITORY LEGIBLE MEDIUM AND DEPTH MAP PROCESSING APPARATUS |
US8502909B2 (en) | 2009-10-19 | 2013-08-06 | Pixar | Super light-field lens |
US8546737B2 (en) | 2009-10-30 | 2013-10-01 | Invisage Technologies, Inc. | Systems and methods for color binning |
CN102576154A (en) | 2009-10-30 | 2012-07-11 | 惠普发展公司,有限责任合伙企业 | Stereo display systems |
WO2011055655A1 (en) | 2009-11-05 | 2011-05-12 | コニカミノルタオプト株式会社 | Image pickup device, optical unit, wafer lens laminated body, and method for manufacturing wafer lens laminated body |
CN102597693B (en) | 2009-11-13 | 2015-04-01 | 富士胶片株式会社 | Distance measuring device, distance measuring method, distance measuring program, distance measuring system, and image capturing device |
JP5399215B2 (en) | 2009-11-18 | 2014-01-29 | シャープ株式会社 | Multi-lens camera device and electronic information device |
WO2011063347A2 (en) | 2009-11-20 | 2011-05-26 | Pelican Imaging Corporation | Capturing and processing of images using monolithic camera array with heterogeneous imagers |
US8497934B2 (en) | 2009-11-25 | 2013-07-30 | Massachusetts Institute Of Technology | Actively addressable aperture light field camera |
KR101608970B1 (en) | 2009-11-27 | 2016-04-05 | 삼성전자주식회사 | Apparatus and method for processing image using light field data |
US8400555B1 (en) | 2009-12-01 | 2013-03-19 | Adobe Systems Incorporated | Focused plenoptic camera employing microlenses with different focal lengths |
US8730338B2 (en) * | 2009-12-01 | 2014-05-20 | Nokia Corporation | Set of camera modules hinged on a body and functionally connected to a single actuator |
JP5446797B2 (en) | 2009-12-04 | 2014-03-19 | 株式会社リコー | Imaging device |
US8446492B2 (en) | 2009-12-10 | 2013-05-21 | Honda Motor Co., Ltd. | Image capturing device, method of searching for occlusion region, and program |
JP5387377B2 (en) | 2009-12-14 | 2014-01-15 | ソニー株式会社 | Image processing apparatus, image processing method, and program |
US9030530B2 (en) | 2009-12-15 | 2015-05-12 | Thomson Licensing | Stereo-image quality and disparity/depth indications |
US20110153248A1 (en) | 2009-12-23 | 2011-06-23 | Yeming Gu | Ophthalmic quality metric system |
US8885067B2 (en) | 2009-12-24 | 2014-11-11 | Sharp Kabushiki Kaisha | Multocular image pickup apparatus and multocular image pickup method |
JP4983905B2 (en) | 2009-12-25 | 2012-07-25 | カシオ計算機株式会社 | Imaging apparatus, 3D modeling data generation method, and program |
KR101643607B1 (en) | 2009-12-30 | 2016-08-10 | 삼성전자주식회사 | Method and apparatus for generating of image data |
CN102118551A (en) | 2009-12-31 | 2011-07-06 | 鸿富锦精密工业(深圳)有限公司 | Imaging device |
CN102131044B (en) | 2010-01-20 | 2014-03-26 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
US8649008B2 (en) | 2010-02-04 | 2014-02-11 | University Of Southern California | Combined spectral and polarimetry imaging and diagnostics |
US8648918B2 (en) | 2010-02-18 | 2014-02-11 | Sony Corporation | Method and system for obtaining a point spread function using motion information |
CN103210641B (en) | 2010-02-19 | 2017-03-15 | 双光圈国际株式会社 | Process multi-perture image data |
KR101802238B1 (en) | 2010-02-23 | 2017-11-29 | 삼성전자주식회사 | Apparatus and method for generating a three-dimension image data in portable terminal |
WO2011105814A2 (en) | 2010-02-23 | 2011-09-01 | 삼성전자 주식회사 | Method and apparatus for providing a multi-view still image service, and method and apparatus for receiving a multi-view still image service |
JP2013521576A (en) | 2010-02-28 | 2013-06-10 | オスターハウト グループ インコーポレイテッド | Local advertising content on interactive head-mounted eyepieces |
US8817015B2 (en) | 2010-03-03 | 2014-08-26 | Adobe Systems Incorporated | Methods, apparatus, and computer-readable storage media for depth-based rendering of focused plenoptic camera data |
US20110221950A1 (en) | 2010-03-12 | 2011-09-15 | Doeke Jolt Oostra | Camera device, wafer scale package |
EP2548071A1 (en) | 2010-03-17 | 2013-01-23 | Pelican Imaging Corporation | Fabrication process for mastering imaging lens arrays |
CN102282857B (en) | 2010-03-19 | 2014-03-12 | 富士胶片株式会社 | Imaging device and method |
WO2011116345A1 (en) | 2010-03-19 | 2011-09-22 | Invisage Technologies, Inc. | Dark current reduction in image sensors via dynamic electrical biasing |
JP5679978B2 (en) | 2010-03-19 | 2015-03-04 | パナソニックIpマネジメント株式会社 | Stereoscopic image alignment apparatus, stereoscopic image alignment method, and program thereof |
US20110242342A1 (en) | 2010-04-05 | 2011-10-06 | Qualcomm Incorporated | Combining data from multiple image sensors |
US8896668B2 (en) | 2010-04-05 | 2014-11-25 | Qualcomm Incorporated | Combining data from multiple image sensors |
US8600186B2 (en) | 2010-04-26 | 2013-12-03 | City University Of Hong Kong | Well focused catadioptric image acquisition |
US9053573B2 (en) | 2010-04-29 | 2015-06-09 | Personify, Inc. | Systems and methods for generating a virtual camera viewpoint for an image |
US20130250150A1 (en) | 2010-05-03 | 2013-09-26 | Michael R. Malone | Devices and methods for high-resolution image and video capture |
US9256974B1 (en) | 2010-05-04 | 2016-02-09 | Stephen P Hines | 3-D motion-parallax portable display software application |
US8885890B2 (en) | 2010-05-07 | 2014-11-11 | Microsoft Corporation | Depth map confidence filtering |
KR101756910B1 (en) | 2010-05-11 | 2017-07-26 | 삼성전자주식회사 | Apparatus and method for processing light field data using mask with attenuation pattern |
US20130147979A1 (en) | 2010-05-12 | 2013-06-13 | Pelican Imaging Corporation | Systems and methods for extending dynamic range of imager arrays by controlling pixel analog gain |
JP5545016B2 (en) | 2010-05-12 | 2014-07-09 | ソニー株式会社 | Imaging device |
KR101824672B1 (en) * | 2010-05-12 | 2018-02-05 | 포토네이션 케이맨 리미티드 | Architectures for imager arrays and array cameras |
WO2011142774A1 (en) | 2010-05-14 | 2011-11-17 | Omnivision Technologies, Inc. | Alternative color image array and associated methods |
US8576293B2 (en) | 2010-05-18 | 2013-11-05 | Aptina Imaging Corporation | Multi-channel imager |
US8602887B2 (en) | 2010-06-03 | 2013-12-10 | Microsoft Corporation | Synthesis of information from multiple audiovisual sources |
US20120062697A1 (en) | 2010-06-09 | 2012-03-15 | Chemimage Corporation | Hyperspectral imaging sensor for tracking moving targets |
US20110310980A1 (en) | 2010-06-22 | 2011-12-22 | Qualcomm Mems Technologies, Inc. | Apparatus and methods for processing frames of video data across a display interface using a block-based encoding scheme and a tag id |
KR20120000485A (en) | 2010-06-25 | 2012-01-02 | 삼성전자주식회사 | Apparatus and method for depth coding using prediction mode |
CN101883291B (en) | 2010-06-29 | 2012-12-19 | 上海大学 | Method for drawing viewpoints by reinforcing interested region |
EP2403234A1 (en) | 2010-06-29 | 2012-01-04 | Koninklijke Philips Electronics N.V. | Method and system for constructing a compound image from data obtained by an array of image capturing devices |
US8493432B2 (en) | 2010-06-29 | 2013-07-23 | Mitsubishi Electric Research Laboratories, Inc. | Digital refocusing for wide-angle images using axial-cone cameras |
GB2482022A (en) | 2010-07-16 | 2012-01-18 | St Microelectronics Res & Dev | Method for measuring resolution and aberration of lens and sensor |
US8386964B2 (en) | 2010-07-21 | 2013-02-26 | Microsoft Corporation | Interactive image matting |
US20120019700A1 (en) | 2010-07-26 | 2012-01-26 | American Technologies Network Corporation | Optical system with automatic mixing of daylight and thermal vision digital video signals |
US20120026342A1 (en) | 2010-07-27 | 2012-02-02 | Xiaoguang Yu | Electronic system communicating with image sensor |
US20120026451A1 (en) | 2010-07-29 | 2012-02-02 | Lensvector Inc. | Tunable liquid crystal lens with single sided contacts |
CN102375199B (en) | 2010-08-11 | 2015-06-03 | 鸿富锦精密工业(深圳)有限公司 | Camera module |
US8428342B2 (en) | 2010-08-12 | 2013-04-23 | At&T Intellectual Property I, L.P. | Apparatus and method for providing three dimensional media content |
US8493482B2 (en) | 2010-08-18 | 2013-07-23 | Apple Inc. | Dual image sensor image processing system and method |
US8749694B2 (en) | 2010-08-27 | 2014-06-10 | Adobe Systems Incorporated | Methods and apparatus for rendering focused plenoptic camera data using super-resolved demosaicing |
US8724000B2 (en) | 2010-08-27 | 2014-05-13 | Adobe Systems Incorporated | Methods and apparatus for super-resolution in integral photography |
US8665341B2 (en) | 2010-08-27 | 2014-03-04 | Adobe Systems Incorporated | Methods and apparatus for rendering output images with simulated artistic effects from focused plenoptic camera data |
US20120056982A1 (en) | 2010-09-08 | 2012-03-08 | Microsoft Corporation | Depth camera based on structured light and stereo vision |
US9013550B2 (en) | 2010-09-09 | 2015-04-21 | Qualcomm Incorporated | Online reference generation and tracking for multi-user augmented reality |
CN103299619A (en) | 2010-09-14 | 2013-09-11 | 汤姆逊许可公司 | Compression methods and apparatus for occlusion data |
US9013634B2 (en) | 2010-09-14 | 2015-04-21 | Adobe Systems Incorporated | Methods and apparatus for video completion |
US8780251B2 (en) | 2010-09-20 | 2014-07-15 | Canon Kabushiki Kaisha | Image capture with focus adjustment |
WO2012039043A1 (en) | 2010-09-22 | 2012-03-29 | 富士通株式会社 | Stereo image generating unit, method of generating stereo image, and stereo image generating computer program |
US20140192238A1 (en) | 2010-10-24 | 2014-07-10 | Linx Computational Imaging Ltd. | System and Method for Imaging and Image Processing |
US9137503B2 (en) | 2010-11-03 | 2015-09-15 | Sony Corporation | Lens and color filter arrangement, super-resolution camera system and method |
US9065991B2 (en) | 2010-11-04 | 2015-06-23 | Lensvector Inc. | Methods of adjustment free manufacture of focus free camera modules |
MY150361A (en) | 2010-12-03 | 2013-12-31 | Mimos Berhad | Method of image segmentation using intensity and depth information |
WO2012078126A1 (en) | 2010-12-08 | 2012-06-14 | Thomson Licensing | System and method for trinocular depth acquisition with triangular sensor |
US8878950B2 (en) | 2010-12-14 | 2014-11-04 | Pelican Imaging Corporation | Systems and methods for synthesizing high resolution images using super-resolution processes |
JP5963422B2 (en) | 2010-12-17 | 2016-08-03 | キヤノン株式会社 | Imaging apparatus, display apparatus, computer program, and stereoscopic image display system |
US9177381B2 (en) | 2010-12-22 | 2015-11-03 | Nani Holdings IP, LLC | Depth estimate determination, systems and methods |
US8682107B2 (en) | 2010-12-22 | 2014-03-25 | Electronics And Telecommunications Research Institute | Apparatus and method for creating 3D content for oriental painting |
US8565709B2 (en) | 2010-12-30 | 2013-10-22 | Apple Inc. | Digital signal filter |
JP5699609B2 (en) | 2011-01-06 | 2015-04-15 | ソニー株式会社 | Image processing apparatus and image processing method |
EP2666048A4 (en) | 2011-01-20 | 2014-06-04 | Fivefocal Llc | Passively athermalized infrared imaging system and methods of manufacturing same |
US8717467B2 (en) | 2011-01-25 | 2014-05-06 | Aptina Imaging Corporation | Imaging systems with array cameras for depth sensing |
US8581995B2 (en) * | 2011-01-25 | 2013-11-12 | Aptina Imaging Corporation | Method and apparatus for parallax correction in fused array imaging systems |
JP5594477B2 (en) | 2011-01-26 | 2014-09-24 | Nltテクノロジー株式会社 | Image display device, image display method, and program |
EP2668617A1 (en) | 2011-01-27 | 2013-12-04 | Metaio GmbH | Method for determining correspondences between a first and a second image, and method for determining the pose of a camera |
CA2767023C (en) | 2011-02-09 | 2014-09-09 | Research In Motion Limited | Increased low light sensitivity for image sensors by combining quantum dot sensitivity to visible and infrared light |
US20120200726A1 (en) | 2011-02-09 | 2012-08-09 | Research In Motion Limited | Method of Controlling the Depth of Field for a Small Sensor Camera Using an Extension for EDOF |
US20140176592A1 (en) | 2011-02-15 | 2014-06-26 | Lytro, Inc. | Configuring two-dimensional image processing based on light-field parameters |
US8406548B2 (en) | 2011-02-28 | 2013-03-26 | Sony Corporation | Method and apparatus for performing a blur rendering process on an image |
WO2012117583A1 (en) | 2011-02-28 | 2012-09-07 | 富士フイルム株式会社 | Color imaging device |
US8537245B2 (en) | 2011-03-04 | 2013-09-17 | Hand Held Products, Inc. | Imaging and decoding device with quantum dot imager |
CA2769358C (en) | 2011-03-08 | 2016-06-07 | Research In Motion Limited | Quantum dot image sensor with dummy pixels used for intensity calculations |
US9565449B2 (en) | 2011-03-10 | 2017-02-07 | Qualcomm Incorporated | Coding multiview video plus depth content |
US20120249853A1 (en) | 2011-03-28 | 2012-10-04 | Marc Krolczyk | Digital camera for reviewing related images |
US8824821B2 (en) | 2011-03-28 | 2014-09-02 | Sony Corporation | Method and apparatus for performing user inspired visual effects rendering on an image |
US9030528B2 (en) | 2011-04-04 | 2015-05-12 | Apple Inc. | Multi-zone imaging sensor and lens array |
FR2974449A1 (en) | 2011-04-22 | 2012-10-26 | Commissariat Energie Atomique | IMAGEUR INTEGRATED CIRCUIT AND STEREOSCOPIC IMAGE CAPTURE DEVICE |
US9192707B2 (en) | 2011-04-29 | 2015-11-24 | Medtronic, Inc. | Electrolyte and pH monitoring for fluid removal processes |
JP5797016B2 (en) | 2011-05-30 | 2015-10-21 | キヤノン株式会社 | Image processing apparatus, image processing method, and program |
JP5762142B2 (en) | 2011-05-31 | 2015-08-12 | キヤノン株式会社 | Imaging apparatus, image processing apparatus and method thereof |
JP2013005259A (en) | 2011-06-17 | 2013-01-07 | Sony Corp | Image processing apparatus, image processing method, and program |
US20130265459A1 (en) | 2011-06-28 | 2013-10-10 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
WO2013003276A1 (en) | 2011-06-28 | 2013-01-03 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
US8773513B2 (en) | 2011-07-01 | 2014-07-08 | Seiko Epson Corporation | Context and epsilon stereo constrained correspondence matching |
US9300946B2 (en) | 2011-07-08 | 2016-03-29 | Personify, Inc. | System and method for generating a depth map and fusing images from a camera array |
JP5780865B2 (en) | 2011-07-14 | 2015-09-16 | キヤノン株式会社 | Image processing apparatus, imaging system, and image processing system |
US9363535B2 (en) | 2011-07-22 | 2016-06-07 | Qualcomm Incorporated | Coding motion depth maps with depth range variation |
US9264689B2 (en) | 2011-08-04 | 2016-02-16 | Semiconductor Components Industries, Llc | Systems and methods for color compensation in multi-view video |
US8432435B2 (en) | 2011-08-10 | 2013-04-30 | Seiko Epson Corporation | Ray image modeling for fast catadioptric light field rendering |
US8866951B2 (en) | 2011-08-24 | 2014-10-21 | Aptina Imaging Corporation | Super-resolution imaging systems |
US8704895B2 (en) | 2011-08-29 | 2014-04-22 | Qualcomm Incorporated | Fast calibration of displays using spectral-based colorimetrically calibrated multicolor camera |
US20130070060A1 (en) * | 2011-09-19 | 2013-03-21 | Pelican Imaging Corporation | Systems and methods for determining depth from multiple views of a scene that include aliasing using hypothesized fusion |
JP5879549B2 (en) | 2011-09-20 | 2016-03-08 | パナソニックIpマネジメント株式会社 | Light field imaging apparatus and image processing apparatus |
JP5544047B2 (en) | 2011-09-21 | 2014-07-09 | 富士フイルム株式会社 | Image processing apparatus, method and program, stereoscopic imaging apparatus, portable electronic device, printer, and stereoscopic image reproducing apparatus |
US8724893B2 (en) | 2011-09-27 | 2014-05-13 | Thomson Licensing | Method and system for color look up table generation |
US8908083B2 (en) | 2011-09-28 | 2014-12-09 | Apple Inc. | Dynamic autofocus operations |
WO2013049699A1 (en) | 2011-09-28 | 2013-04-04 | Pelican Imaging Corporation | Systems and methods for encoding and decoding light field image files |
JP5831105B2 (en) | 2011-09-30 | 2015-12-09 | ソニー株式会社 | Imaging apparatus and imaging method |
CN104185808A (en) | 2011-10-11 | 2014-12-03 | 派力肯影像公司 | Lens stack arrays including adaptive optical elements |
EP2582128A3 (en) | 2011-10-12 | 2013-06-19 | Canon Kabushiki Kaisha | Image-capturing device |
US20130107061A1 (en) | 2011-10-31 | 2013-05-02 | Ankit Kumar | Multi-resolution ip camera |
US9692991B2 (en) | 2011-11-04 | 2017-06-27 | Qualcomm Incorporated | Multispectral imaging system |
JP5149435B1 (en) | 2011-11-04 | 2013-02-20 | 株式会社東芝 | Video processing apparatus and video processing method |
EP2590138B1 (en) | 2011-11-07 | 2019-09-11 | Flir Systems AB | Gas visualization arrangements, devices, and methods |
WO2013072875A2 (en) | 2011-11-15 | 2013-05-23 | Technion Research & Development Foundation Ltd. | Method and system for transmitting light |
US20130121559A1 (en) | 2011-11-16 | 2013-05-16 | Sharp Laboratories Of America, Inc. | Mobile device with three dimensional augmented reality |
WO2013119706A1 (en) | 2012-02-06 | 2013-08-15 | Pelican Imaging Corporation | Systems and methods for extending dynamic range of imager arrays by controlling pixel analog gain |
US9172889B2 (en) | 2012-02-09 | 2015-10-27 | Semiconductor Components Industries, Llc | Imaging systems and methods for generating auto-exposed high-dynamic-range images |
US9412206B2 (en) | 2012-02-21 | 2016-08-09 | Pelican Imaging Corporation | Systems and methods for the manipulation of captured light field image data |
JP5860304B2 (en) | 2012-02-23 | 2016-02-16 | キヤノン株式会社 | Imaging apparatus, control method therefor, program, and storage medium |
JP6112824B2 (en) * | 2012-02-28 | 2017-04-12 | キヤノン株式会社 | Image processing method and apparatus, and program. |
EP2637139A1 (en) | 2012-03-05 | 2013-09-11 | Thomson Licensing | Method and apparatus for bi-layer segmentation |
WO2013155403A1 (en) | 2012-04-13 | 2013-10-17 | Automation Engineering, Inc. | Active alignment using continuous motion sweeps and temporal interpolation |
US9210392B2 (en) | 2012-05-01 | 2015-12-08 | Pelican Imaging Coporation | Camera modules patterned with pi filter groups |
WO2013169671A1 (en) | 2012-05-09 | 2013-11-14 | Lytro, Inc. | Optimization of optical systems for improved light field capture and manipulation |
US9100635B2 (en) | 2012-06-28 | 2015-08-04 | Pelican Imaging Corporation | Systems and methods for detecting defective camera arrays and optic arrays |
US20140002674A1 (en) | 2012-06-30 | 2014-01-02 | Pelican Imaging Corporation | Systems and Methods for Manufacturing Camera Modules Using Active Alignment of Lens Stack Arrays and Sensors |
US8896594B2 (en) | 2012-06-30 | 2014-11-25 | Microsoft Corporation | Depth sensing with depth-adaptive illumination |
US9147251B2 (en) | 2012-08-03 | 2015-09-29 | Flyby Media, Inc. | Systems and methods for efficient 3D tracking of weakly textured planar surfaces for augmented reality applications |
US8988566B2 (en) | 2012-08-09 | 2015-03-24 | Omnivision Technologies, Inc. | Lens array for partitioned image sensor having color filters |
CN104662589B (en) | 2012-08-21 | 2017-08-04 | 派力肯影像公司 | For the parallax detection in the image using array camera seizure and the system and method for correction |
US20140055632A1 (en) | 2012-08-23 | 2014-02-27 | Pelican Imaging Corporation | Feature based high resolution motion estimation from low resolution images captured using an array source |
WO2014034444A1 (en) | 2012-08-31 | 2014-03-06 | ソニー株式会社 | Image processing device, image processing method, and information processing device |
US9214013B2 (en) | 2012-09-14 | 2015-12-15 | Pelican Imaging Corporation | Systems and methods for correcting user identified artifacts in light field images |
US9143673B2 (en) | 2012-09-19 | 2015-09-22 | Google Inc. | Imaging device with a plurality of pixel arrays |
CN104685860A (en) | 2012-09-28 | 2015-06-03 | 派力肯影像公司 | Generating images from light fields utilizing virtual viewpoints |
TW201415879A (en) | 2012-10-12 | 2014-04-16 | Wintek Corp | Image capture device |
WO2014070927A2 (en) | 2012-10-31 | 2014-05-08 | Invisage Technologies, Inc. | Expanded-field-of-view image and video capture |
US9143711B2 (en) | 2012-11-13 | 2015-09-22 | Pelican Imaging Corporation | Systems and methods for array camera focal plane control |
CN113472989A (en) | 2012-11-28 | 2021-10-01 | 核心光电有限公司 | Multi-aperture imaging system and method for acquiring images by multi-aperture imaging system |
US9001226B1 (en) | 2012-12-04 | 2015-04-07 | Lytro, Inc. | Capturing and relighting images using multiple devices |
US9088369B2 (en) | 2012-12-28 | 2015-07-21 | Synergy Microwave Corporation | Self injection locked phase locked looped optoelectronic oscillator |
US9547160B2 (en) | 2013-01-05 | 2017-01-17 | Light Labs Inc. | Methods and apparatus for capturing and/or processing images |
KR20140094395A (en) | 2013-01-22 | 2014-07-30 | 삼성전자주식회사 | photographing device for taking a picture by a plurality of microlenses and method thereof |
WO2014130849A1 (en) | 2013-02-21 | 2014-08-28 | Pelican Imaging Corporation | Generating compressed light field representation data |
US9374512B2 (en) | 2013-02-24 | 2016-06-21 | Pelican Imaging Corporation | Thin form factor computational array cameras and modular array cameras |
US20150002734A1 (en) | 2013-07-01 | 2015-01-01 | Motorola Mobility Llc | Electronic Device with Modulated Light Flash Operation for Rolling Shutter Image Sensor |
US9774789B2 (en) | 2013-03-08 | 2017-09-26 | Fotonation Cayman Limited | Systems and methods for high dynamic range imaging using array cameras |
US8866912B2 (en) | 2013-03-10 | 2014-10-21 | Pelican Imaging Corporation | System and methods for calibration of an array camera using a single captured image |
US9521416B1 (en) | 2013-03-11 | 2016-12-13 | Kip Peli P1 Lp | Systems and methods for image data compression |
US9519972B2 (en) | 2013-03-13 | 2016-12-13 | Kip Peli P1 Lp | Systems and methods for synthesizing images from image data captured by an array camera using restricted depth of field depth maps in which depth estimation precision varies |
WO2014164909A1 (en) | 2013-03-13 | 2014-10-09 | Pelican Imaging Corporation | Array camera architecture implementing quantum film sensors |
WO2014160142A1 (en) | 2013-03-13 | 2014-10-02 | Pelican Imaging Corporation | Systems and methods for using alignment to increase sampling diversity of cameras in an array camera module |
US9106784B2 (en) | 2013-03-13 | 2015-08-11 | Pelican Imaging Corporation | Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing |
WO2014164550A2 (en) | 2013-03-13 | 2014-10-09 | Pelican Imaging Corporation | System and methods for calibration of an array camera |
US9578259B2 (en) | 2013-03-14 | 2017-02-21 | Fotonation Cayman Limited | Systems and methods for reducing motion blur in images or video in ultra low light with array cameras |
WO2014150856A1 (en) | 2013-03-15 | 2014-09-25 | Pelican Imaging Corporation | Array camera implementing quantum dot color filters |
WO2014149902A1 (en) | 2013-03-15 | 2014-09-25 | Pelican Imaging Corporation | Systems and methods for providing an array projector |
US9445003B1 (en) | 2013-03-15 | 2016-09-13 | Pelican Imaging Corporation | Systems and methods for synthesizing high resolution images using image deconvolution based on motion and depth information |
WO2014144157A1 (en) | 2013-03-15 | 2014-09-18 | Pelican Imaging Corporation | Optical arrangements for use with an array camera |
US9497429B2 (en) | 2013-03-15 | 2016-11-15 | Pelican Imaging Corporation | Extended color processing on pelican array cameras |
WO2014145856A1 (en) | 2013-03-15 | 2014-09-18 | Pelican Imaging Corporation | Systems and methods for stereo imaging with camera arrays |
WO2015048694A2 (en) | 2013-09-27 | 2015-04-02 | Pelican Imaging Corporation | Systems and methods for depth-assisted perspective distortion correction |
US20150104101A1 (en) | 2013-10-14 | 2015-04-16 | Apple Inc. | Method and ui for z depth image segmentation |
EP3066690A4 (en) | 2013-11-07 | 2017-04-05 | Pelican Imaging Corporation | Methods of manufacturing array camera modules incorporating independently aligned lens stacks |
US9426361B2 (en) | 2013-11-26 | 2016-08-23 | Pelican Imaging Corporation | Array camera configurations incorporating multiple constituent array cameras |
JP6211435B2 (en) | 2014-02-26 | 2017-10-11 | 株式会社アドバンテスト | Manufacturing method of semiconductor device |
US9521319B2 (en) | 2014-06-18 | 2016-12-13 | Pelican Imaging Corporation | Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor |
-
2014
- 2014-02-24 US US14/188,521 patent/US9374512B2/en active Active
- 2014-02-24 WO PCT/US2014/018084 patent/WO2014133974A1/en active Application Filing
- 2014-02-24 US US14/188,524 patent/US9253380B2/en active Active
-
2016
- 2016-02-01 US US15/012,044 patent/US9743051B2/en active Active
- 2016-04-22 US US15/136,166 patent/US9774831B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009151903A2 (en) * | 2008-05-20 | 2009-12-17 | Pelican Imaging Corporation | Capturing and processing of images using monolithic camera array with hetergeneous imagers |
US20110069189A1 (en) * | 2008-05-20 | 2011-03-24 | Pelican Imaging Corporation | Capturing and processing of images using monolithic camera array with heterogeneous imagers |
US20120287291A1 (en) * | 2011-05-11 | 2012-11-15 | Pelican Imaging Corporation | Systems and methods for transmitting and receiving array camera image data |
Cited By (157)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9049391B2 (en) | 2008-05-20 | 2015-06-02 | Pelican Imaging Corporation | Capturing and processing of near-IR images including occlusions using camera arrays incorporating near-IR light sources |
US11792538B2 (en) | 2008-05-20 | 2023-10-17 | Adeia Imaging Llc | Capturing and processing of images including occlusions focused on an image sensor by a lens stack array |
US9191580B2 (en) | 2008-05-20 | 2015-11-17 | Pelican Imaging Corporation | Capturing and processing of images including occlusions captured by camera arrays |
US10027901B2 (en) | 2008-05-20 | 2018-07-17 | Fotonation Cayman Limited | Systems and methods for generating depth maps using a camera arrays incorporating monochrome and color cameras |
US10142560B2 (en) | 2008-05-20 | 2018-11-27 | Fotonation Limited | Capturing and processing of images including occlusions focused on an image sensor by a lens stack array |
US9749547B2 (en) | 2008-05-20 | 2017-08-29 | Fotonation Cayman Limited | Capturing and processing of images using camera array incorperating Bayer cameras having different fields of view |
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US9712759B2 (en) | 2008-05-20 | 2017-07-18 | Fotonation Cayman Limited | Systems and methods for generating depth maps using a camera arrays incorporating monochrome and color cameras |
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US8885059B1 (en) | 2008-05-20 | 2014-11-11 | Pelican Imaging Corporation | Systems and methods for measuring depth using images captured by camera arrays |
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US9049411B2 (en) | 2008-05-20 | 2015-06-02 | Pelican Imaging Corporation | Camera arrays incorporating 3×3 imager configurations |
US9188765B2 (en) | 2008-05-20 | 2015-11-17 | Pelican Imaging Corporation | Capturing and processing of images including occlusions focused on an image sensor by a lens stack array |
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US9060124B2 (en) | 2008-05-20 | 2015-06-16 | Pelican Imaging Corporation | Capturing and processing of images using non-monolithic camera arrays |
US9077893B2 (en) | 2008-05-20 | 2015-07-07 | Pelican Imaging Corporation | Capturing and processing of images captured by non-grid camera arrays |
US9094661B2 (en) | 2008-05-20 | 2015-07-28 | Pelican Imaging Corporation | Systems and methods for generating depth maps using a set of images containing a baseline image |
US11412158B2 (en) | 2008-05-20 | 2022-08-09 | Fotonation Limited | Capturing and processing of images including occlusions focused on an image sensor by a lens stack array |
US9264610B2 (en) | 2009-11-20 | 2016-02-16 | Pelican Imaging Corporation | Capturing and processing of images including occlusions captured by heterogeneous camera arrays |
US10306120B2 (en) | 2009-11-20 | 2019-05-28 | Fotonation Limited | Capturing and processing of images captured by camera arrays incorporating cameras with telephoto and conventional lenses to generate depth maps |
US10455168B2 (en) | 2010-05-12 | 2019-10-22 | Fotonation Limited | Imager array interfaces |
US9936148B2 (en) | 2010-05-12 | 2018-04-03 | Fotonation Cayman Limited | Imager array interfaces |
US11423513B2 (en) | 2010-12-14 | 2022-08-23 | Fotonation Limited | Systems and methods for synthesizing high resolution images using images captured by an array of independently controllable imagers |
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US10366472B2 (en) | 2010-12-14 | 2019-07-30 | Fotonation Limited | Systems and methods for synthesizing high resolution images using images captured by an array of independently controllable imagers |
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US9866739B2 (en) | 2011-05-11 | 2018-01-09 | Fotonation Cayman Limited | Systems and methods for transmitting and receiving array camera image data |
US10218889B2 (en) | 2011-05-11 | 2019-02-26 | Fotonation Limited | Systems and methods for transmitting and receiving array camera image data |
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US9794476B2 (en) | 2011-09-19 | 2017-10-17 | Fotonation Cayman Limited | Systems and methods for controlling aliasing in images captured by an array camera for use in super resolution processing using pixel apertures |
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US9864921B2 (en) | 2011-09-28 | 2018-01-09 | Fotonation Cayman Limited | Systems and methods for encoding image files containing depth maps stored as metadata |
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US20180197035A1 (en) | 2011-09-28 | 2018-07-12 | Fotonation Cayman Limited | Systems and Methods for Encoding Image Files Containing Depth Maps Stored as Metadata |
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US11729365B2 (en) | 2011-09-28 | 2023-08-15 | Adela Imaging LLC | Systems and methods for encoding image files containing depth maps stored as metadata |
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US9774831B2 (en) | 2013-02-24 | 2017-09-26 | Fotonation Cayman Limited | Thin form factor computational array cameras and modular array cameras |
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US9743051B2 (en) | 2013-02-24 | 2017-08-22 | Fotonation Cayman Limited | Thin form factor computational array cameras and modular array cameras |
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US10225543B2 (en) | 2013-03-10 | 2019-03-05 | Fotonation Limited | System and methods for calibration of an array camera |
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US9497429B2 (en) | 2013-03-15 | 2016-11-15 | Pelican Imaging Corporation | Extended color processing on pelican array cameras |
US9497370B2 (en) | 2013-03-15 | 2016-11-15 | Pelican Imaging Corporation | Array camera architecture implementing quantum dot color filters |
US10542208B2 (en) | 2013-03-15 | 2020-01-21 | Fotonation Limited | Systems and methods for synthesizing high resolution images using image deconvolution based on motion and depth information |
US10182216B2 (en) | 2013-03-15 | 2019-01-15 | Fotonation Limited | Extended color processing on pelican array cameras |
US9438888B2 (en) | 2013-03-15 | 2016-09-06 | Pelican Imaging Corporation | Systems and methods for stereo imaging with camera arrays |
US9633442B2 (en) | 2013-03-15 | 2017-04-25 | Fotonation Cayman Limited | Array cameras including an array camera module augmented with a separate camera |
US10674138B2 (en) | 2013-03-15 | 2020-06-02 | Fotonation Limited | Autofocus system for a conventional camera that uses depth information from an array camera |
US10638099B2 (en) | 2013-03-15 | 2020-04-28 | Fotonation Limited | Extended color processing on pelican array cameras |
US9898856B2 (en) | 2013-09-27 | 2018-02-20 | Fotonation Cayman Limited | Systems and methods for depth-assisted perspective distortion correction |
US10540806B2 (en) | 2013-09-27 | 2020-01-21 | Fotonation Limited | Systems and methods for depth-assisted perspective distortion correction |
US9426343B2 (en) | 2013-11-07 | 2016-08-23 | Pelican Imaging Corporation | Array cameras incorporating independently aligned lens stacks |
US9924092B2 (en) | 2013-11-07 | 2018-03-20 | Fotonation Cayman Limited | Array cameras incorporating independently aligned lens stacks |
US9185276B2 (en) | 2013-11-07 | 2015-11-10 | Pelican Imaging Corporation | Methods of manufacturing array camera modules incorporating independently aligned lens stacks |
US9264592B2 (en) | 2013-11-07 | 2016-02-16 | Pelican Imaging Corporation | Array camera modules incorporating independently aligned lens stacks |
US10767981B2 (en) | 2013-11-18 | 2020-09-08 | Fotonation Limited | Systems and methods for estimating depth from projected texture using camera arrays |
US10119808B2 (en) | 2013-11-18 | 2018-11-06 | Fotonation Limited | Systems and methods for estimating depth from projected texture using camera arrays |
US11486698B2 (en) | 2013-11-18 | 2022-11-01 | Fotonation Limited | Systems and methods for estimating depth from projected texture using camera arrays |
US10708492B2 (en) | 2013-11-26 | 2020-07-07 | Fotonation Limited | Array camera configurations incorporating constituent array cameras and constituent cameras |
US9456134B2 (en) | 2013-11-26 | 2016-09-27 | Pelican Imaging Corporation | Array camera configurations incorporating constituent array cameras and constituent cameras |
US9426361B2 (en) | 2013-11-26 | 2016-08-23 | Pelican Imaging Corporation | Array camera configurations incorporating multiple constituent array cameras |
US9813617B2 (en) | 2013-11-26 | 2017-11-07 | Fotonation Cayman Limited | Array camera configurations incorporating constituent array cameras and constituent cameras |
US10089740B2 (en) | 2014-03-07 | 2018-10-02 | Fotonation Limited | System and methods for depth regularization and semiautomatic interactive matting using RGB-D images |
US10574905B2 (en) | 2014-03-07 | 2020-02-25 | Fotonation Limited | System and methods for depth regularization and semiautomatic interactive matting using RGB-D images |
US9247117B2 (en) | 2014-04-07 | 2016-01-26 | Pelican Imaging Corporation | Systems and methods for correcting for warpage of a sensor array in an array camera module by introducing warpage into a focal plane of a lens stack array |
US9521319B2 (en) | 2014-06-18 | 2016-12-13 | Pelican Imaging Corporation | Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor |
US10250871B2 (en) | 2014-09-29 | 2019-04-02 | Fotonation Limited | Systems and methods for dynamic calibration of array cameras |
US11546576B2 (en) | 2014-09-29 | 2023-01-03 | Adeia Imaging Llc | Systems and methods for dynamic calibration of array cameras |
US9942474B2 (en) | 2015-04-17 | 2018-04-10 | Fotonation Cayman Limited | Systems and methods for performing high speed video capture and depth estimation using array cameras |
US10818026B2 (en) | 2017-08-21 | 2020-10-27 | Fotonation Limited | Systems and methods for hybrid depth regularization |
US11562498B2 (en) | 2017-08-21 | 2023-01-24 | Adela Imaging LLC | Systems and methods for hybrid depth regularization |
US10482618B2 (en) | 2017-08-21 | 2019-11-19 | Fotonation Limited | Systems and methods for hybrid depth regularization |
US10475838B2 (en) * | 2017-09-25 | 2019-11-12 | Omnivision Technologies, Inc. | Multi-pixel detector and associated method for increasing angular sensitivity |
US11699273B2 (en) | 2019-09-17 | 2023-07-11 | Intrinsic Innovation Llc | Systems and methods for surface modeling using polarization cues |
US11270110B2 (en) | 2019-09-17 | 2022-03-08 | Boston Polarimetrics, Inc. | Systems and methods for surface modeling using polarization cues |
US11525906B2 (en) | 2019-10-07 | 2022-12-13 | Intrinsic Innovation Llc | Systems and methods for augmentation of sensor systems and imaging systems with polarization |
US11302012B2 (en) | 2019-11-30 | 2022-04-12 | Boston Polarimetrics, Inc. | Systems and methods for transparent object segmentation using polarization cues |
US11842495B2 (en) | 2019-11-30 | 2023-12-12 | Intrinsic Innovation Llc | Systems and methods for transparent object segmentation using polarization cues |
US11580667B2 (en) | 2020-01-29 | 2023-02-14 | Intrinsic Innovation Llc | Systems and methods for characterizing object pose detection and measurement systems |
US11797863B2 (en) | 2020-01-30 | 2023-10-24 | Intrinsic Innovation Llc | Systems and methods for synthesizing data for training statistical models on different imaging modalities including polarized images |
US11290658B1 (en) | 2021-04-15 | 2022-03-29 | Boston Polarimetrics, Inc. | Systems and methods for camera exposure control |
US11683594B2 (en) | 2021-04-15 | 2023-06-20 | Intrinsic Innovation Llc | Systems and methods for camera exposure control |
US11689813B2 (en) | 2021-07-01 | 2023-06-27 | Intrinsic Innovation Llc | Systems and methods for high dynamic range imaging using crossed polarizers |
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US20140240529A1 (en) | 2014-08-28 |
US20140240528A1 (en) | 2014-08-28 |
US20160269651A1 (en) | 2016-09-15 |
US9374512B2 (en) | 2016-06-21 |
US9253380B2 (en) | 2016-02-02 |
US9743051B2 (en) | 2017-08-22 |
WO2014133974A9 (en) | 2015-04-09 |
US20170085845A1 (en) | 2017-03-23 |
US9774831B2 (en) | 2017-09-26 |
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