WO2011008443A3 - Wafer level camera module with active optical element - Google Patents

Wafer level camera module with active optical element Download PDF

Info

Publication number
WO2011008443A3
WO2011008443A3 PCT/US2010/039595 US2010039595W WO2011008443A3 WO 2011008443 A3 WO2011008443 A3 WO 2011008443A3 US 2010039595 W US2010039595 W US 2010039595W WO 2011008443 A3 WO2011008443 A3 WO 2011008443A3
Authority
WO
WIPO (PCT)
Prior art keywords
module
optical element
camera module
solder balls
wafer level
Prior art date
Application number
PCT/US2010/039595
Other languages
French (fr)
Other versions
WO2011008443A2 (en
Inventor
Bahram Afshari
John Toor
Samuel Wennyann Ho
Original Assignee
Lensvector Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lensvector Inc. filed Critical Lensvector Inc.
Publication of WO2011008443A2 publication Critical patent/WO2011008443A2/en
Publication of WO2011008443A3 publication Critical patent/WO2011008443A3/en
Priority to US13/338,756 priority Critical patent/US8891006B2/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A wafer level camera module may be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors may be a group of solder balls, and the module may have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls may be coplanar in a predetermined grid pattern, and all of the components of the device may be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.
PCT/US2010/039595 2009-06-29 2010-06-23 Wafer level camera module with active optical element WO2011008443A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US13/338,756 US8891006B2 (en) 2009-06-29 2011-12-28 Wafer level camera module with active optical element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22140809P 2009-06-29 2009-06-29
US61/221,408 2009-06-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/338,756 Continuation-In-Part US8891006B2 (en) 2009-06-29 2011-12-28 Wafer level camera module with active optical element

Publications (2)

Publication Number Publication Date
WO2011008443A2 WO2011008443A2 (en) 2011-01-20
WO2011008443A3 true WO2011008443A3 (en) 2011-11-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/039595 WO2011008443A2 (en) 2009-06-29 2010-06-23 Wafer level camera module with active optical element

Country Status (2)

Country Link
US (1) US8891006B2 (en)
WO (1) WO2011008443A2 (en)

Families Citing this family (90)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
US11792538B2 (en) 2008-05-20 2023-10-17 Adeia Imaging Llc Capturing and processing of images including occlusions focused on an image sensor by a lens stack array
US8866920B2 (en) 2008-05-20 2014-10-21 Pelican Imaging Corporation Capturing and processing of images using monolithic camera array with heterogeneous imagers
US8902321B2 (en) 2008-05-20 2014-12-02 Pelican Imaging Corporation Capturing and processing of images using monolithic camera array with heterogeneous imagers
EP2502115A4 (en) 2009-11-20 2013-11-06 Pelican Imaging Corp Capturing and processing of images using monolithic camera array with heterogeneous imagers
KR20110064156A (en) * 2009-12-07 2011-06-15 삼성전자주식회사 Imaging device and its manufacturing method
CN102238319A (en) * 2010-04-26 2011-11-09 鸿富锦精密工业（深圳）有限公司 Image pickup device
KR101824672B1 (en) 2010-05-12 2018-02-05 포토네이션 케이맨 리미티드 Architectures for imager arrays and array cameras
TWI484243B (en) * 2010-06-10 2015-05-11 Hon Hai Prec Ind Co Ltd Lens module and camera device
US8878950B2 (en) 2010-12-14 2014-11-04 Pelican Imaging Corporation Systems and methods for synthesizing high resolution images using super-resolution processes
US8559806B2 (en) * 2010-12-29 2013-10-15 Samsung Electro-Mechanics Co., Ltd. Camera module and method for manufacturing the same
WO2012116302A2 (en) * 2011-02-24 2012-08-30 Flextronics Ap, Llc Autofocus-zoom camera module integrating liquid crystal device as high speed shutter
US10009528B2 (en) * 2011-02-24 2018-06-26 Nan Chang O-Film Optoelectronics Technology Ltd Autofocus camera module packaging with circuitry-integrated actuator system
US8545114B2 (en) 2011-03-11 2013-10-01 Digitaloptics Corporation Auto focus-zoom actuator or camera module contamination reduction feature with integrated protective membrane
JP2014519741A (en) 2011-05-11 2014-08-14 ペリカン イメージング コーポレイション System and method for transmitting and receiving array camera image data
KR101944280B1 (en) 2011-05-18 2019-01-31 엘지이노텍 주식회사 Camera Module
US8896743B2 (en) * 2011-06-08 2014-11-25 Omnivision Technologies, Inc. Enclosure for image capture systems with focusing capabilities
US8878976B2 (en) * 2011-06-08 2014-11-04 Omnivision Technologies, Inc. Image capture systems with focusing capabilities
US20130265459A1 (en) 2011-06-28 2013-10-10 Pelican Imaging Corporation Optical arrangements for use with an array camera
WO2013043761A1 (en) 2011-09-19 2013-03-28 Pelican Imaging Corporation Determining depth from multiple views of a scene that include aliasing using hypothesized fusion
EP2761534B1 (en) 2011-09-28 2020-11-18 FotoNation Limited Systems for encoding light field image files
JP2014530581A (en) * 2011-10-11 2014-11-17 ペリカン イメージング コーポレイション Lens stack array including adaptive optics
US9412206B2 (en) 2012-02-21 2016-08-09 Pelican Imaging Corporation Systems and methods for the manipulation of captured light field image data
US9210392B2 (en) 2012-05-01 2015-12-08 Pelican Imaging Coporation Camera modules patterned with pi filter groups
KR101940478B1 (en) * 2012-05-07 2019-01-21 엘지이노텍 주식회사 Camera Module
KR102033171B1 (en) * 2012-06-22 2019-10-16 엘지이노텍 주식회사 Camera Module
WO2014005123A1 (en) 2012-06-28 2014-01-03 Pelican Imaging Corporation Systems and methods for detecting defective camera arrays, optic arrays, and sensors
US20140002674A1 (en) 2012-06-30 2014-01-02 Pelican Imaging Corporation Systems and Methods for Manufacturing Camera Modules Using Active Alignment of Lens Stack Arrays and Sensors
KR102107654B1 (en) * 2012-07-30 2020-05-07 엘지이노텍 주식회사 Camera Module
TW201408060A (en) * 2012-08-06 2014-02-16 Hon Hai Prec Ind Co Ltd Camera module and method for making camera module
CN107889344A (en) * 2012-08-15 2018-04-06 深圳迈辽技术转移中心有限公司 Flexible circuit board device
CN107346061B (en) 2012-08-21 2020-04-24 快图有限公司 System and method for parallax detection and correction in images captured using an array camera
WO2014032020A2 (en) 2012-08-23 2014-02-27 Pelican Imaging Corporation Feature based high resolution motion estimation from low resolution images captured using an array source
US9214013B2 (en) 2012-09-14 2015-12-15 Pelican Imaging Corporation Systems and methods for correcting user identified artifacts in light field images
CN202773174U (en) * 2012-09-14 2013-03-06 豪威科技(上海)有限公司 Reinforcement structure for protecting wafer level camera module
CN103715208B (en) * 2012-09-28 2016-12-21 意法半导体研发(深圳)有限公司 There is bonding and fill image device and the correlation technique of opening
CN104685860A (en) 2012-09-28 2015-06-03 派力肯影像公司 Generating images from light fields utilizing virtual viewpoints
US9143711B2 (en) 2012-11-13 2015-09-22 Pelican Imaging Corporation Systems and methods for array camera focal plane control
CN103813070A (en) * 2012-11-14 2014-05-21 鸿富锦精密工业（深圳）有限公司 Imaging device
US9462164B2 (en) 2013-02-21 2016-10-04 Pelican Imaging Corporation Systems and methods for generating compressed light field representation data using captured light fields, array geometry, and parallax information
US9253380B2 (en) 2013-02-24 2016-02-02 Pelican Imaging Corporation Thin form factor computational array cameras and modular array cameras
US9774789B2 (en) 2013-03-08 2017-09-26 Fotonation Cayman Limited Systems and methods for high dynamic range imaging using array cameras
US8866912B2 (en) 2013-03-10 2014-10-21 Pelican Imaging Corporation System and methods for calibration of an array camera using a single captured image
US9888194B2 (en) 2013-03-13 2018-02-06 Fotonation Cayman Limited Array camera architecture implementing quantum film image sensors
WO2014165244A1 (en) 2013-03-13 2014-10-09 Pelican Imaging Corporation Systems and methods for synthesizing images from image data captured by an array camera using restricted depth of field depth maps in which depth estimation precision varies
US9106784B2 (en) 2013-03-13 2015-08-11 Pelican Imaging Corporation Systems and methods for controlling aliasing in images captured by an array camera for use in super-resolution processing
WO2014164550A2 (en) 2013-03-13 2014-10-09 Pelican Imaging Corporation System and methods for calibration of an array camera
WO2014153098A1 (en) 2013-03-14 2014-09-25 Pelican Imaging Corporation Photmetric normalization in array cameras
US9578259B2 (en) 2013-03-14 2017-02-21 Fotonation Cayman Limited Systems and methods for reducing motion blur in images or video in ultra low light with array cameras
WO2014145856A1 (en) 2013-03-15 2014-09-18 Pelican Imaging Corporation Systems and methods for stereo imaging with camera arrays
US10122993B2 (en) 2013-03-15 2018-11-06 Fotonation Limited Autofocus system for a conventional camera that uses depth information from an array camera
US9497370B2 (en) 2013-03-15 2016-11-15 Pelican Imaging Corporation Array camera architecture implementing quantum dot color filters
US9497429B2 (en) 2013-03-15 2016-11-15 Pelican Imaging Corporation Extended color processing on pelican array cameras
US9445003B1 (en) 2013-03-15 2016-09-13 Pelican Imaging Corporation Systems and methods for synthesizing high resolution images using image deconvolution based on motion and depth information
CN104253133B (en) * 2013-06-26 2017-07-28 深圳赛意法微电子有限公司 Camera module and preparation method thereof
CN104469099A (en) * 2013-09-25 2015-03-25 深圳富泰宏精密工业有限公司 Camera installation structure and portable electronic device comprising same
WO2015048694A2 (en) 2013-09-27 2015-04-02 Pelican Imaging Corporation Systems and methods for depth-assisted perspective distortion correction
US9671671B2 (en) * 2013-10-10 2017-06-06 Stmicroelectronics Pte Ltd Optical assembly including electrically conductive coupling member and related methods
WO2015070105A1 (en) 2013-11-07 2015-05-14 Pelican Imaging Corporation Methods of manufacturing array camera modules incorporating independently aligned lens stacks
US10119808B2 (en) 2013-11-18 2018-11-06 Fotonation Limited Systems and methods for estimating depth from projected texture using camera arrays
EP3075140B1 (en) 2013-11-26 2018-06-13 FotoNation Cayman Limited Array camera configurations incorporating multiple constituent array cameras
EP3073894B1 (en) * 2013-11-27 2022-03-30 Children's National Medical Center Corrected 3d imaging
KR102165182B1 (en) * 2014-02-13 2020-10-13 삼성전자주식회사 An electronic device including opening
US10089740B2 (en) 2014-03-07 2018-10-02 Fotonation Limited System and methods for depth regularization and semiautomatic interactive matting using RGB-D images
KR102217098B1 (en) * 2014-04-17 2021-02-18 엘지이노텍 주식회사 Camera module
US9521319B2 (en) 2014-06-18 2016-12-13 Pelican Imaging Corporation Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor
CN113256730B (en) 2014-09-29 2023-09-05 快图有限公司 System and method for dynamic calibration of an array camera
US9768216B2 (en) * 2014-11-07 2017-09-19 Stmicroelectronics Pte Ltd Image sensor device with different width cell layers and related methods
US9942474B2 (en) 2015-04-17 2018-04-10 Fotonation Cayman Limited Systems and methods for performing high speed video capture and depth estimation using array cameras
US9703173B2 (en) * 2015-04-21 2017-07-11 Apple Inc. Camera module structure having electronic device connections formed therein
US10426037B2 (en) * 2015-07-15 2019-09-24 International Business Machines Corporation Circuitized structure with 3-dimensional configuration
US10021280B2 (en) 2015-08-18 2018-07-10 Apple Inc. Camera module electrical architecture
US10261001B2 (en) * 2015-10-21 2019-04-16 Flir Detection, Inc. Manually operated desorber for sensor detector device
CN108289597A (en) * 2015-10-27 2018-07-17 奥林巴斯株式会社 Photographic device and endoscope
US10026765B2 (en) * 2015-11-11 2018-07-17 Pixart Imaging (Penang) Sdn. Bhd. Apparatus and sensor chip component attaching method
US9933601B2 (en) * 2015-12-16 2018-04-03 Intel Corporation Stacked wafer lens and camera
US10840396B2 (en) 2016-04-15 2020-11-17 Ams Sensors Singapore Pte. Ltd. Optoelectronic modules with alignment spacers and methods for assembling the same
US11150438B2 (en) 2016-08-10 2021-10-19 Apple Inc. Protected interconnect for solid state camera module
US10482618B2 (en) 2017-08-21 2019-11-19 Fotonation Limited Systems and methods for hybrid depth regularization
US10750061B2 (en) * 2017-09-15 2020-08-18 Omnivision Technologies, Inc. Endoscope having camera module and LED on flexible printed circuit
KR102543699B1 (en) * 2018-01-23 2023-06-13 엘지이노텍 주식회사 Liquid len module, lens assembly including the module, and camera module including the assembly
MX2022003020A (en) 2019-09-17 2022-06-14 Boston Polarimetrics Inc Systems and methods for surface modeling using polarization cues.
EP4042366A4 (en) 2019-10-07 2023-11-15 Boston Polarimetrics, Inc. Systems and methods for augmentation of sensor systems and imaging systems with polarization
KR20230116068A (en) 2019-11-30 2023-08-03 보스턴 폴라리메트릭스, 인크. System and method for segmenting transparent objects using polarization signals
CN115552486A (en) 2020-01-29 2022-12-30 因思创新有限责任公司 System and method for characterizing an object pose detection and measurement system
KR20220133973A (en) 2020-01-30 2022-10-05 인트린식 이노베이션 엘엘씨 Systems and methods for synthesizing data to train statistical models for different imaging modalities, including polarized images
WO2021243088A1 (en) 2020-05-27 2021-12-02 Boston Polarimetrics, Inc. Multi-aperture polarization optical systems using beam splitters
US11954886B2 (en) 2021-04-15 2024-04-09 Intrinsic Innovation Llc Systems and methods for six-degree of freedom pose estimation of deformable objects
US11290658B1 (en) 2021-04-15 2022-03-29 Boston Polarimetrics, Inc. Systems and methods for camera exposure control
US11689813B2 (en) 2021-07-01 2023-06-27 Intrinsic Innovation Llc Systems and methods for high dynamic range imaging using crossed polarizers

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060020387A1 (en) * 2004-07-20 2006-01-26 Koji Nagata Navigation apparatus, position information registration method and program thereof
US20060103758A1 (en) * 2004-11-12 2006-05-18 Samsung Techwin Co., Ltd. Camera module and method of manufacturing the same
US20070229754A1 (en) * 2006-03-03 2007-10-04 Universite Laval Method and apparatus for spatially modulated electric field generation and electro-optical tuning using liquid crystals
US20080251707A1 (en) * 2001-10-23 2008-10-16 Tessera North America Optical chassis, camera having an optical chassis, and associated methods
US20090134483A1 (en) * 2007-11-23 2009-05-28 Jui-Ping Weng Electronic assembly for image sensor device

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176017A (en) 1984-02-23 1985-09-10 Canon Inc Optical element
JP2925064B2 (en) 1993-12-02 1999-07-26 矢崎総業株式会社 Tunable wavelength filter
US5808679A (en) 1996-09-06 1998-09-15 Microtek International Inc. Camera lens assembly using rotatable conductive plate connectors
US7369327B1 (en) 1998-06-09 2008-05-06 Olympus Corporation Variable optical-property element and optical apparatus including the same
JP4245731B2 (en) 1999-06-08 2009-04-02 オリンパス株式会社 Liquid crystal lens unit and liquid crystal lens assembly
JP2002072244A (en) 2000-08-28 2002-03-12 Minolta Co Ltd Display device and manufacturing method thereof
JP2004247947A (en) 2003-02-13 2004-09-02 Olympus Corp Optical apparatus
JP4655462B2 (en) 2003-09-09 2011-03-23 コニカミノルタオプト株式会社 Photography lens and imaging device
DE10344770A1 (en) 2003-09-26 2005-05-04 Siemens Ag Optical module and optical system
DE10344762B4 (en) 2003-09-26 2006-06-29 Siemens Ag Optical module with lens unit and optical system supported on the sensitive surface
JP3921467B2 (en) * 2003-12-11 2007-05-30 シャープ株式会社 CAMERA MODULE, CAMERA MODULE MANUFACTURING METHOD, ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD
JP4532482B2 (en) 2004-03-31 2010-08-25 株式会社びにっと Double liquid crystal aberration correction element and manufacturing method thereof
KR101244647B1 (en) 2004-11-02 2013-03-18 이-비젼 엘엘씨 Electro-active spectacles and method of fabricating same
JP4091593B2 (en) * 2004-11-05 2008-05-28 Ｓｍｋ株式会社 Connection structure of camera module with autofocus function and module connector
JP2006243573A (en) 2005-03-07 2006-09-14 Citizen Watch Co Ltd Liquid crystal lens and camera module
CN100583953C (en) * 2005-04-01 2010-01-20 松下电器产业株式会社 Image pickup device
JP4707176B2 (en) * 2005-04-28 2011-06-22 シチズンホールディングス株式会社 Imaging lens and camera module
US20070063048A1 (en) 2005-09-14 2007-03-22 Havens William H Data reader apparatus having an adaptive lens
US7469100B2 (en) 2005-10-03 2008-12-23 Flextronics Ap Llc Micro camera module with discrete manual focal positions
JP2007208587A (en) * 2006-02-01 2007-08-16 Citizen Electronics Co Ltd Imaging structure of camera
CN100561285C (en) * 2006-04-07 2009-11-18 鸿富锦精密工业（深圳）有限公司 Camera lens module
US7715107B2 (en) 2006-04-25 2010-05-11 Asml Netherlands B.V. Optical element for correction of aberration, and a lithographic apparatus comprising same
EP1890180A1 (en) * 2006-08-15 2008-02-20 STMicroelectronics (Research & Development) Limited Lens unit
US7724347B2 (en) 2006-09-05 2010-05-25 Tunable Optix Corporation Tunable liquid crystal lens module
WO2008041469A1 (en) 2006-10-03 2008-04-10 Panasonic Corporation Imaging device
US8027096B2 (en) 2006-12-15 2011-09-27 Hand Held Products, Inc. Focus module and components with actuator polymer control
TWM317589U (en) 2007-01-09 2007-08-21 Lite On Technology Corp Image capturing device
US7755841B2 (en) 2007-01-30 2010-07-13 Dmetrix, Inc. Liquid-lens variable-control optics in array microscope
US20080277480A1 (en) 2007-05-10 2008-11-13 Serge Thuries Temperature compensated auto focus control for a microfluidic lens, such as auto focus control for a microfluidic lens of a bar code scanner
DE602007013722D1 (en) * 2007-05-14 2011-05-19 Varioptic Sa Housing for variable lens
KR100856092B1 (en) * 2007-06-18 2008-09-02 삼성전기주식회사 Optical lens and camera module combined it
JP4413956B2 (en) * 2007-08-21 2010-02-10 新光電気工業株式会社 Camera module and portable terminal
EP2071367A1 (en) 2007-12-13 2009-06-17 Varioptic Image stabilization circuitry for liquid lens
EP2085796A1 (en) 2008-01-29 2009-08-05 Varioptic Optical lens arrangement for fixed lenses and a liquid lens
JP5091716B2 (en) 2008-02-21 2012-12-05 株式会社ミツトヨ Telecentric lens optical system and image measuring device
CN101546936A (en) * 2008-03-25 2009-09-30 鸿富锦精密工业（深圳）有限公司 Voice coil motor and imaging device with same
US20090302116A1 (en) 2008-06-04 2009-12-10 Symbol Technologies, Inc. Semi-zoom imaging optical system
JP2011523722A (en) 2008-06-06 2011-08-18 レンズヴェクター インコーポレイテッド Connection structure of tunable liquid crystal optical device
KR101689817B1 (en) 2008-06-21 2017-01-09 렌즈벡터 인코퍼레이티드 Electro-optical devices using dynamic reconfiguration of effective electrode structures
CN101620303B (en) * 2008-06-30 2011-06-08 鸿富锦精密工业（深圳）有限公司 Camera module
WO2010022503A1 (en) 2008-09-01 2010-03-04 Lensvector Inc. Wafer-level fabrication of liquid crystal optoelectronic devices
CN102272653B (en) * 2008-12-30 2015-06-17 得利捷扫描集团有限公司 Liquid lens image capture device
MX2011007487A (en) 2009-01-15 2011-10-06 E Vision Llc Electro-active focus and zoom systems.
US8282004B2 (en) 2009-04-29 2012-10-09 Hand Held Products, Inc. Focusing apparatus and terminal comprising variable focus lens assembly
WO2010129454A1 (en) * 2009-05-03 2010-11-11 Lensvector, Inc. Optical lens having fixed lenses and embedded active optics
US8248523B2 (en) * 2009-11-05 2012-08-21 Flextronics Ap, Llc Camera module with fold over flexible circuit and cavity substrate
KR20110064156A (en) * 2009-12-07 2011-06-15 삼성전자주식회사 Imaging device and its manufacturing method
US20110221950A1 (en) * 2010-03-12 2011-09-15 Doeke Jolt Oostra Camera device, wafer scale package
CN102238319A (en) * 2010-04-26 2011-11-09 鸿富锦精密工业（深圳）有限公司 Image pickup device
TWI417013B (en) * 2010-05-14 2013-11-21 Kuang Hong Prec Co Ltd Stereo circuit device and manufacturing method thereof
US8970781B2 (en) * 2010-05-20 2015-03-03 Lg Innotek Co., Ltd. Camera module having MEMS actuator, connecting method for shutter coil of camera module and camera module manufactured by the same method
TWI484243B (en) * 2010-06-10 2015-05-11 Hon Hai Prec Ind Co Ltd Lens module and camera device
US20120026451A1 (en) * 2010-07-29 2012-02-02 Lensvector Inc. Tunable liquid crystal lens with single sided contacts
US8559806B2 (en) * 2010-12-29 2013-10-15 Samsung Electro-Mechanics Co., Ltd. Camera module and method for manufacturing the same
KR101237627B1 (en) * 2011-03-17 2013-02-27 삼성전기주식회사 Camera module
KR101944280B1 (en) * 2011-05-18 2019-01-31 엘지이노텍 주식회사 Camera Module
US8896743B2 (en) * 2011-06-08 2014-11-25 Omnivision Technologies, Inc. Enclosure for image capture systems with focusing capabilities
KR101917221B1 (en) * 2012-06-29 2018-11-13 엘지이노텍 주식회사 Camera module
KR102047373B1 (en) * 2012-07-30 2019-11-21 엘지이노텍 주식회사 Camera Module
KR102059169B1 (en) * 2012-07-30 2019-12-24 엘지이노텍 주식회사 Camera Module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080251707A1 (en) * 2001-10-23 2008-10-16 Tessera North America Optical chassis, camera having an optical chassis, and associated methods
US20060020387A1 (en) * 2004-07-20 2006-01-26 Koji Nagata Navigation apparatus, position information registration method and program thereof
US20060103758A1 (en) * 2004-11-12 2006-05-18 Samsung Techwin Co., Ltd. Camera module and method of manufacturing the same
US20070229754A1 (en) * 2006-03-03 2007-10-04 Universite Laval Method and apparatus for spatially modulated electric field generation and electro-optical tuning using liquid crystals
US20090134483A1 (en) * 2007-11-23 2009-05-28 Jui-Ping Weng Electronic assembly for image sensor device

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Publication number Publication date
WO2011008443A2 (en) 2011-01-20
US20120140101A1 (en) 2012-06-07
US8891006B2 (en) 2014-11-18

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