WO2011055655A1 - Image pickup device, optical unit, wafer lens laminated body, and method for manufacturing wafer lens laminated body - Google Patents

Abstract

Disclosed is a wafer lens laminated body wherein a plurality of wafer lenses are laminated, each of said wafer lenses having, on a glass substrate, a resin section having a plurality of lens sections. The resin section has a non lens section on the outer circumference of each lens section, and the non lens section is partitioned from other lens sections by means of a groove section, which has the side circumferential surface thereof as the side wall. In the laminated wafer lenses, a space formed by means of the groove section of one wafer lens and the groove section of another wafer lens is filled with resin or a flat plate.

Description

Imaging apparatus, optical unit, wafer lens laminate, and method for manufacturing wafer lens laminate

The present invention relates to an imaging apparatus, an optical unit, a wafer lens laminate, and a method for manufacturing a wafer lens laminate.

Conventionally, in the field of manufacturing optical lenses, a technique for obtaining an optical lens having high heat resistance by providing a lens portion made of a curable resin on a glass substrate has been studied. As an example of an optical lens manufacturing method to which this technology is applied, a so-called “wafer lens” in which a plurality of optical members made of a curable resin is provided on the surface of a glass substrate is formed, and then the glass substrate is cut for each lens portion. A method has also been proposed.

As a method of manufacturing a wafer lens, for example, a first resin mold is created from a mold, and then a second resin mold is created from the first resin mold, and a resin is produced using the second resin mold. In some cases, a mold and two resin molds are used to manufacture a manufactured wafer lens (see, for example, Patent Documents 1 and 2). In particular, Patent Document 2 discloses a so-called step-and-repeat method in which formed portions are sequentially formed on a large-diameter glass substrate.

Here, the mold is a master mold and the resin mold is a sub master mold. When the wafer lens is manufactured using the sub master mold, the number of times of using the expensive master mold can be reduced, and as a result, the cost of the wafer lens can be reduced.

Special table 2006-519711 gazette US Patent Application Publication No. 2006/0259546

However, in the above step-and-repeat method, the molding part is sequentially formed on the first resin mold substrate having a large diameter using a small master molding die, so that it is adjacent after molding in the first region. A predetermined amount of gap is generated between the second region. This occurs because the position accuracy of the mold in the first region and the position accuracy of the mold in the second region cannot be matched exactly.

As a result, the resin does not rotate in the formed gap, and the first resin mold having the groove portion where the base of the first resin mold substrate is exposed is manufactured on one surface of the first resin mold substrate. . Further, when the second resin mold is manufactured using the first resin mold having such a groove, and the wafer lens is manufactured using the second resin mold, the first resin is also applied to the wafer lens. A groove portion is formed at a position corresponding to the groove portion of the mold.

Then, two wafer lenses each having a groove portion are laminated and bonded to each other to form a wafer lens laminate, and the glass substrates of both wafer lenses are diced together to separate each pair of lens portions. In this case, dicing is performed at a position where there is a cavity formed by the groove portions of the two stacked wafer lenses.

Therefore, bending or cracking may occur due to impact during dicing, or the glass substrate and the resin part may be peeled off. Of course, such a cavity also occurs when only one of the wafer lenses to be directly laminated has a groove and the other has no groove.

The present invention has been made in view of the above circumstances, and prevents the occurrence of bending or cracking during dicing without increasing the size or complexity of the wafer lens, and also prevents the glass substrate and the resin from peeling off. An object of the present invention is to provide a wafer lens laminate and a method of manufacturing the wafer lens laminate that can be prevented. Another object of the present invention is to provide an imaging device and an optical unit that can prevent the occurrence of ghosts while preventing cracks around the lens and peeling of the glass substrate and the resin part, while having a compact configuration. It is said.

According to one aspect of the present invention, a first lens block in which a first lens portion and a first non-lens portion around the first lens portion are formed of resin on at least one surface of the first glass substrate. A second lens block in which a second lens part and a second non-lens part around the second lens part are formed of resin on at least one surface of the second glass substrate; and the first non-lens part. An optical unit joined so that the second non-lens part faces,
A light-shielding member having a light-shielding property with respect to incident light is exposed on the side surfaces of the first and second lens blocks at least at a part of the joint portion between the first non-lens part and the second non-lens part. In addition, an optical unit is provided in which the light shielding member forms a side surface portion on the same surface as the side surface portions of the first and second lens blocks.

According to another aspect of the present invention, a first lens block in which a first lens portion and a first non-lens portion around the first lens portion are formed of resin on at least one surface of the first glass substrate; A second lens block in which a second lens part and a second non-lens part around the second lens part are formed of resin on at least one surface of the second glass substrate; and the first non-lens part. An optical unit bonded so that the second non-lens portion faces the optical unit;
One end surface is joined to the surface of the second lens block opposite to the surface where the second lens portion and the second non-lens portion are formed, and an opening is formed at a position corresponding to the first and second lens portions. A spacer made of glass having,
A sensor unit having a cover member made of glass, bonded to the other end surface of the spacer, and having an image sensor disposed at a predetermined interval from the cover member,
A light-shielding member having a light-shielding property with respect to incident light is exposed on the side surfaces of the first and second lens blocks at least at a part of the joint portion between the first non-lens part and the second non-lens part. The light-shielding member forms a side surface portion on the same surface together with a side surface portion of the first and second lens blocks, a side surface portion of the spacer, and a side surface portion of the sensor unit. An imaging device is provided.

According to another aspect of the present invention, the first lens portion formed on a part of the resin portion provided on one surface of the first glass substrate with the convex surface facing the object side, and the concave surface facing the image side. A first lens block having a second lens part formed on a part of the resin part provided on the other surface of the first glass substrate;
The third lens part formed on a part of the resin part provided on one surface of the second glass substrate with the concave surface facing the object side, and one of the resin parts provided on the other surface of the second glass substrate An optical unit in which a second lens block having a fourth lens part formed on a part is joined to a resin part on which the second lens part and the third lens part are formed,
A light-shielding member having a light-shielding property with respect to incident light is disposed between the resin part in which the second lens part is formed and the resin part in which the third lens part is formed, and side surfaces of the first and second lens blocks. An optical unit is provided in which the side surface portion is formed on the same surface together with the side surface portions of the first and second lens blocks.

According to another aspect of the present invention, the first lens portion formed on a part of the resin portion provided on one surface of the first glass substrate with the convex surface facing the object side, and the concave surface facing the image side. A first lens block having a second lens portion formed on a part of a resin portion provided on the other surface of the first glass substrate, and a first surface of the second glass substrate with a concave surface facing the object side A second lens having a third lens part formed on a part of the resin part provided on the second glass part and a fourth lens part formed on a part of the resin part provided on the other surface of the second glass substrate. An optical unit in which a block is joined to a resin part in which the second lens part and the third lens part are formed;
A spacer made of glass having one end surface bonded to the resin portion where the fourth lens portion of the second lens block is formed and having an opening at a position corresponding to the fourth lens portion from the first lens portion;
An image pickup apparatus comprising: a cover member made of glass to which the other end surface of the spacer is bonded; and a sensor unit having an image pickup element arranged at a predetermined interval from the cover member.
A light-shielding member having a light-shielding property with respect to incident light is disposed between the resin part in which the second lens part is formed and the resin part in which the third lens part is formed, and side surfaces of the first and second lens blocks. And the light shielding member is exposed and formed on the side surfaces of the first and second lens blocks, and the side surfaces of the first and second lens blocks, the side surfaces of the spacer, and the sensor. An imaging device is provided in which the side surface portion of the same surface is formed together with the side surface portion of the unit.

According to another aspect of the present invention, there is provided a wafer lens laminate in which a plurality of wafer lenses each having a resin portion having a plurality of lens portions formed on a substrate are laminated, and at least of two wafer lenses that are directly laminated. On the other hand,
The resin part has a non-lens part on the outer periphery of each lens part,
The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
A wafer lens laminate, wherein a cavity formed between the groove portion of one wafer lens and the other wafer lens to be laminated is filled between the wafer lenses laminated to each other. Is provided.

According to another aspect of the present invention, there is provided a wafer lens laminate in which a plurality of wafer lenses each having a resin portion having a plurality of lens portions formed on a substrate are laminated, and at least of two wafer lenses that are directly laminated. On the other hand,
The resin part has a non-lens part on the outer periphery of each lens part,
The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
A flat plate smaller than the cavity is disposed in a cavity formed between the groove portion of one wafer lens and the other wafer lens between the wafer lenses laminated to each other. A wafer lens laminate is provided, which is filled with a resin therebetween.

According to another aspect of the present invention, there is provided a method of manufacturing a wafer lens laminate in which a plurality of wafer lenses each having a resin portion having a plurality of lens portions formed on a substrate are laminated, wherein two wafers are directly laminated. At least one of the lenses
The resin part of the wafer lens has a non-lens part on the outer periphery of each lens part,
The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
Wafer lenses are stacked on top of each other,
There is provided a method for producing a wafer lens laminate, wherein a resin is filled in a cavity formed between the groove of one wafer lens and the other wafer lens.

According to another aspect of the present invention, there is provided a method of manufacturing a wafer lens laminate in which a plurality of wafer lenses each having a resin portion having a plurality of lens portions formed on a substrate are laminated, wherein two wafers are directly laminated. At least one of the lenses
The resin part of the wafer lens has a non-lens part on the outer periphery of each lens part,
The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
Wafer lenses are stacked on top of each other,
A flat plate smaller than the cavity is disposed in a cavity formed between the groove portion of one wafer lens and the other wafer lens, and a resin is filled between the flat plate and the cavity. A method for producing a wafer lens laminate is provided.

According to the wafer lens laminate and the method for producing the wafer lens laminate of the present invention, it is possible to prevent the occurrence of bending or cracking during dicing without increasing the size of the wafer lens or having a complicated configuration. And the resin can be prevented from peeling off, and unnecessary reflected light can be shielded by the light shielding member to prevent ghosting. In addition, according to the imaging apparatus and the optical unit of the present invention, it is possible to prevent the occurrence of ghost while preventing cracks around the lens and peeling between the glass substrate and the resin portion while having a compact configuration.

(A) is sectional drawing which shows schematic structure of an imaging device, (b) is drawing which shows the state which removed the package which is a top view of an imaging device. It is a perspective view which shows schematic structure of a wafer lens laminated body. It is a top view which shows schematically the aperture_diaphragm | restriction of the glass substrate of a wafer lens, and the pattern of IR cut coat. (A), (b) is a part of manufacturing method of a wafer lens, and is the side view which showed the case where a 1st convex-shaped resin mold is manufactured. (A), (b) is a side view which showed the case where the 2nd concave resin type | mold is manufactured from the state of FIG. 4 in a part of manufacturing method of a wafer lens. (A), (b) is a side view which showed the case where a wafer lens is manufactured from the state of FIG. 5 in a part of manufacturing method of a wafer lens. (A), (b) is the side view which showed a part of manufacturing method of a wafer lens laminated body. (A), (b) is a part of manufacturing method of a wafer lens laminated body, and is the side view which showed the case where a wafer lens laminated body is manufactured from the state of FIG. (A) is the top view which showed the case where resin is filled in a cavity, when manufacturing a wafer lens laminated body, (b) is a side view of (a). (A) is sectional drawing which shows schematic structure of the imaging device of 2nd Embodiment, (b) is a top view of the imaging device of 2nd Embodiment, and is drawing which shows the state which removed the package. . (A), (b) is the side view which showed a part of manufacturing method of the wafer lens laminated body of 2nd Embodiment. (A), (b) is a part of manufacturing method of the wafer lens laminated body of 2nd Embodiment, and is the side view which showed the case where a wafer lens laminated body is manufactured from the state of FIG. It is a figure for demonstrating the manufacturing method of the wafer lens by a step and repeat system, Comprising: It is a top view in the case of manufacturing a 1st convex resin type | mold.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
<Imaging device>
As shown in FIG. 1A, the imaging device 2 is mainly composed of a lens unit 4 and a sensor unit 6, and the lens unit 4 is disposed on the sensor unit 6.

The lens unit 4 includes an optical unit including lens blocks 8 and 10, a spacer 12, and a cover package 14. The lens unit 4 is covered with the cover package 14 in a state where the lens blocks 8 and 10 and the spacer 12 are bonded and laminated. ing.

The lens block 8 has a flat glass substrate 16. A diaphragm 18, an IR cut coat 21 and a resin part 20 are formed on the upper part of the glass substrate 16, and a diaphragm 22, an IR cut coat 23 and a resin part 24 are formed on the lower part of the glass substrate 16.

A convex lens portion 20a having a convex shape is formed at a substantially central portion of the resin portion 20. In the resin part 20, parts other than the convex lens part 20a are non-lens parts 20b. The non-lens portion 20b includes an inclined portion 20c inclined upward from the convex lens portion 20a toward the outer peripheral portion, a substantially flat flat portion 20d continuously convex upward from the inclined portion 20c, and an outer side of the flat portion 20d. And a groove portion 20e which is a portion formed to be depressed downward.

A concave lens portion 24 a having a concave shape is formed at a substantially central portion of the resin portion 24. In the resin part 24, parts other than the concave lens part 24a are non-lens parts 24b. The non-lens part 24b has a substantially flat flat part 24d formed on the outer peripheral part of the concave lens part 24a, and a groove part 24e which is a part formed to be recessed upward on the outside of the flat part 24d. Here, upward and downward refer to the upward and downward directions in FIG.

The lens block 10 also has a flat glass substrate 26. A resin portion 28 is formed on the upper portion of the glass substrate 26, and a diaphragm 30 and a resin portion 32 are formed on the lower portion of the glass substrate 26.

A concave lens portion 28a having a concave shape is formed at a substantially central portion of the resin portion 28. In the resin part 28, parts other than the concave lens part 28a are non-lens parts 28b. The non-lens part 28b has a substantially flat flat part 28c formed on the outer peripheral part of the concave lens part 28a, and a groove part 28d which is a part formed to be depressed downward on the outer side of the flat part 28c.

A convex lens portion 32 a having a convex shape is formed at a substantially central portion of the resin portion 32. In the resin part 32, parts other than the convex lens part 32a are non-lens parts 32b. The non-lens part 32b has a substantially flat flat part 32c formed on the outer peripheral part of the convex lens part 32a, and a groove part 32d which is a part formed to be concave downward on the outside of the flat part 32c.

Resin portions 20, 24, 28, and 32 are light-transmitting portions where photo-curing resin is molded. The convex lens portion 20a, the concave lens portion 24a, the concave lens portion 28a, and the convex lens portion 32a in the resin portions 20, 24, 28, and 32 are lens effective portions that exhibit a lens function (optical function).

When the lens blocks 8 and 10 are viewed from the object side (convex lens portion 20a side), as shown in FIG. 1B, the convex lens portion 20a, the concave lens portion 24a, the concave lens portion 28a, and the convex lens portion 32a are arranged concentrically. These lens portions are stacked vertically so that the optical axes 34 coincide with each other.

The sensor unit 6 mainly includes a sensor 36, a package 38, and a cover glass 40. The sensor 36 is a light receiving sensor that receives light transmitted through the lens unit 4, and can photoelectrically convert the received light to output an electrical signal to an external device (not shown).

The package 38 has a bottomed box shape and is open at the top. A sensor 36 is disposed at a substantially central portion of the package 38. The cover glass 40 is provided as a lid on the upper part of the package 38, and the sensor 36 is sealed in a space surrounded by the package 38 and the cover glass 40.

The spacer 12 is interposed between the lens block 10 and the sensor 36, and provides a constant interval between these members.

<Wafer lens laminate>
The wafer lens laminate before dicing the lens unit 4 of FIG. 1 by dicing will be described. As shown in FIG. 2, the wafer lens laminate 50 mainly includes wafer lenses 52 and 54, a spacer substrate 56, It has the structure by which these members were laminated | stacked.

The wafer lens laminate 50 is diced at a predetermined position to form a plurality of sets of units in which the lens blocks 8 and 10 and the spacers 12 are bonded and laminated.

As shown in FIG. 8B, the wafer lens 52 includes a glass substrate 16 having a wafer shape, and a diaphragm 18, a resin portion 20, and an IR cut coat 21 are formed on the glass substrate 16.

A large number of the apertures 18 are formed on the glass substrate 16 in a rectangular shape, and a circular opening 18a is formed at the center of each aperture 18 except for a portion corresponding to the convex lens portion 20a of the resin portion 20. It is formed (see FIG. 3).

The diaphragm 18 is made of a light shielding photoresist. As the light shielding photoresist, a photoresist mixed with carbon black is applied.

The IR cut coat 21 is formed at a location corresponding to the convex lens portion 20a, and a large number of small circular shapes are arranged on the glass substrate 16 (see FIG. 3).

The IR cut coat 21 shields infrared rays that are about to enter the sensor 36 when the imaging apparatus 2 is used. Even for ultraviolet light, the transmittance is limited to 50% or less due to reflection and light absorption. Specifically, although not shown, the IR cut coat 21 is an alternating multilayer film in which a plurality of low refractive index layers made of a low refractive index material and a plurality of high refractive index layers made of a high refractive index material are alternately stacked. It is. Preferably, the IR cut coat 21 may be formed so that the low refractive index layer is in direct contact with the glass substrate 16.

Examples of the method for forming the IR cut coat 21 include a known vacuum deposition method, sputtering, CVD (Chemical Vapor Deposition) method, patterning method and the like while using a mask. As the mask, a mask in which a hole is formed only at a location corresponding to the convex lens portion 20a is used, and the IR cut coat 21 is formed only at a location corresponding to the convex lens portion 20a.

First, the aperture 18 and the IR cut coat 21 are formed on the glass substrate 16, and then the convex lens portion 20 a and the non-lens portion 20 b are formed by forming a resin between the mold and the glass substrate. Therefore, the diaphragm 18 and the IR cut coat 21 are covered with the resin portion 20.

A diaphragm 22, a resin part 24, and an IR cut coat 23 are formed below the glass substrate 16.

Many apertures 22 are formed on the glass substrate 16 in the same shape as the apertures 18, and a circular opening 22 a is removed from the central portion of each aperture 18 except for a portion corresponding to the concave lens portion 24 a of the resin portion 24. Is formed. Further, like the diaphragm 18, it is made of a light shielding photoresist.

A large number of IR cut coats 23 are formed on the glass substrate 26, and are formed at locations corresponding to the concave lens portions 24a. The IR cut coat 23 has the same shape as the IR cut coat 21 and is formed in the same manner as the IR cut coat 21.

The aperture 22 and the IR cut coat 23 are formed in the same manner as the aperture 18 and the IR cut coat 21, and are covered with a resin portion 24 constituting a concave lens portion 24a and a non-lens portion 24b. The concave lens portion 24a is in a coaxial position with the convex lens portion 20a.

A portion constituted by a set of convex lens portion 20a, aperture 18, aperture 22, concave lens portion 24a, IR cut coat 21 and IR cut coat 23 corresponds to one unit of the component, and a large number of these are held on the glass substrate 16. In this state, the wafer lens 54 and the spacer substrate 56 are unitized.

As shown in FIG. 8B, the wafer lens 54 has a glass substrate 26 having a wafer shape, and a resin portion 28 is formed on the glass substrate 26. The resin portion 28 constitutes a concave lens portion 28a at a position coaxial with the convex lens portion 20a.

A diaphragm 30 and a resin part 32 are formed in the lower part of the glass substrate 26.

A large number of the diaphragms 30 are formed on the glass substrate 26 in a rectangular shape, and a circular opening 30a is formed at a central portion of each diaphragm 30 except a portion corresponding to the convex lens part 30a of the resin part 32. Is formed.

The diaphragm 30 is covered with a resin portion 32 constituting a convex lens portion 32a, and the convex lens portion 32a is coaxial with the convex lens portion 20a.

A portion constituted by a set of concave lens portion 28a, diaphragm 30, and convex lens portion 32a corresponds to one unit of a component, and is unitized with wafer lens 52 and spacer substrate 56 in a state where a large number of these are held on glass substrate 26. The

As shown in FIG. 2, the spacer substrate 56 is a glass flat plate having a wafer shape like the glass substrates 16 and 26. A large number of circular openings are formed in the spacer substrate 56.

In FIG. 8B, the wafer lens laminated body 50 includes, in order from the upper side to the lower side, a convex lens portion 20a, an IR cut coat 21 (opening 18a of the diaphragm 18), and an IR cut coat 23 (opening of the diaphragm 22). Portion 22a), concave lens portion 24a, concave lens portion 28a, aperture 30a of diaphragm 30, convex lens portion 32a, and aperture 56a of spacer substrate 56 are disposed on optical axis 34, and wafer lens laminate 50 is diced into a dicing line. A plurality of lens units 4 are formed by cutting along 62.

<Lens material>
The resin parts 20, 24, 28, 32 are basically composed of a photocurable resin 44 (see FIG. 6).

As the resin 44, acrylic resin, allyl ester resin, epoxy resin, silicone resin or the like is used. Acrylic resins and allyl ester resins can be reactively cured by radical polymerization, and epoxy resins can be reactively cured by cationic polymerization.

Resin portions 20, 24, 28, and 32 may be made of a thermosetting resin. According to the thermosetting resin, it can be cured by addition polymerization such as silicone in addition to radical polymerization and cationic polymerization.

Details of the resin 44 are as described in (1) to (4).

(1) Acrylic resin The (meth) acrylate used for the polymerization reaction is not particularly limited, and the following (meth) acrylate produced by a general production method can be used. Ester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, ether (meth) acrylate, alkyl (meth) acrylate, alkylene (meth) acrylate, (meth) acrylate having an aromatic ring, alicyclic structure The (meth) acrylate which has is mentioned. One or more of these can be used.

(Meth) acrylate having an alicyclic structure is particularly preferable, and may be an alicyclic structure containing an oxygen atom or a nitrogen atom. For example, cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, cycloheptyl (meth) acrylate, bicycloheptyl (meth) acrylate, tricyclodecyl (meth) acrylate, tricyclodecane dimethanol (meth) acrylate, isoboronyl (meth) ) Acrylate, di (meth) acrylate of hydrogenated bisphenols, and the like. In particular, it preferably has an adamantane skeleton. For example, 2-alkyl-2-adamantyl (meth) acrylate (Japanese Patent Laid-Open No. 2002-193883), adamantyl di (meth) acrylate (Japanese Patent Laid-Open No. 57-5000785), diallyl adamantyl dicarboxylate (Japanese Patent Laid-Open No. 60-60) No. 100537), perfluoroadamantyl acrylate (JP 2004-123687), Shin-Nakamura Chemical Co., Ltd. 2-methyl-2-adamantyl methacrylate, 1,3-adamantanediol diacrylate, 1,3,5-adamantane Triol triacrylate, unsaturated carboxylic acid adamantyl ester (JP 2000-119220 A), 3,3′-dialkoxycarbonyl-1,1 ′ biadamantane (JP 2001-253835 A), 1,1′- Biadamantane compounds U.S. Pat. No. 3,342,880), tetraadamantane (Japanese Patent Laid-Open No. 2006-169177), 2-alkyl-2-hydroxyadamantane, 2-alkyleneadamantane, 1,3-adamantane dicarboxylate di-tert-butyl and the like Curable resins having an adamantane skeleton having no ring (Japanese Patent Laid-Open No. 2001-322950), bis (hydroxyphenyl) adamantanes and bis (glycidyloxyphenyl) adamantanes (Japanese Patent Laid-Open Nos. 11-35522 and 10-130371) No. gazette).

It is also possible to contain other reactive monomers. In the case of (meth) acrylate, for example, methyl acrylate, methyl methacrylate, n-butyl acrylate, n-butyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, isobutyl acrylate, isobutyl methacrylate, tert-butyl acrylate Tert-butyl methacrylate, phenyl acrylate, phenyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, and the like.

Examples of the polyfunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta ( (Meth) acrylate, dipentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, tripentaerythritol octa (meth) acrylate, tripentaerythritol septa (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tri Pentaerythritol penta (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol Such Rutori (meth) acrylate.

(2) Allyl ester resin A resin having an allyl group and cured by radical polymerization. Examples thereof include the following, but are not particularly limited to the following.

Bromine-containing (meth) allyl ester not containing an aromatic ring (Japanese Patent Laid-Open No. 2003-66201), allyl (meth) acrylate (Japanese Patent Laid-Open No. 5-286896), allyl ester resin (Japanese Patent Laid-Open No. 5-286896), No. 2003-66201), a copolymer compound of an acrylate ester and an epoxy group-containing unsaturated compound (JP-A 2003-128725), an acrylate compound (JP-A 2003-147072), an acrylic ester compound (JP-A No. 2005-2064).

(3) Epoxy resin The epoxy resin is not particularly limited as long as it has an epoxy group and is polymerized and cured by light or heat, and an acid anhydride, a cation generator, or the like can be used as a curing initiator. Epoxy resin is preferable in that it has a low cure shrinkage and can be a lens with excellent molding accuracy.

Examples of the epoxy include novolak phenol type epoxy resin, biphenyl type epoxy resin, and dicyclopentadiene type epoxy resin. Examples include bisphenol F diglycidyl ether, bisphenol A diglycidyl ether, 2,2′-bis (4-glycidyloxycyclohexyl) propane, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinyl Cyclohexene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3-dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2 -Cyclopropanedicarboxylic acid bisglycidyl ester and the like.

The curing agent is used for constituting the curable resin material and is not particularly limited. Moreover, in this invention, when comparing the transmittance | permeability of the curable resin material and the optical material after adding an additive, a hardening | curing agent shall not be contained in an additive. As the curing agent, an acid anhydride curing agent, a phenol curing agent, or the like can be preferably used.

Specific examples of acid anhydride curing agents include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride Examples thereof include an acid, a mixture of 3-methyl-hexahydrophthalic anhydride and 4-methyl-hexahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic anhydride, and methyl nadic anhydride.

Moreover, a curing accelerator is contained as necessary. The curing accelerator is not particularly limited as long as it has good curability, is not colored, and does not impair the transparency of the thermosetting resin. For example, 2-ethyl-4-methylimidazole is not limited. Imidazoles such as (2E4MZ), tertiary amines, quaternary ammonium salts, bicyclic amidines such as diazabicycloundecene and their derivatives, phosphines, phosphonium salts, etc. can be used, Two or more kinds may be mixed and used.

(4) Silicone Resin A silicone resin having a siloxane bond with Si—O—Si as the main chain can be used. As the silicone resin, a silicone resin made of a predetermined amount of polyorganosiloxane resin can be used (for example, JP-A-6-9937).

The thermosetting polyorganosiloxane resin is not particularly limited as long as it becomes a three-dimensional network structure with a siloxane bond skeleton by a continuous hydrolysis-dehydration condensation reaction by heating. It exhibits curability and has the property of being hard to be re-softened by overheating once cured.

Such a polyorganosiloxane resin includes the following general formula (A) as a structural unit, and the shape thereof may be any of a chain, a ring, and a network.

((R ₁ ) (R ₂ ) SiO) _n (A)
In the general formula (A), “R ₁ ” and “R ₂ ” represent the same or different substituted or unsubstituted monovalent hydrocarbon groups. Specifically, as “R ₁ ” and “R ₂ ”, an alkyl group such as a methyl group, an ethyl group, a propyl group and a butyl group, an alkenyl group such as a vinyl group and an allyl group, an allyl group such as a phenyl group and a tolyl group Group, a cycloalkyl group such as a cyclohexyl group or a cyclooctyl group, or a group in which a hydrogen atom bonded to a carbon atom of these groups is substituted with a halogen atom, a cyano group, an amino group, or the like, such as a chloromethyl group, 3, 3, Examples include 3-trifluoropropyl group, cyanomethyl group, γ-aminopropyl group, N- (β-aminoethyl) -γ-aminopropyl group, and the like. “R ₁ ” and “R ₂ ” may be a group selected from a hydroxyl group and an alkoxy group. In the general formula (A), “n” represents an integer of 50 or more.

The polyorganosiloxane resin is usually used after being dissolved in a hydrocarbon solvent such as toluene, xylene, or a petroleum solvent, or a mixture of these with a polar solvent. Moreover, you may mix | blend and use what has a different composition in the range which mutually melt | dissolves.

The method for producing the polyorganosiloxane resin is not particularly limited, and any known method can be used. For example, it can be obtained by hydrolysis or alcoholysis of one or a mixture of two or more organohalogenosilanes. The polyorganosiloxane resin generally contains a hydrolyzable group such as a silanol group or an alkoxy group. The group is contained in an amount of 1 to 10% by mass in terms of a silanol group.

These reactions are generally performed in the presence of a solvent capable of melting organohalogenosilane. It can also be obtained by a method of synthesizing a block copolymer by cohydrolyzing a linear polyorganosiloxane having a hydroxyl group, an alkoxy group or a halogen atom at the molecular chain terminal with an organotrichlorosilane. The polyorganosiloxane resin thus obtained generally contains the remaining HCl, but in the composition of the present embodiment, the storage stability is good, so that the one having 10 ppm or less, preferably 1 ppm or less is used. Is good.

<Manufacturing method of wafer lens>
In forming the wafer lens 52, as shown in FIGS. 4A and 4B, first, a positive first convex shape is formed from a negative concave mold 100 corresponding to the optical surface shape of the convex lens portion 20a. Resin mold 210 is molded (first resin mold manufacturing process). Thereafter, as shown in FIGS. 5A and 5B, a negative second concave resin mold 220 is formed from the first convex resin mold 210 (second resin mold manufacturing process), and FIG. As shown in a) and (b), the wafer lens 52 is molded by the molded second concave resin mold 220 (wafer lens manufacturing process).

Hereinafter, the first resin mold manufacturing process, the second resin mold manufacturing process, and the wafer lens manufacturing process will be described.

<< First resin mold manufacturing process >>
As shown in FIG. 4A, a resin 218 serving as a material of the molding part 212 of the first convex resin mold 210 is dropped on the upper surface of the concave mold 100 (dispensing process), and above the concave mold 100. A first resin mold substrate 214 which is a glass substrate is sucked and fixed. At this time, each is arranged so that the concave mold 100 corresponds to a part of the first resin mold substrate 214 (first region R1).

Thereafter, the concave mold 100 is raised to a predetermined height position toward the first resin mold substrate 214 disposed above, and the resin 218 is pressed against the first resin mold substrate 214 (imprint process). .

Then, while maintaining the height position of the concave mold 100 as it is, the upper side of the first resin mold substrate 214 with respect to the resin 218 filled between the concave mold 100 and the first resin mold substrate 214. Then, the resin 218 is photocured (exposure process).

After the light irradiation, the concave mold 100 is lowered, thereby releasing the resin 218 from the concave mold 100 (mold release process).

As a result, as shown in FIG. 4B, a positive shape corresponding to the optical surface shape of the convex lens portion 20a of the wafer lens 52 is formed on a part of the lower surface of the first resin mold substrate 214 (first region R1). A first convex resin mold 210 having a portion 212 is formed. That is, the molding part 212 of the first convex resin mold 210 corresponding to one concave mold 100 is formed on the first resin mold substrate 214.

Thereafter, as shown in FIG. 4A, a predetermined amount of gap from the first region R1 to another position on the lower surface of the first resin mold substrate 214 (second region R2 adjacent to the first region). X is shifted to move the concave mold 100 (see FIG. 4A), and the dispensing process, the imprint process, the exposure process, and the release process are performed as one cycle in the same manner as described above, and this cycle is repeated a predetermined number of times. Then, a plurality of molding portions 212 are sequentially formed on the first resin mold substrate 214 to manufacture the first convex resin mold 210 (see FIG. 4B).

FIG. 13 shows a process of manufacturing the first convex resin mold 210 manufactured using the mold 100. By adopting such a step-and-repeat method, the first resin mold (first convex resin mold 210) having a large area is manufactured from the small mold 100, so that the first resin mold is formed. Only the mold 100 is used, the wafer lens 52 can be formed at low cost, and cost reduction can be achieved.

The gap X is generated because the position accuracy of the mold 100 in the first region R1 and the position accuracy of the mold 100 in the second region R2 cannot be matched exactly. As a result, the resin 218 does not rotate in the formed gap X, and the first resin having the groove portion M in which the base of the first resin mold substrate 214 is exposed on one surface of the first resin mold substrate 214. The mold 210 is manufactured (see FIG. 4B). In FIG. 4, only the vicinity of the left end of the mold 100 before the movement and the right end of the mold 100 are illustrated.

<< Second resin mold manufacturing process >>
As shown in FIG. 5A, a resin 228 is dropped on the upper surface of the first convex resin mold 210 (dispensing process), and the second resin mold that is a glass substrate above the first convex resin mold 210. The substrate 224 is sucked and fixed.

Thereafter, the first convex resin mold 210 is raised to a predetermined height position toward the second resin mold substrate 224 disposed above, and the resin 228 is pressed against the second resin mold substrate 224 ( Imprint process).

Then, while maintaining the height position of the first convex resin mold 210 as it is, the resin 228 filled between the first convex resin mold 210 and the second resin mold substrate 224 is The resin 228 is photocured by irradiating light from above the second resin mold substrate 224 (exposure process).

After the light irradiation, the first convex resin mold 210 is lowered, thereby releasing the resin 228 from the first convex resin mold 210 (release process).

As a result, as shown in FIG. 5B, a second concave resin mold having a negative molded part 222 corresponding to the optical surface shape of the convex lens part 20a of the wafer lens 52 on the lower surface of the second resin mold substrate 224. 220 is manufactured. Since the first resin mold 210 has the groove portion M as described above, the groove portion derived from the groove portion M is also formed in the second resin mold 220.

<Wafer lens manufacturing process>
In the wafer lens manufacturing process, a diaphragm 18 and an IR cut coat 21 that are optical components are formed in advance on a glass substrate 16 for wafer lenses. Specifically, a photoresist mixed with carbon black is applied onto the glass substrate 16, and then the material layer is selectively removed by a known patterning exposure and development process. Form. Further, the IR cut coat 21 is formed on the glass substrate 16 by a known method.

Then, as shown in FIG. 6A, the resin 44 is dropped onto the upper surface of the second concave resin mold 220 (dispensing process), and the glass substrate 16 for the wafer lens is sucked above the second concave resin mold 220.・ Fix it.

Thereafter, the second concave resin mold 220 is raised to a predetermined height position toward the glass substrate 16 disposed above, and the resin 44 is pressed against the glass substrate 16 (imprint process).

Then, while maintaining the height position of the second concave resin mold 220, the resin 44 filled between the second concave resin mold 220 and the glass substrate 16 is irradiated with light from above the glass substrate 16. Irradiate to photocur the resin 44 (exposure process).

After the light irradiation, the second concave resin mold 220 is lowered, thereby releasing the resin 44 from the second concave resin mold 220 (mold release step).

As a result, a plurality of convex lens portions 20 a are formed on the lower surface of the glass substrate 16 as shown in FIG. In the wafer lens 52 having the lens portion formed on one side of the substrate in this way, the groove portion 20e is formed at a position corresponding to the groove portion M of the first resin mold 210 (see FIG. 6B).

Thereafter, although not shown, the glass substrate 16 is turned upside down, and the diaphragm 22 and the IR cut coat 23 are formed on the surface of the glass substrate 16 opposite to the surface on which the convex lens portion 20a is provided. A plurality of concave lens portions 24a are formed through a dispensing process, an imprint process, an exposure process, and a mold release process in the wafer lens manufacturing process. In this way, the wafer lens 52 is manufactured. The mold, the first resin mold, and the second resin mold to be used have shapes corresponding to the shapes of the concave lens portion 24a to be molded.

Also, the wafer lens 54 can be manufactured in the same manner through the first resin mold manufacturing process, the second resin mold manufacturing process, and the wafer lens manufacturing process described above, and the description thereof is omitted here. To do.

<Method for producing wafer lens laminate>
As shown in FIG. 7A, an adhesive 281 is applied to the upper surface of the non-lens portion 28b (flat portion 28c) of the resin portion 28 of the wafer lens 54, and the wafer lenses 52 and 54 are pressed against each other. The adhesive 281 is made of, for example, a photocurable resin and is cured by light irradiation. In addition, it may be composed of a thermosetting resin. Thereafter, light is irradiated from below the wafer lens 52 to cure the adhesive 281 and fix the wafer lenses 52 and 54 (see FIG. 7B).

Thereafter, as shown in FIG. 8A, a resin K is filled into a cavity K formed by the groove 24e of the wafer lens 52 and the groove 28d of the wafer lens 54. As a filling method, as shown in FIGS. 9A and 9B, the resin 101 is filled in the syringe 101, and the resin J is filled in the cavity K through the needle 102.

The resin J may be a photo-curing resin or a thermosetting resin as in the case of the lens material. In particular, it is ghost to use a black resin having a light-shielding property against incident light. It is preferable in terms of countermeasures. In the case of a photocurable resin, the same resin 44 as that of the resin portions 20, 24, 28, 30 of the wafer lenses 52, 54 may be used.

When a photocurable resin is used as the resin J, after the resin J is filled, the resin J is irradiated with light and cured.

Thereafter, as shown in FIG. 8B, an adhesive 321 is applied to the lower surface of the non-lens portion 32b (groove portion 32d) of the resin portion 32 of the wafer lens 54, and the wafer lens 54 and the spacer substrate 56 are pressed against each other. . As the adhesive 321, the same photo-curing resin or thermosetting resin as the above-described adhesive 281 can be used. Then, the adhesive 321 is cured by light irradiation, and the wafer lens 54 and the spacer substrate 56 are fixed. As a result, the wafer lens laminate 50 is manufactured.

The manufactured wafer lens laminate 50 is obtained by dicing the glass substrates 16 and 26 and the spacer substrate 56 with the dicing line 62 at the position of the filled resin J, whereby the lens blocks 8 and 10 and the spacer 12 are bonded and laminated. A plurality of the set of units are formed.

As described above, in the step-and-repeat method, after molding in the first region R1, a predetermined amount of gap X occurs between the adjacent second regions R2, and as a result, the first resin mold A first resin mold 210 having a groove portion M in which the base of the first resin mold substrate 214 is exposed on one surface of the substrate 214 is manufactured. Furthermore, when the second resin mold 220 is manufactured using the first resin mold 210 having such a groove M, and the wafer lens 52 is manufactured using the second resin mold 220, the wafer lens 52 is formed. Also, a groove 20e is formed at a position corresponding to the groove M of the first resin mold 210. Then, as shown in FIGS. 7A and 7B, the wafer lenses 52 and 54 having the groove portions 24e and 28d are laminated and bonded together to form a wafer lens laminate 50, and the glass substrate of the wafer lenses 52 and 54 is obtained. When dicing 16 and 26 into pieces for each pair of lens portions, a position where there is a cavity K formed by the groove portions 24e and 28d of the laminated wafer lenses 52 and 54 is diced. .

Therefore, as described above, when the resin is not filled in the cavity K, bending or cracking may occur due to an impact during dicing, or the glass substrates 16 and 26 and the resin portions 24 and 28 may be peeled off. Of course, such a cavity also occurs when only one of the wafer lenses to be directly laminated has a groove and the other has no groove.

In this embodiment, since the cavity K is filled with resin, the occurrence of bending and cracking due to impact during dicing is prevented, and the occurrence of peeling between the glass substrates 16 and 26 and the resin portions 24 and 28 is also prevented. The

In the description so far, the lens block 8 and the spacer 12 are included in the lens block 8 and 10 to form the wafer lens laminated body 50. However, the lens unit 8 and only the wafer lens laminated body 50 is diced and the optical unit is used. It is good. At this time, the spacer 12 is cut in advance to the same size as the optical unit, and attached to the optical unit together with the sensor unit 6.

Therefore, when viewed with an optical unit obtained by cutting, if the material filling the grooves 24e and 28d is made of a light shielding material, the resin that forms the concave lens portion 24a of the lens block 8 as shown in FIG. A light-shielding member having a light-shielding property against incident light is formed between the portion 24 and the resin portion 28 where the concave lens portion 28a of the lens block 10 is formed, and the wafer lens stack 50 is collectively cut after filling. The light shielding member is formed so as to be exposed on the side surfaces of the lens locks 8 and 10, and the side surface portion which is a cut surface of the lens block 8 and 10 and the exposed light shielding material have the same side surface portion. It becomes the structure which forms.

As a result, problems such as cracks when cutting the wafer lens can be reduced, and even when viewed with the optical unit as a finished product, the resin is cut after filling with the light shielding member, so the sides are the same surface In addition, it is possible to provide a compact optical unit and a lens unit as a whole without the trouble of separately forming a cover package that covers the side surface separately in a different shape.

Of course, if the configuration in which the sensor unit 6 is cut together in addition to the spacer 12 is adopted, the side surface portion of the spacer 12 and the side surface portion of the sensor unit 6 as the imaging device 2 also form the same side surface portion. It becomes composition.

As described above, the resin portions 20, 24, 28, and 32 of the wafer lenses 52 and 54 have the non-lens portions 20b, 24b, 28b, and 32b on the outer periphery of the convex lens portions 20a, 24a, 28a, and 32a that are optical surfaces. And are separated from the other lens parts 20a, 24a, 28a, 32a by grooves 20e, 24e, 28d, 32d whose side walls are the side peripheral surfaces of the non-lens parts 20b, 24b, 28b, 32b. Since the resin J is filled in the cavity K formed by the groove portion 24e of one wafer lens 52 and the groove portion 28d of the other wafer lens 54 between the wafer lenses 52 and 54 thus formed, bending during dicing is performed. And the occurrence of cracks, and the glass substrates 16 and 26 of the wafer lenses 52 and 54 and the resin portions 20, 24, 28, Peeling and 2 can be prevented.

Also, the resin J filled in the cavity K is made of black resin, so that it is excellent in ghost countermeasures.

Further, the IR cut coats 21 and 23 formed on the glass substrate 16 of the wafer lens 52 are formed only at positions corresponding to the convex lens portion 20a and the concave lens portion 24a, and a small circular shape is formed on the glass substrates 16 and 26. Since they are formed side by side, infrared rays can be reliably shielded from the convex lens portion 20a and the concave lens portion 24a. Furthermore, the warp of the glass substrate 16 can be reduced as compared with the case where an IR cut coat is formed on the entire surface of the glass substrate 16.

[Second Embodiment]
<Method for producing wafer lens laminate>
In the second embodiment, as shown in FIGS. 10A and 10B, in the method of manufacturing the wafer lens laminate of the first embodiment, instead of filling the resin K in the cavity K, the lens portion and its surroundings. The flat plate 58 which is a plate member provided with an opening in a region facing the flat portion of the lens is disposed so that the flat portion of the lens portion and the surrounding flat portion and the opening of the flat plate 58 are opposed to each other, and the flat plate 58 is positioned in the cavity K. To do. The flat plate 58 is previously smaller than the size of the cavity K, and the space between the cavity K and the flat plate 58 is filled with an adhesive 581.

Specifically, as shown in FIG. 11A, an adhesive 581 is applied to the lower surface of the flat plate 58, and the flat plate 58 and the wafer lens are bonded to the groove 28d forming the cavity K. 54 are pressed against each other.

Further, as shown in FIG. 11B, an adhesive 582 is applied to the upper surface of the flat plate 58, while an adhesive 241 is applied to the lower surface of the flat portion 24c of the resin portion 24 of the wafer lens 52, and the flat plate 58 and the wafer are coated. The lenses 52 are pressed against each other. As the adhesives 582 and 241, the same photo-curable resin or thermosetting resin as the adhesive 281 of the first embodiment described above can be used.

When a photo-curable resin is used as the adhesives 582 and 241, as shown in FIG. 12A, the adhesives 581, 582 and 241 are cured by irradiating light from above the wafer lens 52, and the wafer lens 52. 54 and the flat plate 58 are fixed. At this time, the adhesives 581 and 582 are filled in the gap between the flat plate 58 and the cavity K and cured.

Thereafter, as in FIG. 8B, an adhesive 321 is applied to the lower surface of the non-lens portion 32b (groove portion 32d) of the resin portion 32 of the wafer lens 54, as shown in FIG. The lens 54 and the spacer substrate 56 are pressed against each other. Thereafter, the adhesive 321 is cured by light irradiation, and the wafer lenses 52 and 54 and the spacer substrate 56 are fixed. As a result, the wafer lens laminate 50 is manufactured.

In the manufactured wafer lens laminate 50, the glass blocks 16, 26, the flat plate 58, and the spacer substrate 56 are diced by the dicing line 62 in which the flat plate 58 is arranged, whereby the lens blocks 8, 10 and the spacer 12 are separated. A plurality of bonded and laminated units are formed.

As described above, the resin portions 20, 24, 28, and 32 of the wafer lenses 52 and 54 have the non-lens portions 20b, 24b, 28b, and 32b on the outer periphery of the convex lens portions 20a, 24a, 28a, and 32a that are optical surfaces. And is separated from the other lens portions 20a, 24a, 28a, 32a by the groove portions 20e, 24e, 28d, 32d having the side peripheral surfaces of the non-lens portions 20b, 24b, 28b, 32b as side walls, and are laminated together. Between the wafer lenses 52 and 54, a flat plate 58 smaller than the hollow K is disposed in a cavity K formed by the groove portion 24e of one wafer lens 52 and the groove portion 28d of the other wafer lens 54. Between the space 58 and the cavity K, adhesives 581 and 582 which are resins are filled. Therefore, it is possible to prevent the occurrence of bending and cracks during dicing, and to prevent the glass substrates 16 and 26 of the wafer lenses 52 and 54 and the resin portions 20, 24, 28 and 32 from peeling off.

Further, since the flat plate 58 is smaller than the size of the cavity K and the gap between the cavity K and the flat plate 58 is filled with a resin adhesive, even when the wafer lenses 52 and 54 are joined together, the convex lens portion 24a and the concave lens portion. The core thickness at 28a can be made uniform, and a highly accurate wafer lens laminate 50 can be obtained.

2 Imaging device 4 Lens unit (optical unit)
6 Sensor unit 8 Lens block (first lens block)
10 Lens block (second lens block)
12 Spacer 14 Cover package (cover member)
16 Glass substrate 18 Aperture 20 Resin part 20a Convex lens part (first lens part)
20b Non-lens part 20c Inclined part 20d Flat part 20e Groove part 21 IR cut filter 22 Aperture 23 IR cut filter 24a Concave lens part (second lens part)
24b Non-lens part 24d Flat part 24e Groove part 26 Glass substrate 28 Resin part 28a Concave lens part (third lens part)
28b Non-lens part 28c Flat part 28d Groove part 30 Aperture 32 Resin part 32a Convex lens part (fourth lens part)
32b Non-lens part 32c Flat part 32d Groove part 50 Wafer lens stack 52, 54 Wafer lens 56 Spacer substrate 58 Flat plate 100 Concave mold 210 First convex resin mold 212 Molding part 214 First resin mold substrate 220 Second Concave resin mold 222 Molded part 224 Second resin mold substrate 581 Adhesive 582 Adhesive K Cavity J Resin

Claims (15)

1. A first lens block in which a first lens portion and a first non-lens portion around the first lens portion are formed of resin on at least one surface of the first glass substrate, and at least one surface of the second glass substrate And a second lens block in which a second lens portion and a second non-lens portion around the second lens portion are formed of a resin so that the first non-lens portion and the second non-lens portion face each other. An optical unit bonded to
   A light-shielding member having a light-shielding property with respect to incident light is exposed on the side surfaces of the first and second lens blocks at least at a part of the joint portion between the first non-lens part and the second non-lens part. The optical unit is characterized in that the light shielding member forms a side surface portion on the same surface together with the side surface portions of the first and second lens blocks.
2. 2. The optical unit according to claim 1, wherein the light shielding member is a resin injected into a cavity formed in the joint portion or a flat plate installed in the cavity portion.
3. A first lens block in which a first lens portion and a first non-lens portion around the first lens portion are formed of resin on at least one surface of the first glass substrate, and at least one surface of the second glass substrate And a second lens block in which a second lens portion and a second non-lens portion around the second lens portion are formed of a resin so that the first non-lens portion and the second non-lens portion face each other. An optical unit bonded to the
   One end surface is joined to the surface of the second lens block opposite to the surface where the second lens portion and the second non-lens portion are formed, and an opening is formed at a position corresponding to the first and second lens portions. A spacer made of glass having,
   A sensor unit having a cover member made of glass, bonded to the other end surface of the spacer, and having an image sensor disposed at a predetermined interval from the cover member,
   A light-shielding member having a light-shielding property with respect to incident light is exposed on the side surfaces of the first and second lens blocks at least at a part of the joint portion between the first non-lens part and the second non-lens part. The light-shielding member forms a side surface portion on the same surface together with a side surface portion of the first and second lens blocks, a side surface portion of the spacer, and a side surface portion of the sensor unit. An imaging device.
4. 4. The imaging apparatus according to claim 3, wherein the light shielding member is a resin injected into a hollow portion formed in the joint portion, or a flat plate installed in the hollow portion.
5. A convex surface facing the object side, a first lens portion formed on a part of the resin portion provided on one surface of the first glass substrate, a concave surface facing the image side, and the other surface of the first glass substrate A first lens block having a second lens part formed on a part of the provided resin part;
   The third lens part formed on a part of the resin part provided on one surface of the second glass substrate with the concave surface facing the object side, and one of the resin parts provided on the other surface of the second glass substrate An optical unit in which a second lens block having a fourth lens part formed on a part is joined to a resin part on which the second lens part and the third lens part are formed,
   A light-shielding member having a light-shielding property with respect to incident light is disposed between the resin part in which the second lens part is formed and the resin part in which the third lens part is formed, and side surfaces of the first and second lens blocks. The optical unit is formed so as to be exposed to the surface, and the side surface portion is formed on the same surface together with the side surface portions of the first and second lens blocks.
6. A convex surface facing the object side, a first lens portion formed on a part of the resin portion provided on one surface of the first glass substrate, a concave surface facing the image side, and the other surface of the first glass substrate A first lens block having a second lens part formed on a part of the provided resin part, a concave surface facing the object side, and a part of the resin part provided on one surface of the second glass substrate; A second lens block having a third lens part formed and a fourth lens part formed on a part of a resin part provided on the other surface of the second glass substrate; An optical unit in which the resin part formed with the third lens part is joined;
   A spacer made of glass having one end surface bonded to the resin portion where the fourth lens portion of the second lens block is formed and having an opening at a position corresponding to the fourth lens portion from the first lens portion;
   An image pickup apparatus comprising: a cover member made of glass to which the other end surface of the spacer is bonded; and a sensor unit having an image pickup element arranged at a predetermined interval from the cover member.
   A light-shielding member having a light-shielding property with respect to incident light is disposed between the resin part in which the second lens part is formed and the resin part in which the third lens part is formed, and side surfaces of the first and second lens blocks. The light shielding member is exposed and formed on the side surfaces of the first and second lens blocks, and the side surfaces of the first and second lens blocks, the side surfaces of the spacer substrate, An image pickup apparatus, wherein a side part of the same surface is formed together with a side part of the sensor unit.
7. A wafer lens laminate in which a plurality of wafer lenses in which a resin portion having a plurality of lens portions is formed on a substrate is laminated, and at least one of the two wafer lenses directly laminated is:
   The resin part has a non-lens part on the outer periphery of each lens part,
   The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
   A wafer lens laminate, wherein a cavity formed between the groove portion of one wafer lens and the other wafer lens to be laminated is filled between the wafer lenses laminated to each other. .
8. The wafer lens laminate according to claim 7, wherein the resin filled in the cavity is a black resin having a light shielding property against incident light.
9. The wafer lens laminate according to claim 7, wherein the groove is formed on both of the wafer lenses to be laminated.
10. A wafer lens laminate in which a plurality of wafer lenses in which a resin portion having a plurality of lens portions is formed on a substrate is laminated, and at least one of the two wafer lenses directly laminated is:
    The resin part has a non-lens part on the outer periphery of each lens part,
    The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
    A flat plate smaller than the cavity is disposed in a cavity formed between the groove portion of one wafer lens and the other wafer lens between the wafer lenses laminated to each other. A wafer lens laminate, which is filled with a resin therebetween.
11. A method of manufacturing a wafer lens laminate in which a plurality of wafer lenses each having a resin portion having a plurality of lens portions formed on a substrate are laminated, wherein at least one of the two wafer lenses directly laminated is:
    The resin part of the wafer lens has a non-lens part on the outer periphery of each lens part,
    The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
    Wafer lenses are stacked on top of each other,
    A method of manufacturing a wafer lens laminate, comprising: filling a cavity formed between the groove portion of one wafer lens and the other wafer lens.
12. 12. The method for producing a wafer lens laminate according to claim 11, wherein the resin filled in the cavity is a black resin having a light shielding property against incident light.
13. 12. The method of manufacturing a wafer lens laminate according to claim 11, wherein the wafer lens is manufactured by a step-and-repeat method.
14. A method of manufacturing a wafer lens laminate in which a plurality of wafer lenses each having a resin portion having a plurality of lens portions formed on a substrate are laminated, wherein at least one of the two wafer lenses directly laminated is:
    The resin part of the wafer lens has a non-lens part on the outer periphery of each lens part,
    The non-lens part is configured to be partitioned from other lens parts by a groove part having a side peripheral surface as a side wall,
    Wafer lenses are stacked on top of each other,
    A flat plate smaller than the cavity is disposed in a cavity formed between the groove portion of one wafer lens and the other wafer lens, and a resin is filled between the flat plate and the cavity. A method for producing a wafer lens laminate.
15. 15. The method of manufacturing a wafer lens laminate according to claim 14, wherein the wafer lens is manufactured by a step-and-repeat method.

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