DE19706790A1 - Integral mounted command mechanism for cars - Google Patents
Integral mounted command mechanism for carsInfo
- Publication number
- DE19706790A1 DE19706790A1 DE1997106790 DE19706790A DE19706790A1 DE 19706790 A1 DE19706790 A1 DE 19706790A1 DE 1997106790 DE1997106790 DE 1997106790 DE 19706790 A DE19706790 A DE 19706790A DE 19706790 A1 DE19706790 A1 DE 19706790A1
- Authority
- DE
- Germany
- Prior art keywords
- base plate
- control device
- connector
- carrier
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/043—Stacked PCBs with their backs attached to each other without electrical connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10553—Component over metal, i.e. metal plate in between bottom of component and surface of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Abstract
Description
Die Erfindung betrifft ein Steuergerät für den Einbau in ein Kraftfahrzeug gemäß dem Oberbegriff von Patentanspruch 1.The invention relates to a control unit for installation in a Motor vehicle according to the preamble of claim 1.
Ein solches Steuergerät ist aus der Patentschrift EP 0 588 793 B1 bekannt. Dabei ist der Stecker in einem zentralen Be reich der Metallplatte derart montiert, daß dessen Anschluß pins den Leiterbahnträger in zwei Bereiche teilen. Die zen trale Anordnung des Steckers erschwert das Layout und des Lei terbahnträgers und die Unterbringung dieses Geräts in einem Kraftfahrzeug. Insbesondere ist eine kompakte Unterbringung zusammen mit weiteren Geräten schwierig.Such a control device is known from patent specification EP 0 588 793 B1 known. The plug is in a central loading richly mounted the metal plate so that its connection pins divide the conductor carrier into two areas. The zen central arrangement of the plug complicates the layout and lei carrier and the accommodation of this device in one Motor vehicle. In particular, it is compact difficult with other devices.
Ziel der Erfindung ist es, ein Steuergerät bereitzustellen, das für den Einbau in ein Kraftfahrzeug unter den fahrzeug spezifischen Einsatzbedingungen und räumlichen Gegebenheiten besonders geeignet ist.The aim of the invention is to provide a control device that for installation in a motor vehicle under the vehicle specific operating conditions and spatial conditions is particularly suitable.
Dieses Ziel wird mit einem Steuergerät erreicht, wie es in Anspruch 1 definiert ist. Zweckmäßige Weiterbildungen der Er findung sind in den Unteransprüchen angegeben.This goal is achieved with a control unit as described in Claim 1 is defined. Appropriate further training of the Er invention are specified in the subclaims.
Wegen der Anordnung des Steckerverbinders an einem Rand des Leiterbahnträgers entsteht auf dem Leiterbahnträger ein gro ßes, zusammenhängendes Gebiet. Dadurch wird ein optimales Layout und eine besonders günstige Flächenausnutzung ermög licht. Because of the arrangement of the connector on one edge of the The conductor track carrier creates a large on the conductor track carrier large, coherent area. This makes an optimal one Layout and a particularly favorable use of space light.
Die gleichzeitige periphere Anordnung des Steckverbinders am Gehäuse des Steuergeräts bewirkt, daß bei Bedarf auf dem Ge häuse weitere Geräte angeordnet und insbesondere gestapelt werden können. Auch ist eine Befestigung in einem Einschub möglich. Alternativ kann der zusammenhängende, steckerfreie Abschnitt der Außenseite der wärmeleitenden Grundplatte gut von Kühlluft angeströmt werden oder an metallischen Fahrzeug teilen befestigt werden.The simultaneous peripheral arrangement of the connector on Housing of the control unit causes that if necessary on the Ge other devices arranged and especially stacked can be. There is also an attachment in a slot possible. Alternatively, the coherent, plug-free Section of the outside of the heat-conducting base plate well be blown by cooling air or on metallic vehicle parts to be attached.
Weitere Vorteile, Merkmale und Anwendungsmöglichkeiten erge ben sich aus der nachfolgenden Beschreibung der Ausführungs beispiele in Verbindung mit den Zeichnungen. Es zeigen:Other advantages, features and possible uses ben from the following description of the execution examples in connection with the drawings. Show it:
Fig. 1 eine perspektivische Ansicht eines Steuergerät; Fig. 1 is a perspective view of a control device;
Fig. 2 die Steckerseite des Steuergeräts; Figure 2 shows the connector side of the control unit.
Fig. 3 einen Verbund aus zwei Steuergeräten; Fig. 3 is a composite of two control devices;
Fig. 4 eine Schnittansicht eines Steuergeräts mit zwei Leiterbahnträgern; und Fig. 4 is a sectional view of a control device with two conductor track carriers; and
Fig. 5 eine Schnittansicht eines Steuergeräts, das nicht SMD-fähige Bauelemente mit Anschlußdrähten auf weist. Fig. 5 is a sectional view of a control device which has non-SMD-compatible components with connecting wires.
Fig. 1 zeigt ein Steuergerät in Flachbauweise. Ein Leiter bahnträger, z. B. eine starre Leiterplatte 10, ist auf einer metallischen Grundplatte 20 angebracht und weist einen Rand bereich 11 und ein mit SMD-Bauelementen 12 bestücktes, gro ßes, zusammenhängendes Gebiet auf. Ein Gehäuseteil 13 ist als metallischer Gehäusedeckel zum Schutz der Leiterplatte ausge bildet. Der Gehäusedeckel weist am Rand eine umlaufende Kon tur 14 auf, die eine Gehäusedichtung 15 aufnehmen kann, wenn eine hermetische Abdichtung des Gehäuses gewünscht ist. Fig. 1 shows a control unit in a flat design. A conductor web carrier, e.g. B. a rigid circuit board 10 is mounted on a metallic base plate 20 and has an edge area 11 and a SMD components 12 equipped with large, coherent area. A housing part 13 is formed out as a metallic housing cover to protect the circuit board. The housing cover has on the edge a circumferential con ture 14 which can accommodate a housing seal 15 if a hermetic seal of the housing is desired.
Die der Leiterplatte abgewandte Seite der Grundplatte 20 bil det eine Gehäuseaußenseite des Steuergeräts. An dieser ist ein Steckverbinder 22 im Randbereich der Grundplatte und gleichzeitig im Randbereich der Leiterplatte angebracht. Durch diese Gehäuseaußenseite oder Steckerseite 23 sind An schlußpins 24 in den Randbereich 11 der Leiterplatte geführt, der im wesentlichen über eine ganze Seite der Leiterplatte verläuft. Obgleich am Leiterplattenrand keine elektronischen Bauelemente angeordnet sind, können dort einige passive Bau elemente insbesondere als RF-Abschirmmaßnahme angeordnet sein.The side of the base plate 20 facing away from the printed circuit board is an outer side of the housing of the control unit. A connector 22 is attached to this in the edge region of the base plate and at the same time in the edge region of the printed circuit board. Through this outer side of the housing or plug side 23 are connected to pins 24 in the edge region 11 of the circuit board, which extends essentially over an entire side of the circuit board. Although no electronic components are arranged at the edge of the circuit board, some passive construction elements can be arranged there in particular as an RF shielding measure.
Fig. 2 veranschaulicht die periphere Anordnung des Steckver binders 22 auf der Steckerseite 23 der Grundplatte 20. Da durch wird eine große zusammenhängende Fläche, die gut von Kühlluft angeströmt werden kann oder als Auflagefläche dienen kann geschaffen. Fig. 2 illustrates the peripheral arrangement of the fastex binder 22 on the connector side 23 of the base plate 20th Since a large coherent surface is created, which can be flowed well by cooling air or can serve as a support surface.
In Fig. 3 ist auf der Steckerseite der Grundplatte 20 eines Steuergeräts ein weiteres, kleineres Gerät angebracht. Das kleinere Gerät füllt den Platz neben dem Steckverbinder 22 des größeren Geräts vollständig aus. Die Stecker 22 der bei den Geräte weisen in dieselbe Richtung. An beiden Geräten sind die metallischen Deckel an den jeweiligen Grundplatten 20 mittels der aus dem Gebrauchsmuster DE 295 14 573 U be kannten Bördeltechnik befestigt. Wegen der metallischen Natur des Gehäusedeckels des kleineren Geräts kann die Grundplatte 20 des größeren Steuergeräts ausreichend Wärme abführen, ob wohl die Grundplatte von dem Gehäusedeckel des kleineren Ge räts fast vollständig bedeckt wird.In Fig. 3, another, smaller device is attached to the connector side of the base plate 20 of a control device. The smaller device completely fills the space next to the connector 22 of the larger device. The plugs 22 of the devices point in the same direction. On both devices, the metallic covers are attached to the respective base plates 20 by means of the flanging technique known from the utility model DE 295 14 573 U. Because of the metallic nature of the housing cover of the smaller device, the base plate 20 of the larger control unit can dissipate sufficient heat, although the base plate is almost completely covered by the housing cover of the smaller device.
Derart aufeinander gestapelte Geräte können mittels Abstand halter, bügelartiger Federn oder, wie in Fig. 3 dargestellt, mittels an den Deckeln angeformten Halteorganen 16 verbunden bzw. zusammengeklemmt werden.Devices stacked on top of one another in this way can be connected or clamped together by means of spacers, bow-like springs or, as shown in FIG. 3, by means of holding members 16 molded onto the covers.
In Fig. 4 ist ein Steuergerät dargestellt, bei dem auf der Steckerseite 23 der Grundplatte 20 ein zusätzlicher, als Lei terplatte ausgebildeter Leiterbahnträger 30 angebracht ist. Dieser ist ebenso wie eine Ausnehmung 21 der Grundplatte 20 von einer Leiterplattenabdeckung 31 nach außen abgeschirmt. Zwischen den Leiterplatten 10 und 30 ist eine elektrische Verbindung 32 mittels Kabel ausgeführt. Hierfür lassen sich auch vorteilhaft Jumper, Steckverbinder oder Lötstifte ein setzen.In Fig. 4, a control device is shown, in which on the connector side 23 of the base plate 20 an additional, as Lei terplatte designed conductor track carrier 30 is attached. Like a recess 21 in the base plate 20, this is shielded from the outside by a printed circuit board cover 31 . An electrical connection 32 is made between the circuit boards 10 and 30 by means of cables. For this purpose, jumpers, connectors or soldering pins can also be used advantageously.
Die auf der Steckerseite 23 angebrachte zusätzliche Leiter platte 30 nutzt die große, zusammenhängende Fläche, die durch die periphere Anbringung des Steckverbinders 22 geschaffen wurde, vorteilhaft aus.The attached on the connector side 23 additional circuit board 30 takes advantage of the large, contiguous area created by the peripheral attachment of the connector 22 .
Fig. 5 veranschaulicht eine fertigungstechnisch günstige Lö sung zur Unterbringung von nicht SMD-fähigen Sonderbauelemen ten 33. Für diese ist in der Grundplatte 20 eine als Öffnung (Loch) ausgebildete Ausnehmung 21 vorgesehen. Eine Ausnehmung läßt sich auch mit einer L-förmigen Grundplatte auf einfache Weise verwirklichen. Die Ausnehmung ist mit einer Bauelemen tenabdeckung 34 vor schädlichen Umwelteinwirkungen geschützt. Da die Anschlußdrähte aufweisenden, nicht SMD-fähigen Bauele mente durch die Ausnehmung 21 der Grundplatte bestückt wer den, muß die Leiterplatte lediglich von einer Seite gelötet werden. Dies kann in einem Arbeitsgang erfolgen. Fig. 5 illustrates a production-technically advantageous solution Lö to accommodate not SMD-compatible Sonderbauelemen th 33rd A recess 21 designed as an opening (hole) is provided for this in the base plate 20 . A recess can also be easily realized with an L-shaped base plate. The recess is protected with a component cover 34 from harmful environmental influences. Since the connecting wires having non-SMD-compatible components are fitted through the recess 21 of the base plate, the circuit board only has to be soldered from one side. This can be done in one operation.
Statt der Abdeckung der Sonderbauelemente und der Ausnehmung 21 mit einem Deckel, kann, ebenso wie bei der zusätzlichen Leiterplatte 30 und der Ausnehmung 21 von Fig. 4, ein Verguß für eine Abdichtung sorgen. Ein geeignetes Material hierfür ist beispielsweise Polyurethan-Material. Ein Vergießen hat den Vorteil, daß die nicht SMD-fähigen Bauelemente 33 gegen schädigende Schwingungen besonders gut geschützt sind. Die gleiche Funktion kann aber auch ein Gummi- oder Dämpfungsele ment zwischen der Leiterplattenabdeckung 31 und den darunter liegenden Bauelementen erfüllen.Instead of covering the special components and the recess 21 with a cover, as with the additional printed circuit board 30 and the recess 21 from FIG. 4, a potting can provide a seal. A suitable material for this is, for example, polyurethane material. Potting has the advantage that the non-SMD-capable components 33 are particularly well protected against damaging vibrations. The same function can also perform a rubber or damping element between the circuit board cover 31 and the components below.
Claims (7)
- - ein Gehäuse mit einer wärmeleitenden Grundplatte (20) und einem weiteren Gehäuseteil (13),
- - einen auf der wärmeleitenden Grundplatte (20) angeordneten Leiterbahnträger (10), der von dem Gehäuseteil (13) abgedeckt wird,
- - einen Steckverbinder (22), dessen Anschlußpins (24) in den Leiterbahnträger geführt sind, dadurch gekennzeichnet, daß
- - der Steckverbinder (22) an einem Randbereich der Grundplat te (20) angeordnet ist, und
- - die Anschlußpins (24) des Steckverbinders derart einen im wesentlichen von elektronischen Bauelementen freien Randab schnitt (11) des Leiterbahnträgers einnehmen, daß ein mit elektronischen Bauelementen (12) bestückbarer, zusammenhän gender Hauptabschnitt entsteht.
- - a housing with a heat-conducting base plate ( 20 ) and a further housing part ( 13 ),
- a conductor track carrier ( 10 ) which is arranged on the heat-conducting base plate ( 20 ) and is covered by the housing part ( 13 ),
- - A connector ( 22 ), the connecting pins ( 24 ) are guided in the conductor carrier, characterized in that
- - The connector ( 22 ) at an edge region of the Grundplat te ( 20 ) is arranged, and
- - The connector pins ( 24 ) of the connector such a substantially free from electronic components Randab section ( 11 ) of the conductor carrier that a populated with electronic components ( 12 ), coherent gender main section arises.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997106790 DE19706790C2 (en) | 1997-02-20 | 1997-02-20 | Control unit for installation in a motor vehicle |
FR9801767A FR2759843B1 (en) | 1997-02-20 | 1998-02-13 | CONTROL DEVICE FOR MOUNTING IN A MOTOR VEHICLE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1997106790 DE19706790C2 (en) | 1997-02-20 | 1997-02-20 | Control unit for installation in a motor vehicle |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19706790A1 true DE19706790A1 (en) | 1998-08-27 |
DE19706790C2 DE19706790C2 (en) | 2000-08-31 |
Family
ID=7820974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1997106790 Revoked DE19706790C2 (en) | 1997-02-20 | 1997-02-20 | Control unit for installation in a motor vehicle |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19706790C2 (en) |
FR (1) | FR2759843B1 (en) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999037128A1 (en) * | 1998-01-13 | 1999-07-22 | Sun Microsystems, Inc. | Sealed liquid-filled module and method of forming same |
DE19854641C1 (en) * | 1998-11-26 | 2000-03-16 | Siemens Ag | Control device with pluggable connector especially for motor vehicle |
EP1048451A2 (en) * | 1999-04-28 | 2000-11-02 | Wilhelm Fette GmbH | Distributor device for rotary tabletting press and method for manufacturing |
WO2001017069A1 (en) * | 1999-09-01 | 2001-03-08 | Siemens Aktiengesellschaft | Control device and soldering method |
DE19936398C2 (en) * | 1999-08-03 | 2001-10-11 | Siemens Ag | Device and method for checking the functionality of a circuit carrier for condensation water separations |
DE10017925A1 (en) * | 2000-04-11 | 2001-10-25 | Infineon Technologies Ag | Device for fixing a heat distribution cover on a printed circuit board |
WO2002057118A1 (en) * | 2001-01-22 | 2002-07-25 | Robert Bosch Gmbh | Electrical device, particularly a switching device or control device for motor vehicles |
DE10113474A1 (en) * | 2001-03-17 | 2002-10-02 | Siemens Ag | Electrical circuit |
DE10352705A1 (en) * | 2003-11-12 | 2005-06-23 | Diehl Bgt Defence Gmbh & Co. Kg | Circuit arrangement, especially for use in space, has element, especially vacuum-tight housing on base element and at least one heat-generating component connected to housing to dissipate heat losses |
DE102005039706A1 (en) * | 2005-08-23 | 2007-03-01 | Hella Kgaa Hueck & Co. | Printed circuit board structure for an electronic device like a choke/controller on a gas discharge lamp has electronic components attached to a heat sink and earthing contacts |
WO2008053048A2 (en) * | 2006-11-04 | 2008-05-08 | Zf Friedrichshafen Ag | Multi-part housing for a transmission controller and transmission controller having a housing of said type |
DE10205073B4 (en) * | 2001-02-08 | 2009-11-12 | DENSO CORPORATION, Kariya-shi | Housing for an electronic control unit |
US7671275B2 (en) | 2006-08-31 | 2010-03-02 | Yazaki Corporation | Electrical connection box |
US7969586B2 (en) | 2006-08-01 | 2011-06-28 | Trimble Jena Gmbh | Electronic leveling apparatus and method |
WO2018233899A1 (en) * | 2017-06-19 | 2018-12-27 | Robert Bosch Gmbh | Electronic module |
US10566596B2 (en) | 2016-09-02 | 2020-02-18 | Volkswagen Ag | Battery unit and wiring unit for a battery unit |
DE102020212811A1 (en) | 2020-10-09 | 2022-04-14 | Vitesco Technologies Germany Gmbh | Compact control module for a vehicle with at least one electric motor and a transmission |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004159478A (en) * | 2002-11-08 | 2004-06-03 | Sumitomo Wiring Syst Ltd | Junction box |
JP3748253B2 (en) * | 2002-11-14 | 2006-02-22 | 三菱電機株式会社 | In-vehicle electronic device housing structure |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3942392A1 (en) * | 1988-12-23 | 1990-06-28 | Mazda Motor | VEHICLE CONTROL UNIT ASSEMBLY |
DE3936906A1 (en) * | 1989-11-06 | 1991-05-08 | Telefunken Electronic Gmbh | Housing for electronic device in motor vehicle - has frame provided by inside surface fitted with two opposing carrier plates |
DE4123261C1 (en) * | 1991-07-13 | 1993-01-14 | Mercedes-Benz Aktiengesellschaft, 7000 Stuttgart, De | |
DE4225358A1 (en) * | 1992-07-31 | 1994-02-03 | Bosch Gmbh Robert | Add-on control unit |
EP0588793B1 (en) * | 1991-01-26 | 1995-04-12 | TEMIC TELEFUNKEN microelectronic GmbH | Housing for motor vehicle electronics |
DE29514573U1 (en) * | 1995-09-11 | 1995-11-09 | Siemens Ag | Control device, in particular for a motor vehicle |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4023319C1 (en) * | 1990-07-21 | 1991-12-12 | Robert Bosch Gmbh, 7000 Stuttgart, De | |
FR2686213B1 (en) * | 1992-01-14 | 1994-05-06 | Applications Gles Elect Meca | RECEIVER HOUSING FOR ELECTRONIC DISSIPATORS. |
DE9307080U1 (en) * | 1992-05-22 | 1993-07-15 | Siemens Ag, 8000 Muenchen, De | |
DE4240755A1 (en) * | 1992-12-03 | 1994-06-16 | Siemens Ag | Electronic control device for motor vehicle engine or ABS system - has cooling plate with PCBs fixed on both sides and with housing fixing section which extends out of housing |
-
1997
- 1997-02-20 DE DE1997106790 patent/DE19706790C2/en not_active Revoked
-
1998
- 1998-02-13 FR FR9801767A patent/FR2759843B1/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3942392A1 (en) * | 1988-12-23 | 1990-06-28 | Mazda Motor | VEHICLE CONTROL UNIT ASSEMBLY |
DE3936906A1 (en) * | 1989-11-06 | 1991-05-08 | Telefunken Electronic Gmbh | Housing for electronic device in motor vehicle - has frame provided by inside surface fitted with two opposing carrier plates |
EP0588793B1 (en) * | 1991-01-26 | 1995-04-12 | TEMIC TELEFUNKEN microelectronic GmbH | Housing for motor vehicle electronics |
DE4123261C1 (en) * | 1991-07-13 | 1993-01-14 | Mercedes-Benz Aktiengesellschaft, 7000 Stuttgart, De | |
DE4225358A1 (en) * | 1992-07-31 | 1994-02-03 | Bosch Gmbh Robert | Add-on control unit |
DE29514573U1 (en) * | 1995-09-11 | 1995-11-09 | Siemens Ag | Control device, in particular for a motor vehicle |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6222122B1 (en) | 1998-01-13 | 2001-04-24 | Sun Microsystems, Inc. | Sealed liquid-filled module and method of forming same |
WO1999037128A1 (en) * | 1998-01-13 | 1999-07-22 | Sun Microsystems, Inc. | Sealed liquid-filled module and method of forming same |
DE19854641C1 (en) * | 1998-11-26 | 2000-03-16 | Siemens Ag | Control device with pluggable connector especially for motor vehicle |
FR2786654A1 (en) * | 1998-11-26 | 2000-06-02 | Siemens Ag | CONTROL APPARATUS AND METHOD FOR SETTING UP A PLUG CONNECTOR IN A CONTROL APPARATUS |
EP1048451A2 (en) * | 1999-04-28 | 2000-11-02 | Wilhelm Fette GmbH | Distributor device for rotary tabletting press and method for manufacturing |
EP1048451A3 (en) * | 1999-04-28 | 2003-12-03 | Fette GmbH | Distributor device for rotary tabletting press and method for manufacturing |
DE19936398C2 (en) * | 1999-08-03 | 2001-10-11 | Siemens Ag | Device and method for checking the functionality of a circuit carrier for condensation water separations |
DE19941690A1 (en) * | 1999-09-01 | 2001-04-05 | Siemens Ag | Control unit and soldering process |
WO2001017069A1 (en) * | 1999-09-01 | 2001-03-08 | Siemens Aktiengesellschaft | Control device and soldering method |
DE19941690C2 (en) * | 1999-09-01 | 2001-12-06 | Siemens Ag | Control unit and soldering process |
US6572412B2 (en) | 1999-09-01 | 2003-06-03 | Siemens Aktiengesellschaft | Control device and soldering method |
DE10017925A1 (en) * | 2000-04-11 | 2001-10-25 | Infineon Technologies Ag | Device for fixing a heat distribution cover on a printed circuit board |
US6757171B2 (en) | 2000-04-11 | 2004-06-29 | Infineon Technologies Ag | Device for fixing a heat distribution covering on a printed circuit board with heat distribution covering |
WO2002057118A1 (en) * | 2001-01-22 | 2002-07-25 | Robert Bosch Gmbh | Electrical device, particularly a switching device or control device for motor vehicles |
DE10205073B4 (en) * | 2001-02-08 | 2009-11-12 | DENSO CORPORATION, Kariya-shi | Housing for an electronic control unit |
US6683525B2 (en) | 2001-03-17 | 2004-01-27 | Siemens Ag | Electrical strain sensitive resistor |
DE10113474A1 (en) * | 2001-03-17 | 2002-10-02 | Siemens Ag | Electrical circuit |
DE10113474B4 (en) * | 2001-03-17 | 2007-09-13 | Siemens Ag | Electrical circuit |
DE10352705A1 (en) * | 2003-11-12 | 2005-06-23 | Diehl Bgt Defence Gmbh & Co. Kg | Circuit arrangement, especially for use in space, has element, especially vacuum-tight housing on base element and at least one heat-generating component connected to housing to dissipate heat losses |
DE102005039706A1 (en) * | 2005-08-23 | 2007-03-01 | Hella Kgaa Hueck & Co. | Printed circuit board structure for an electronic device like a choke/controller on a gas discharge lamp has electronic components attached to a heat sink and earthing contacts |
US7969586B2 (en) | 2006-08-01 | 2011-06-28 | Trimble Jena Gmbh | Electronic leveling apparatus and method |
US7671275B2 (en) | 2006-08-31 | 2010-03-02 | Yazaki Corporation | Electrical connection box |
DE102007040828B4 (en) * | 2006-08-31 | 2010-04-22 | Yazaki Corp. | Power Distribution Box |
WO2008053048A3 (en) * | 2006-11-04 | 2008-06-26 | Zahnradfabrik Friedrichshafen | Multi-part housing for a transmission controller and transmission controller having a housing of said type |
DE102006052107A1 (en) * | 2006-11-04 | 2008-05-08 | Zf Friedrichshafen Ag | Multi-part housing for a transmission control and transmission control with such a housing |
WO2008053048A2 (en) * | 2006-11-04 | 2008-05-08 | Zf Friedrichshafen Ag | Multi-part housing for a transmission controller and transmission controller having a housing of said type |
US10566596B2 (en) | 2016-09-02 | 2020-02-18 | Volkswagen Ag | Battery unit and wiring unit for a battery unit |
WO2018233899A1 (en) * | 2017-06-19 | 2018-12-27 | Robert Bosch Gmbh | Electronic module |
DE102020212811A1 (en) | 2020-10-09 | 2022-04-14 | Vitesco Technologies Germany Gmbh | Compact control module for a vehicle with at least one electric motor and a transmission |
DE102020212811B4 (en) | 2020-10-09 | 2022-10-13 | Vitesco Technologies Germany Gmbh | Compact control module for a vehicle with at least one electric motor and a transmission |
Also Published As
Publication number | Publication date |
---|---|
FR2759843B1 (en) | 2005-08-19 |
DE19706790C2 (en) | 2000-08-31 |
FR2759843A1 (en) | 1998-08-21 |
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