WO2007012402A1 - Ensemble vanne et dispositif de refroidissement - Google Patents

Ensemble vanne et dispositif de refroidissement Download PDF

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Publication number
WO2007012402A1
WO2007012402A1 PCT/EP2006/006805 EP2006006805W WO2007012402A1 WO 2007012402 A1 WO2007012402 A1 WO 2007012402A1 EP 2006006805 W EP2006006805 W EP 2006006805W WO 2007012402 A1 WO2007012402 A1 WO 2007012402A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
valve arrangement
valve
arrangement according
electronics housing
Prior art date
Application number
PCT/EP2006/006805
Other languages
German (de)
English (en)
Inventor
Albert KÖCKEMANN
Gerold Liebler
Joachim Neumann
Original Assignee
Bosch Rexroth Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Rexroth Ag filed Critical Bosch Rexroth Ag
Publication of WO2007012402A1 publication Critical patent/WO2007012402A1/fr

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K49/00Means in or on valves for heating or cooling

Definitions

  • the invention relates to a valve assembly according to the preamble of patent claim 1 and a Kuhlvoriques according to the preamble of claim 18th
  • Such a valve arrangement is known for example from DE 195 30 935 C2.
  • the actuation of a control piston takes place via one or two actuation magnets, which are actuated via control electronics as a function of control signals of a control unit.
  • the control electronics and an inductive position transducer for detecting the position of the control piston are integrated with such valves in an electronics housing made of plastic (on-board electronics), which rests on two mutually perpendicular abutment surfaces on the valve housing and is fixed thereto.
  • a bestuckte with electronic components of the control circuit board is arranged, which is attached to improve the heat dissipation to a base of a good heat-conducting material existing cover of the Elektronikgehauses.
  • Further electronic power components of the control electronics such as power transistors, are mounted directly on the base of the end cover for improved heat dissipation.
  • the end cover is equipped in sections with cooling ribs, which improve the cooling effect of the end cover by passive thermal convection with the ambient air.
  • a disadvantage of such valve arrangements is that the heat dissipation via the end cover, in particular at high ambient temperatures, for example in warm countries or in the warm area of working machines, as well as a reduced cooling air supply, for example, due to noise protection housings is insufficient to cool the electronic components of the control electronics sufficient and it due to the high operating temperatures to a faulty work and a shortened life of the electronic components to failure of the Control electronics can come.
  • the present invention seeks to provide an electro-hydraulic valve assembly, in which an improved cooling of the electronic components is possible.
  • valve arrangement with the feature combination of claim 1 and by a cooling device for such valve arrangements with the features of claim 18.
  • the electrohydraulic valve arrangement has a valve housing and at least one electronics housing for accommodating electronic components for controlling the valve (on-board electronics).
  • an active i. provided by a coolant flowing through or thermoelectrically acting cooling element for cooling the electronic components, which is in thermal contact with the electronics housing.
  • Inventive ⁇ according to the cooling device flowed through by a coolant or thermoelectrically actingdeele ⁇ has ment, which is in thermal contact with the Elektronikge- home stands.
  • the cooling device can be attached as a retrofit kit to existing valves.
  • the cooling element has at least one thermoelectric Peltier element.
  • This consists for example of two thin ceramic plates between which alternately p- and n-doped semiconductor materials are arranged in a series circuit. By applying a DC voltage, one of the ceramic plates is cooled and the other heated by means of the series connection of two materials with different levels in the thermoelectric voltage series, so that a temperature gradient arises between the ceramic plates (Peltier effect).
  • thermoelectric Peltier elements reach high temperature differences (up to 70 0 C) with good efficiencies and are silent and maintenance-free due to the lack of moving components during operation.
  • the cooling element is a fluid-cooled cooling plate. Due to the thermal convection of the fluid, for example, water, oil or air, a large amount of heat is dissipated from the electronics housing via the cooling plate depending on the type of coolant and its flow rate and thus cooled the control electronics defined.
  • the cooling plate preferably has at least one cooling channel, which can be connected via coolant connections to a cooling circuit and can be supplied via this with the coolant, for example water.
  • the cooling plate has two substantially parallel bores, which are interconnected via an approximately perpendicular to this transverse bore and form an approximately U-shaped cooling channel in the cooling plate, which is supplied via two coolant connections with coolant ,
  • the cooling channel formed by the bores is easy to manufacture compared to a cooling channel produced by casting.
  • two inclined, mutually connected, interconnected bores are introduced into the cooling plate, which form an approximately V-shaped cooling channel in the cooling plate.
  • only two holes are required, so that the production of the cooling channel is further simplified.
  • the cooling element via a contact surface at least in sections with a side surface of the electronics housing directly or via a heat guide medium, in particular a thermal compound brought into abutment.
  • a heat guide medium in particular a thermal compound brought into abutment.
  • the cooling element is connected via at least one retaining element to the electronics housing and / or the valve housing.
  • the holding element is a holding plate which overlaps the electronics housing and the cooling element.
  • the retaining plate is preferably on the one hand via at least one fastening element, in particular a screw, connected to a cover of the electronics housing and on the other hand with an end face of theméele ⁇ management and carries this.
  • the holding plate has, in an advantageous embodiment of the invention, a bore system with mutually offset holes for the variable positioning of the cooling element on the electronics housing. ⁇ on the staggered mounting holes reason, the cooling element is mounted on both sides of the electronics housing and are thereby adapted to the particular installation conditions of the valve.
  • the cooling element is connected according to a preferred embodiment of an additional, designed as a retaining tab retaining element with the valve housing.
  • the retaining tab preferably has at opposite end portions two holes arranged substantially perpendicular to each other for receiving fastening elements, in particular screws. This allows the retaining tab at a first end portion with the Ventilge ⁇ housing and at a second end portion with thedeele- ment to be connected, so that the mounting of the cooling element to the electronics housing, and thereby the heat transfer ⁇ are further improved between the electronics housing and the cooling element.
  • the retaining plate is at least partially adapted to the contour of the end cover and / or the retaining tab at least partially adapted to the contour of the electronics housing.
  • the retaining plate which is adapted to the contour of the end cover, enlarges the heat exchange surface and thereby increases the heat conduction via the end cap to the cooling element, so that the cooling effect is further improved.
  • the bore pattern of the holding elements is adapted in accordance with an advantageous embodiment of the invention to the existing hole pattern of the valve housing and / or the end cover.
  • the fastening elements of the holding plate and / or the retaining tab engage in existing threaded bores of the end cover and the valve housing, so that the cooling device according to the invention can be fastened to conventional valves with minimal production outlay.
  • the cooling element is arranged at least in sections within the electronics housing.
  • the cooling element and / or the retaining plate from a material with high thermal conductivity, for example aluminum. This will increase the thermal efficiency of the Increased cooling element and improves the heat dissipation of the electronic ⁇ nikgephaseuse.
  • the invention is in principle applicable to a variety of electro-hydraulic valve assemblies with integrated electronic components for controlling the valve (on-board electronics), for example in control valves with control electronics or pilot valves of control pumps with integrated electronics.
  • the main application of the valve assembly is likely to be in direct-controlled control valves with integrated control electronics.
  • Figure 1 is a three-dimensional view of a preferred embodiment of a valve assembly according to the invention with a cooling element
  • Figure 2 is a plan view of the valve assembly of Figure 1;
  • Figure 3 is a side view of the valve assembly of Figure 1;
  • Figure 4 is a detail view of the retaining tab of Figure 3;
  • FIG. 5 is another view of the valve assembly of Figure 1 and FIG. 6 is a sectional view of the cooling plate of FIG. 1.
  • FIG. 1 shows a three-dimensional representation of a directly controlled 4/3-way directional control valve arrangement 1, which essentially consists of a 4/3-way directional control valve 2, an integrated in an electronics housing 4 of electrically insulating or conductive plastic or metal control electronics for controlling the Directional valve 2 and also arranged in the electronics housing 4 inductive displacement sensor (not shown).
  • an electrical actuating magnet 12 is arranged on an end face 8 of a substantially rectangular valve housing 6 of the directional control valve 2, for direct actuation of the control piston, via which the control piston is moved in response to the electrical control signals of the control electronics in its working positions.
  • an electrical line connection coupling 18 and a connection cable 20 are provided on a narrow side 16 of the electronics housing 4.
  • the electronics housing 4 is fastened via fastening elements, not shown, on the actuating magnet 12 and the end face closed by a cover 22 made of aluminum, which is bolted to the electronics housing 4 via mounting screws 24.
  • electronic components of the control electronics are arranged on a thermally conductively connected to the end cover 22 circuit board (not shown).
  • Other electronic power components, such as power transistors, are used for good heat dissipation directly on a non-illustrated attached end cap 22 sockets.
  • the end cover 22 is provided in sections with cooling fins 26 to increase the heat exchange surface, wherein the heat is dissipated by convection.
  • a cooling element 28 through which a coolant flows is provided for cooling the electronic components, which is in thermal contact with the electronics housing 4 of the valve arrangement 1.
  • the cooling element 28 is a fluid-cooled cooling plate 30 having a substantially rectangular cross-section, which is brought into abutment via a contact surface 32 with a side surface 34 of the electronics housing 4.
  • the cooling plate 30, described in more detail below with reference to FIG. 6, has a cooling channel 36, which can be connected to a cooling circuit via two coolant connections 38, 40 and can be supplied with coolant via it.
  • water is used as the coolant.
  • the heat is dissipated via the cooling medium via the cooling plate 30, whereby the heat transfer surface is relatively large due to contact of the cooling plate 30 with the electronics housing 4, so that the electronic components be sufficiently cooled.
  • thermoelectrically acting Peltier cooling element is provided for cooling the electronic components, which is in thermal contact with the electronics housing 4.
  • the cooling plate 30 is screwed via a retaining element 42 with the end cover 22 of the electronics housing 4.
  • the holding member 42 as a electronics housing 4 and the cooling plate 30 cross-holding plate 44 is formed with a substantially rectangular cross section, on the one hand via a screw 46 with the end cover 22 of the electronics housing 4 and on the other hand via two mounting screws 48, 50 with a Side surface 52 of the cooling plate 30 is screwed and thereby fixes the cooling plate 30 to the electronics housing 4.
  • the cooling plate 30 For fastening the cooling plate 30 to the holding plate 44 six threaded holes 54 are in the side surface 52 of the cooling plate 30 is introduced (in Figure 1, four of the threaded holes 54 are covered by the holding plate 44), of each of which two are brought into engagement with the two fastening screws 48, 50 of the retaining plate 44.
  • the cooling plate 30 can be mounted on both sides of the valve assembly 1 and the axial positioning of the cooling plate 30 relative to the electronics housing 4 can be varied.
  • a threaded hole (tank thread) already present for a screw plug of a potentiometer used for zero point adjustment of the displacement transducer is used to fasten the retaining plate 44 on the end cover 22 as a fastening bore.
  • the cooling plate and the retaining plate are formed of aluminum.
  • the support plate 44 has a bore system 56 with mutually offset through holes 58, 60 (the through hole 60 is hidden by the screw 46) for variable positioning of the cooling plate 30 on the electronics housing 4. Due to the staggered through holes 58, 60, the cooling plate 30 on both sides of the electronics housing 4, ie on the side surface 34 and a side surface 62 of the electronics housing 4 depending on the particular installation conditions of the valve assembly 1 to the existing holes the end cover are mounted.
  • the retaining plate 44 is adapted to the contour of the end cover 22 of the electronics housing 4 via a groove 64 (see FIG. 1), in each of which a projection 66, 68 of the end cover 22 engages.
  • the heat dissipation of the electronic components on the end cover 22 and the support plate 44 to the cooling plate 30 is further improved.
  • the hole pattern 56 of the holding plate 44 is on adjusted the existing hole pattern of the electronics housing 4, so that the screw 46 engages for fastening the retaining plate 44 in an existing threaded bore of the end cover 22.
  • the cooling plate 30 can be attached to the conventional directional control valve 2 with minimal manufacturing outlay.
  • FIG. 3 which shows a side view of the valve arrangement 1 from FIG. 1, the cooling plate 30 is connected to the actuating magnet 12 in addition to the holding plate 44 via a retaining element 74 designed as a retaining tab 72.
  • the retaining tab 72 as shown in particular Figure 4, at opposite end portions 76, 78 two mutually perpendicular through holes 80, 82 for receiving fastening screws 83, 84.
  • the retaining tab 72 is in the region of the valve-side mounting hole 82 via • a radius R adapted to the contour of the electronics housing 4.
  • the retaining tab 72 can be connected at the end portion 78 to the electronics housing 4 and at the end portion 76 with a side surface 86 of the cooling plate 30 so that the attachment of the cooling plate 30 and thereby the heat transfer between the electronics housing 4 and the cooling plate 30 are further improved.
  • the hole pattern of the retaining tab 72 is adapted to the hole pattern of the actuating magnet 12, so that the fastening screw 83 of the retaining tab 72 engages through the actuating magnet 12 into the already existing threaded bore of the valve housing 6.
  • the cooling plate 30 can be attached to the conventional directional control valve 2 with minimal production outlay.
  • FIG. 6 which shows a sectional illustration of the cooling plate 30 from FIG. 1, two parallel blind bores 90, 92 are introduced into an end face 88 of the cooling plate 30, which are connected to one another via a transverse bore 94 which runs perpendicular to the latter and is also formed as a blind bore form approximately U-shaped cooling channel 36 in the cooling plate 30, which can be supplied with coolant via the two coolant connections 38, 40 serving as coolant inlet or coolant outlet.
  • the transverse bore 94 is closed by a closure screw 96 (see FIG. 5).
  • the formation of the cooling channel 36 from the blind holes 90, 92, 94 allows a simple component design, so that the cooling plate 30 manufacturing technology is easy to manufacture.
  • valve assembly 1 is not limited to the embodiment described above.
  • any known from the prior art coolant in particular oil for cooling use, which ensures sufficient heat dissipation.
  • the electronic components of the valve arrangement 1 are actively cooled by means of a cooling element through which a coolant flows or thermoelectrically acting cooling element 28, which is in thermal contact with the electronics housing 4.
  • an electro-hydraulic valve assembly 1 with a valve housing 6 and at least one electronics housing 4 for receiving electronic components for controlling the valve 2 (on-board electronics) and a cooling device for such a valve arrangement.
  • the valve arrangement 1 has a cooling element through which a coolant flows or thermoelectrically acting cooling element 28, which is in thermal contact with the electronics housing 4.

Abstract

L'invention concerne un ensemble vanne électrohydraulique (1), présentant un corps de vanne (6) et au moins un boîtier (4) destiné à loger des composants électroniques servant à commander la vanne (électronique embarquée), ainsi qu'un dispositif de refroidissement pour un ensemble vanne de ce type. Selon la présente invention, cet ensemble vanne présente un élément de refroidissement (28) à effet thermoélectrique ou traversé par un fluide de refroidissement, lequel élément est en contact thermique avec le boîtier de composants électroniques.
PCT/EP2006/006805 2005-07-26 2006-07-12 Ensemble vanne et dispositif de refroidissement WO2007012402A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102005035491 2005-07-26
DE102005035491.2 2005-07-26
DE102005042784A DE102005042784A1 (de) 2005-07-26 2005-09-08 Ventilanordnung und Kühlvorrichtung
DE102005042784.7 2005-09-08

Publications (1)

Publication Number Publication Date
WO2007012402A1 true WO2007012402A1 (fr) 2007-02-01

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ID=37025997

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/006805 WO2007012402A1 (fr) 2005-07-26 2006-07-12 Ensemble vanne et dispositif de refroidissement

Country Status (2)

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DE (1) DE102005042784A1 (fr)
WO (1) WO2007012402A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010059239A2 (fr) 2008-11-21 2010-05-27 Millennium Pharmaceuticals, Inc Sel de lactate du (4-isopropoxyphényl)-amide de l’acide 4-(6-méthoxy-7-(3-pipéridin-1-yl-propoxy)quinazolin-4-yl]pipérazine-1-carboxylique et les compositions pharmaceutiques l’incluant dans le traitement du cancer et d'autres pathologies ou troubles
US9062797B2 (en) 2010-09-20 2015-06-23 Norgren Gmbh High temperature butterfly valve
WO2018060419A1 (fr) * 2016-09-29 2018-04-05 Krones Ag Dispositif permettant d'agir sur le flux volumique d'un produit de remplissage dans une installation de mise en bouteille
US20210040613A1 (en) * 2019-08-09 2021-02-11 Asm Ip Holding B.V. Heater assembly including cooling apparatus and method of using same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011052707A1 (de) 2011-08-15 2013-02-21 Pierburg Gmbh Kühlvorrichtung für ein thermisch belastetes Bauteil
US9945292B2 (en) * 2015-03-10 2018-04-17 Hamilton Sundstrand Corporation Thermoelectric cooled torque motor
WO2023169816A1 (fr) 2022-03-08 2023-09-14 Sew-Eurodrive Gmbh & Co. Kg Moteur électrique comprenant un élément de refroidissement

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3026802A1 (de) * 1979-07-18 1981-01-22 Hitachi Ltd Elektronisch gesteuerte kraftstoffzufuehrvorrichtung fuer brennkraftmaschine
JPS60147544A (ja) * 1984-01-10 1985-08-03 Diesel Kiki Co Ltd 分配型燃料噴射ポンプ
EP0277490A1 (fr) * 1987-02-03 1988-08-10 Robert Bosch Gmbh Pompe d'injection de carburant
DE19530935A1 (de) 1995-08-23 1997-02-27 Rexroth Mannesmann Gmbh Elektrischer Betätigungsmagnet
DE19629589A1 (de) * 1996-07-23 1998-01-29 Bosch Gmbh Robert Brennstoffeinspritzventil
WO2001062059A1 (fr) * 2000-02-15 2001-08-23 Tasowheel Oy Agencement conçu pour un actionneur
AT411116B (de) * 1999-10-05 2003-09-25 Siemens Ag Oesterreich Kühldose zur flüssigkeitskühlung von elektrischen bauelementen
DE10338469A1 (de) * 2003-08-21 2004-11-25 Siemens Ag Stromrichtermodul mit einer rückwärtigen Kühlplatte
WO2005125296A1 (fr) * 2004-06-15 2005-12-29 Tm4 Inc. Dispositif de refroidissement pour circuit électrique

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3026802A1 (de) * 1979-07-18 1981-01-22 Hitachi Ltd Elektronisch gesteuerte kraftstoffzufuehrvorrichtung fuer brennkraftmaschine
JPS60147544A (ja) * 1984-01-10 1985-08-03 Diesel Kiki Co Ltd 分配型燃料噴射ポンプ
EP0277490A1 (fr) * 1987-02-03 1988-08-10 Robert Bosch Gmbh Pompe d'injection de carburant
DE19530935A1 (de) 1995-08-23 1997-02-27 Rexroth Mannesmann Gmbh Elektrischer Betätigungsmagnet
DE19629589A1 (de) * 1996-07-23 1998-01-29 Bosch Gmbh Robert Brennstoffeinspritzventil
AT411116B (de) * 1999-10-05 2003-09-25 Siemens Ag Oesterreich Kühldose zur flüssigkeitskühlung von elektrischen bauelementen
WO2001062059A1 (fr) * 2000-02-15 2001-08-23 Tasowheel Oy Agencement conçu pour un actionneur
DE10338469A1 (de) * 2003-08-21 2004-11-25 Siemens Ag Stromrichtermodul mit einer rückwärtigen Kühlplatte
WO2005125296A1 (fr) * 2004-06-15 2005-12-29 Tm4 Inc. Dispositif de refroidissement pour circuit électrique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 009, no. 313 (M - 437) 10 December 1985 (1985-12-10) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010059239A2 (fr) 2008-11-21 2010-05-27 Millennium Pharmaceuticals, Inc Sel de lactate du (4-isopropoxyphényl)-amide de l’acide 4-(6-méthoxy-7-(3-pipéridin-1-yl-propoxy)quinazolin-4-yl]pipérazine-1-carboxylique et les compositions pharmaceutiques l’incluant dans le traitement du cancer et d'autres pathologies ou troubles
US9062797B2 (en) 2010-09-20 2015-06-23 Norgren Gmbh High temperature butterfly valve
WO2018060419A1 (fr) * 2016-09-29 2018-04-05 Krones Ag Dispositif permettant d'agir sur le flux volumique d'un produit de remplissage dans une installation de mise en bouteille
US11208311B2 (en) 2016-09-29 2021-12-28 Krones Ag Device for influencing the volume flow of a filling product in a filling system
US20210040613A1 (en) * 2019-08-09 2021-02-11 Asm Ip Holding B.V. Heater assembly including cooling apparatus and method of using same

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