CN104795475A - Method for processing complex surface shape lens during LED package - Google Patents
Method for processing complex surface shape lens during LED package Download PDFInfo
- Publication number
- CN104795475A CN104795475A CN201510241923.0A CN201510241923A CN104795475A CN 104795475 A CN104795475 A CN 104795475A CN 201510241923 A CN201510241923 A CN 201510241923A CN 104795475 A CN104795475 A CN 104795475A
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- Prior art keywords
- lens
- led
- processing method
- polymer
- complex topography
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention discloses a method for processing a complex surface shape lens during LED package and relates to a lens surface shape control method based on electrohydrodynamics during LED package. Lens surface shape control is realized by virtue of an induction electrostatic force on the surface of a polymer by virtue of an electric field; accurate regulation and control on the lens surface shape are realized by changing the electric field; and the electric field is changed by configuring different electrodes and applying different voltages. The method for processing the complex surface shape lens during LED package is simple and effective, the processing cost is reduced, a processing cycle is shortened, and the surface smoothness of a lens is greatly improved, so that the optical performance of an LED product is improved.
Description
Technical field
The invention belongs to LED technology, more specifically, relate to a kind of processing method based on complex topography lens in the LED of electrohydrodynamics.
Background technology
LED (Light Emitting Diode) is a kind of light emitting semiconductor device made based on P-N junction electroluminescent principle, have that electro-optical efficiency is high, the advantage such as long service life, environmental protection and energy saving, volume are little, be described as 21 century green illumination light source, if be applied to traditional lighting field will obtain very significant energy-saving effect, this is significant now what be becoming tight global energy day.Along with the breakthrough of third generation semiconductor material technology taking nitride as representative, semiconductor lighting industry based on high power high brightness led (LED) is risen rapidly in the whole world, just become semi-conductor photoelectronic industry new growth engines, and cause a revolution in traditional lighting field.LED, due to the superiority of its uniqueness, has started to be used widely in a lot of fields, is thought the main development direction of following lighting technology, have huge market potential by industry.
Lens, as the main light shape control device of LED illumination, not only can produce convergent beam, also can produce divergent beams simultaneously, and can control effectively to the light of all angles that LED sends, and design freedom is large, and implementation is flexible.Especially along with the rise of LED illumination free-form surface lens in recent years, the design of the symmetrical hot spot of various not rounded becomes more flexibly with convenient.Therefore, lens obtain increasing application in LED illumination, become an important means of optical design, and one of lens key link creating LED.
In order to ensure machining accuracy, free-form surface lens often needs the accurate multiple spindle processing system with having micron order machining accuracy to process.But, in actual volume manufacturing process, in order to enhance productivity, and reduce costs, often adopt the method for compression molding to produce free-form surface lens.The pattern of lens and roughness are completely by shape and the quality decision of mould, very high to the required precision of die surface; The processing of mould is more difficult, and cost is higher, and the cycle of manufacture is long, and easily weares and teares, and repeatedly use rear mold namely to scrap, and easily damage lens during the demoulding, residual stress problem also can affect the use of lens.In addition, the viscosity etc. of temperature during mold pressing, pressure, polymer fluid may affect the surface topography of free-form surface lens, thus affects its optical property and illuminating effect.Can know that traditional moulded lens processing method exists wretched insufficiency from foregoing.Therefore the improvement of lens morphological control method is the subject matter that current LED illumination industrial quarters realizes low cost, high optical property product faces.
Summary of the invention
The object of the present invention is to provide a kind of lens pattern processing control method, the induction electrostatic force of polymer surfaces is utilized to realize the accuracy controlling of lens pattern based on electrohydrodynamics, cutting down finished cost, while improving working (machining) efficiency, also assures that the surface roughness of lens.
Provided by the invention a kind of based on complex lens pattern processing control method in the LED of electrohydrodynamics, realize lens pattern by electric field at the induction electrostatic force of polymer surfaces and control.
Further, the accuracy controlling of lens pattern is realized by the change of electric field.
Further, the change of described electric field is realized by the configuration of Different electrodes and the voltage that applies different size.
Further, above-mentioned electrode configuration, comprise flat board, cylinder, annulus and other be used for the structure of the complex topography lens such as taper, ellipsoid and non-axis symmetry realized.
Further, the voltage of the different size of described applying, use DC power supply to apply voltage, voltage regulation limits is continuously adjustabe in 0-30000V.
Further, comprise the following steps:
1) with spot gluing equipment, polymer lens manufactured materials is transferred in LED module, then LED module is placed between upper/lower electrode;
2) regulate DC power output voltage size, make the electrostatic force suffered by polymer surfaces be enough to overcome surface tension effects, drive the flowing of polymer and its pattern is regulated and controled;
3) adopting the method be heating and curing to realize polymer cure when keeping voltage constant, finally obtaining the lens of any pattern.
Further, described polymer lens manufactured materials is the one in silica gel, epoxy resin, Merlon, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride or glass.
Further, described method is applicable to comprise the various LED forms of stent-type, chip on board, array, system in package, printed circuit board (PCB) encapsulation and silicon based package.
In sum, above technical scheme proposed by the invention compared with prior art, advantage is: utilize electric field to realize the accuracy controlling of lens pattern at the electrostatic force that polymer surfaces produces, for substituting traditional moulded lens processing method, reduce processing cost, shorten the process-cycle, greatly improve the surface smoothness of lens, thus improve LED product optical property.
Accompanying drawing explanation
Fig. 1 is the embodiment of the present invention 1 glue process schematic;
Fig. 2 is that the embodiment of the present invention 1 electric field action controls lens pattern schematic diagram;
Fig. 3 is the embodiment of the present invention 1 polymer lens manufactured materials solidification schematic diagram;
Fig. 4 is that embodiment 1 obtains lens pattern change procedure in time;
Fig. 5 is the taper pattern lens that embodiment 1 obtains;
Fig. 6 is the curve of light distribution of the taper pattern lens that embodiment 1 obtains;
Fig. 7 is that embodiment 2 electric field action controls lens pattern schematic diagram;
Fig. 8 is the ellipsoid pattern lens that embodiment 2 obtains;
Fig. 9 is the curve of light distribution of the ellipsoid pattern lens that embodiment 2 obtains;
Figure 10 is that enforcement 3 electric field action controls lens pattern schematic diagram;
Figure 11 is the asymmetric pattern lens that embodiment 3 obtains;
Figure 12 is the curve of light distribution of the asymmetric pattern lens that embodiment 3 obtains;
Figure 13 is the lens surface roughness that the embodiment 1 to 3 recorded by atomic force microscope is obtained;
Wherein: 1-LED module, 2-polymer, 3-spot gluing equipment, 4-DC power supply, 5-electrode, 6-electrode, 7-hot plate.
Embodiment
In further detail the present invention is described below by embodiment, but following examples are only illustrative, protection scope of the present invention is not by the restriction of these embodiments.
Embodiment 1
Provided by the invention a kind of based on lens pattern processing method in the LED of electrohydrodynamics, realize lens pattern by electric field at the induction electrostatic force of polymer surfaces and control.The accuracy controlling of lens pattern is realized by the change of electric field.
The change of electric field is realized by the configuration of Different electrodes and the voltage that applies different size.Electrode configuration comprises flat board, cylinder, annulus and other arbitrary structures designed.Use DC power supply to apply voltage, voltage regulation limits is continuously adjustabe in 0-30000V.
Lens morphological control method, concrete step comprises:
See Fig. 1,1) with spot gluing equipment 3, polymer 2 is transferred in LED module 1, then LED module 1 is placed between plate electrode 5 and plate electrode 6;
See Fig. 2,2) regulate DC power supply 4 output voltage size, make the electrostatic force suffered by polymer 2 surface be enough to overcome surface tension effects, drive the flowing of polymer 2 and its pattern is regulated and controled;
See Fig. 3, the method adopting hot plate 7 to be heating and curing when keeping voltage constant realizes polymer cure, finally obtains the lens of any pattern.
Polymer lens manufactured materials is silica gel, epoxy resin, Merlon, polymethyl methacrylate, acrylonitrile-butadiene-styrene copolymer, polyvinyl chloride or glass.
The method is applicable to comprise the various LED forms of stent-type, chip on board, array, system in package, printed circuit board (PCB) encapsulation and silicon based package.
See Fig. 4, under electric field action, lens pattern has become taper from initial ball looks, and whole process completed in 10 seconds.
See Fig. 5, under the effect of different voltage, obtain the lens of different cone height, along with the increase of voltage, cone height increases.
See Fig. 6, the curve of light distribution of the lens LED sample of different-shape is adopted to show that the bright dipping of LED has been converged to zone line by tapered lens.Compared with free forming lens, electric field action obtains the light distribution that zone line strengthens, and largest light intensity improves 35%.
Embodiment 2
See Fig. 7, the difference of the present embodiment and embodiment 1 is: electrode 5 is round loop electrode.
See Fig. 8, obtain the lens of different elliposoidal height under the effect of different voltage, along with the increase of voltage, lens height reduces.
See Fig. 9, the curve of light distribution of the LED sample of different-shape lens is adopted to show that the bright dipping of LED has been diffused to two side areas by elliposoidal lens.Compared with free forming lens, electric field action obtains the light distribution that two side areas strengthens, and largest light intensity improves 31% and occurs in ± 46 ° of visual angles place.
Embodiment 3,
See Figure 10, the difference of the present embodiment and embodiment 1 is: electrode 5 is asymmetric cylinder electrode.
See Figure 11, obtain the non-sym lens of differing heights under the effect of different voltage, along with the increase of voltage, lens height increases.
See Figure 12, the curve of light distribution of the LED sample of different-shape lens is adopted to show that the bright dipping of LED has been converged to that higher side of lens by non-sym lens.Compared with free forming lens, electric field action obtains the light distribution that side strengthens, and largest light intensity improves 39% and occurs in-50 ° of visual angles place.
See Figure 13, the surface roughness of the different-shape lens that embodiment 1 to 3 obtains is less than 5nm, and the lens of the lens morphological control method processing that the present invention program proposes have very high surface quality.
The above is preferred embodiment of the present invention, but the present invention should not be confined to the content disclosed in this embodiment and accompanying drawing.The equivalence completed under not departing from spirit disclosed in this invention so every or amendment, all fall into the scope of protection of the invention.
Claims (8)
1. a complex topography lens processing method in LED, is characterized in that: realize lens pattern by electric field at the induction electrostatic force on polymer lens manufactured materials surface and control.
2. complex topography lens processing method in a kind of LED according to claim 1, be is characterized in that: the accuracy controlling being realized lens pattern by the change of electric field.
3. complex topography lens processing method in a kind of LED according to claim 2, is characterized in that: the change of described electric field is realized by the configuration of difformity electrode and the voltage that applies different size.
4. complex topography lens processing method in a kind of LED according to claim 3, is characterized in that: the configuration structure of described electrode, comprises flat board or cylinder or toroidal.
5. complex topography lens processing method in a kind of LED according to claim 3, is characterized in that: the voltage of the different size of described applying, and use DC power supply to apply voltage, voltage regulation limits is continuously adjustabe in 0-30000V.
6. complex topography lens processing method in a kind of LED according to claim 5, is characterized in that: specifically comprise the following steps:
1) with spot gluing equipment, polymer lens manufactured materials is transferred in LED module, then LED module is placed between upper/lower electrode;
2) regulate DC power output voltage size, make the electrostatic force suffered by polymer surfaces be enough to overcome surface tension effects, drive the flowing of polymer and its pattern is regulated and controled;
3) adopt the method be heating and curing to realize polymer cure when keeping voltage constant, finally obtain the lens of the complex topography of taper or ellipsoid or non-axis symmetry shape.
7. complex topography lens processing method in a kind of LED according to claim 6, is characterized in that: described polymer lens manufactured materials comprises the one in silica gel or epoxy resin or Merlon or polymethyl methacrylate or acrylonitrile-butadiene-styrene copolymer or polyvinyl chloride or glass.
8. complex topography lens processing method in a kind of LED according to claim 7, is characterized in that: described method is applicable to comprise the multiple LED form of stent-type, chip on board, array, system in package, printed circuit board (PCB) encapsulation and silicon based package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510241923.0A CN104795475A (en) | 2015-05-13 | 2015-05-13 | Method for processing complex surface shape lens during LED package |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510241923.0A CN104795475A (en) | 2015-05-13 | 2015-05-13 | Method for processing complex surface shape lens during LED package |
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| CN104795475A true CN104795475A (en) | 2015-07-22 |
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| CN201510241923.0A Pending CN104795475A (en) | 2015-05-13 | 2015-05-13 | Method for processing complex surface shape lens during LED package |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111170270A (en) * | 2020-01-07 | 2020-05-19 | 南昌大学 | Surface microstructure preparation method based on electric field regulation and control morphology |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6369954B1 (en) * | 1997-10-08 | 2002-04-09 | Universite Joseph Fourier | Lens with variable focus |
| CN1780006A (en) * | 2004-11-26 | 2006-05-31 | 安捷伦科技有限公司 | Light-emitting device and method of making same |
| CN1930496A (en) * | 2004-03-04 | 2007-03-14 | 皇家飞利浦电子股份有限公司 | An optical component for introducing optical aberrations to a light beam |
| CN1991414A (en) * | 2005-12-27 | 2007-07-04 | 三星电机株式会社 | Method of fabricating liquid lens using electrowetting and liquid lens fabricated thereby |
| US20070279732A1 (en) * | 2006-06-06 | 2007-12-06 | Konica Minolta Opto, Inc. | Shape-variable optical element, optical device and image pickup apparatus |
-
2015
- 2015-05-13 CN CN201510241923.0A patent/CN104795475A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6369954B1 (en) * | 1997-10-08 | 2002-04-09 | Universite Joseph Fourier | Lens with variable focus |
| CN1930496A (en) * | 2004-03-04 | 2007-03-14 | 皇家飞利浦电子股份有限公司 | An optical component for introducing optical aberrations to a light beam |
| CN1780006A (en) * | 2004-11-26 | 2006-05-31 | 安捷伦科技有限公司 | Light-emitting device and method of making same |
| CN1991414A (en) * | 2005-12-27 | 2007-07-04 | 三星电机株式会社 | Method of fabricating liquid lens using electrowetting and liquid lens fabricated thereby |
| US20070279732A1 (en) * | 2006-06-06 | 2007-12-06 | Konica Minolta Opto, Inc. | Shape-variable optical element, optical device and image pickup apparatus |
Non-Patent Citations (1)
| Title |
|---|
| 詹珍贤: ""液滴透镜在电场中的变形研究"", 《光子学报》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111170270A (en) * | 2020-01-07 | 2020-05-19 | 南昌大学 | Surface microstructure preparation method based on electric field regulation and control morphology |
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Application publication date: 20150722 |