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Publication numberCN104795475 A
Publication typeApplication
Application numberCN 201510241923
Publication date22 Jul 2015
Filing date13 May 2015
Priority date13 May 2015
Publication number201510241923.0, CN 104795475 A, CN 104795475A, CN 201510241923, CN-A-104795475, CN104795475 A, CN104795475A, CN201510241923, CN201510241923.0
Inventors郑怀, 刘胜, 郭醒, 雷翔, 李晓天
Applicant武汉大学
Export CitationBiBTeX, EndNote, RefMan
External Links: SIPO, Espacenet
Method for processing complex surface shape lens during LED package
CN 104795475 A
Abstract
The invention discloses a method for processing a complex surface shape lens during LED package and relates to a lens surface shape control method based on electrohydrodynamics during LED package. Lens surface shape control is realized by virtue of an induction electrostatic force on the surface of a polymer by virtue of an electric field; accurate regulation and control on the lens surface shape are realized by changing the electric field; and the electric field is changed by configuring different electrodes and applying different voltages. The method for processing the complex surface shape lens during LED package is simple and effective, the processing cost is reduced, a processing cycle is shortened, and the surface smoothness of a lens is greatly improved, so that the optical performance of an LED product is improved.
Claims(8)  translated from Chinese
1.一种LED封装中复杂形貌透镜加工方法,其特征在于:通过电场在聚合物透镜制造材料表面的诱导静电力作用实现透镜形貌控制。 An LED package complex topography lens processing method, comprising: an electric field induced by the surface of the polymer lens material in the manufacture of static electricity effects lens shape to achieve control.
2.根据权利要求1所述的一种LED封装中复杂形貌透镜加工方法,其特征在于:通过电场的改变实现透镜形貌的精确调控。 An LED package according to the complex morphology of lens processing method according to claim 1, characterized in that: for precise regulation of the morphology of the lens by changing the electric field.
3.根据权利要求2所述的一种LED封装中复杂形貌透镜加工方法,其特征在于:所述电场的改变通过不同形状电极的配置和施加不同大小的电压来实现。 An LED package according to the complex morphology of lens processing method according to claim 2, wherein: said electric field by changing the configuration of the electrodes of different shapes and sizes of the applied voltage to achieve.
4.根据权利要求3所述的一种LED封装中复杂形貌透镜加工方法,其特征在于:所述电极的配置结构,包括平板或圆柱或圆环形状。 An LED package complex topography lens processing method according to claim 3, characterized in that: said electrode arrangement structure, including flat or a cylindrical or annular shape.
5.根据权利要求3所述的一种LED封装中复杂形貌透镜加工方法,其特征在于:所述施加不同大小的电压,使用直流电源施加电压,电压调节范围是0-30000V内连续可调。 An LED package according to the complex morphology of lens processing method according to claim 3, wherein: the applied voltage of different sizes, the use of the DC power supply voltage is applied, a voltage is continuously adjustable within the adjustment range 0-30000V .
6.根据权利要求5所述的一种LED封装中复杂形貌透镜加工方法,其特征在于:具体包括以下步骤: 1)用点胶设备将聚合物透镜制造材料转移到LED封装模块上,然后将LED封装模块置于上下电极之间; 2)调节直流电源输出电压大小,使聚合物表面所受的静电力足以克服表面张力作用,驱动聚合物的流动并对其形貌进行调控; 3)保持电压不变的情况下采用加热固化的方法实现聚合物固化,最终得到锥形或椭球或非轴对称形状的复杂形貌的透镜。 An LED package 5 according to the complex morphology of the lens processing method according to claim, characterized in that: specifically includes the following steps: 1) will be transferred to the polymer lens with a dispensing device on the LED package module manufacturing materials, and then The LED package module disposed between the upper and lower electrodes; 2) adjusting the size of the output voltage of the DC power supply, so that the surface of the polymer suffered an electrostatic force sufficient to overcome the surface tension, the flow of the polymer and its drive to regulate morphology; 3) adopt maintaining voltage constant heat curing methods to achieve polymer curing, finally get a cone or ellipsoid shape or symmetry axis of the lens complex topography.
7.根据权利要求6所述的一种LED封装中复杂形貌透镜加工方法,其特征在于:所述的聚合物透镜制造材料包括硅胶或环氧树脂或聚碳酸酯或聚甲基丙烯酸甲酯或丙烯腈-苯乙烯-丁二烯共聚物或聚氯乙烯或玻璃中的一种。 A LED package complex topography lens processing method according to claim 6, characterized in that: said polymer material comprises a lens manufacturing polycarbonate or silicone or epoxy or polymethyl methacrylate or acrylonitrile - styrene - butadiene copolymer or polyvinyl chloride or glass in one.
8.根据权利要求7所述的一种LED封装中复杂形貌透镜加工方法,其特征在于:所述方法适用于包括支架式、板上芯片、阵列式、系统封装、印刷电路板封装和硅基封装在内的多种LED封装形式。 An LED package complex topography lens processing method according to claim 7, characterized in that: said method is suitable for scaffolding comprising, on-board chip, array, packaging systems, printed circuit board and a silicon encapsulation multiple LED package base encapsulation.
Description  translated from Chinese
一种LED封装中复杂形貌透镜加工方法 An LED package complex topography lens processing method

技术领域 TECHNICAL FIELD

[0001] 本发明属于LED封装技术,更具体地,涉及一种基于电流体动力学的LED封装中复杂形貌透镜的加工方法。 [0001] The present invention belongs to the LED packaging technology, and more particularly, to a body based on the current dynamics of the LED package of complex topography lens processing methods.

背景技术 Background technique

[0002] LED (Light Emitting D1de)是一种基于P_N结电致发光原理制成的半导体发光器件,具有电光转换效率高、使用寿命长、环保节能、体积小等优点,被誉为21世纪绿色照明光源,如能应用于传统照明领域将得到十分显著的节能效果,这在全球能源日趋紧张的当今意义重大。 [0002] LED (Light Emitting D1de) is a semiconductor light emitting device based P_N junction electroluminescence principle made with high electro-optical conversion efficiency, long life, environmental protection and energy saving, small size, etc., known as the 21st century green lighting, such as can be used in traditional lighting will be very significant energy savings, which in today's increasingly tense global energy significance. 随着以氮化物为代表的第三代半导体材料技术的突破,基于大功率高亮度发光二极管(LED)的半导体照明产业在全球迅速兴起,正成为半导体光电子产业新的经济增长点,并在传统照明领域引发了一场革命。 With nitride as the representative of the third generation of breakthrough semiconductor materials technology, based on high-power high-brightness light-emitting diode (LED) semiconductor lighting industry rapid rise in the world, is becoming a new economic growth point of the semiconductor optoelectronics industry, and in the traditional lighting sparked a revolution. LED由于其独特的优越性,已经开始在许多领域得到广泛应用,被业界认为是未来照明技术的主要发展方向,具有巨大的市场潜力。 LED because of its unique advantages, has begun to be widely used in many fields, was considered a major development direction of future lighting technology, it has huge market potential.

[0003] 透镜作为LED照明主要的光形控制手段,不但能产生会聚光束,同时也能产生发散光束,并且可以对LED发出的各个角度的光进行有效控制,且设计自由度大,实现方式灵活。 [0003] The lens LED lighting as the main light shape control means, not only to produce converging beam, but also can produce diverging beams from different angles and can be emitted from the LED light for effective control, and design flexibility, flexible implementation . 尤其是随着近几年LED照明用自由曲面透镜的兴起,各种非圆对称光斑的设计变得更加灵活与便捷。 Especially with the rise in recent years, LED lighting free curved lens, a variety of non-circular symmetrical spot become more flexible and convenient design. 因此,透镜在LED照明中得到了越来越多的应用,成为光学设计的一个重要手段,而透镜制造成为LED封装的关键环节之一。 Thus, the lens in the LED lighting to give more and more applications become an important means of optical design, and lens manufacturing has become one of the key aspects of the LED package.

[0004] 为了保证加工精度,自由曲面透镜往往需要用具有微米级加工精度的精密多轴加工系统来进行加工。 [0004] In order to ensure accuracy, often need to use free-form surface lens having a micron-level precision multi-axis machining precision machining systems for processing. 然而,在实际批量制造过程中,为了提高生产效率,并且降低成本,往往采用模压成型的方法来生产自由曲面透镜。 However, in the actual batch manufacturing process, in order to improve productivity and reduce costs, often using molding methods to produce free-form surface lens. 透镜的形貌和粗糙度完全由模具的形状和质量决定,对模具表面的精度要求很高;模具的加工比较困难,成本较高,制造的周期长,且容易磨损,多次使用后模具即报废,且脱模时容易损坏透镜,残留应力问题也会影响透镜的使用。 Morphology and roughness of the lens is completely determined by the shape and quality of the mold, the mold surface is high precision; more difficult to mold processing, high cost, long cycle of manufacturing, and easy to wear, after repeatedly using a mold that is scrap, easily damaged lens and release when the residual stress problems will affect the use of the lens. 此外,模压时的温度、压力、聚合物流体的粘度等可能会影响自由曲面透镜的表面形貌,从而影响其光学性能与照明效果。 In addition, when the molding temperature, pressure, viscosity polymer fluid may affect the surface morphology of the free surface of the lens, which can affect their optical performance and lighting effects. 从上述内容可以获知传统的模压透镜加工方法存在严重不足。 From the above, we can learn the traditional processing method for molding a lens there is a serious shortage. 因此透镜形貌控制方法的改进是当前LED照明工业界实现低成本、高光性能产品面临的主要问题。 Thus improving lens shape control method is the main problem of the current LED lighting industry to achieve low-cost, high-performance products face.

发明内容 SUMMARY OF THE INVENTION

[0005] 本发明的目的在于提供一种透镜形貌加工控制方法,基于电流体动力学利用聚合物表面的诱导静电力实现透镜形貌的精确调控,在降低加工成本,提高加工效率的同时,还保证了透镜的表面粗糙度。 [0005] The object of the present invention is to provide a lens shape machining control method, based on the current body dynamics induced by the use of the polymer surface to achieve precise control of electrostatic lens morphology, reduce processing costs, improve processing efficiency, also ensures that the surface roughness of the lens.

[0006] 本发明提供的一种基于电流体动力学的LED封装中复杂透镜形貌加工控制方法,通过电场在聚合物表面的诱导静电力作用实现透镜制形貌控制。 [0006] The present invention provides an LED package based on the complex topography of the lens processing control method current body dynamics, by inducing an electric field in the surface of the polymer electrostatic lens system to realize the role of morphology control.

[0007] 进一步的,通过电场的改变实现透镜形貌的精确调控。 [0007] Further, to achieve precise control of the morphology of the lens by changing electric field.

[0008] 进一步的,所述电场的改变通过不同电极的配置和施加不同大小的电压来实现。 [0008] Further, the configuration of the electric field is changed by applying a voltage different electrodes and different sizes to achieve.

[0009] 进一步的,上述的电极配置结构,包括平板、圆柱、圆环及其它用来实现的锥形、椭球和非轴对称等复杂形貌透镜的结构。 [0009] Further, the above electrode configuration structure, including flat, cylindrical, ring and the other to achieve a conical, ellipsoid and non-axisymmetric lens structure complex morphology.

[0010] 进一步的,所述施加不同大小的电压,使用直流电源施加电压,电压调节范围是0-30000V内连续可调。 [0010] Further, different sizes of the applied voltage, a DC power supply voltage is applied, a voltage is continuously adjustable within the adjustment range 0-30000V.

[0011] 进一步的,包括以下步骤: [0011] Further, comprising the steps of:

1)用点胶设备将聚合物透镜制造材料转移到LED封装模块上,然后将LED封装模块置于上下电极之间; 1) Dispensing equipment will be transferred to the polymer lens material manufacturing LED encapsulation module, then the LED package module is placed between the upper and lower electrodes;

2)调节直流电源输出电压大小,使聚合物表面所受的静电力足以克服表面张力作用,驱动聚合物的流动并对其形貌进行调控; 2) adjusting the DC output voltage magnitude, the polymer surface suffered enough to overcome the surface tension of static electricity effect, driving the flow of the polymer and its morphology regulation;

3)在保持电压不变的情况下采用加热固化的方法实现聚合物固化,最终得到任意形貌的透镜。 3) The heat-curing method while maintaining the voltage constant realization of polymer curing, the final shape of the lens get any.

[0012] 进一步的,所述的聚合物透镜制造材料为硅胶、环氧树脂、聚碳酸酯、聚甲基丙烯酸甲酯、丙烯腈-苯乙烯-丁二烯共聚物、聚氯乙烯或玻璃中的一种。 [0012] Further, the lens manufacturing the polymeric material is a silicone, epoxy resin, polycarbonate, polymethyl methacrylate, acrylonitrile - styrene - butadiene copolymer, polyvinyl chloride or glass a.

[0013] 进一步的,所述方法适用于包括支架式、板上芯片、阵列式、系统封装、印刷电路板封装和硅基封装在内的各种LED封装形式。 [0013] Further, the method is applicable to all kinds of LED Package includes a bracket style, on-board chip, array, system packaging, printed circuit board and the silicon package including packaging.

[0014] 综上所述,本发明所提出的以上技术方案与现有技术相比,优点是:利用电场在聚合物表面产生的静电力实现透镜形貌的精确调控,用于替代传统的模压透镜加工方法,降低了加工成本,缩短了加工周期,极大的提高了透镜的表面光洁度,从而改善了LED产品光学性能。 [0014] In summary, the present invention, the above technical solutions proposed in comparison with the prior art, the advantages are: the use of an electric field generated on the surface of the polymer to achieve precise control of electrostatic lens morphology, to replace the conventional molding lens processing methods to reduce processing costs, shorten the processing cycle, which greatly improves the surface finish of the lens, thereby improving the optical properties of LED products.

附图说明 Brief Description

[0015] 图1为本发明实施例1点胶过程示意图; [0015] FIG. 1 1:00 dispensing process of the present invention Example schematic illustration;

图2为本发明实施例1电场作用控制透镜形貌示意图; Figure 2 embodiment of the present invention, a schematic diagram of an electric field to control the morphology of the lens;

图3为本发明实施例1聚合物透镜制造材料固化示意图; Figure 3 of the present invention manufactured in Example 1 of polymer lens material cured schematic embodiment;

图4为实施例1得到透镜形貌随时间变化过程; Figure 4 is a lens obtained in Example 1 Morphology change process over time;

图5为实施例1得到的锥形形貌透镜; Figure 5 is a conical shape of the lens obtained in Example 1 embodiment;

图6为实施例1得到的锥形形貌透镜的光强分布曲线; Figure 6 is a light intensity distribution curve obtained in Example 1 of the embodiment of the conical shape of the lens;

图7为实施例2电场作用控制透镜形貌示意图; Figure 7 Example 2 a schematic view of an electric field to control the implementation of a lens shape;

图8为实施例2得到的椭球形貌透镜; Figure 8 Example 2 was ellipsoidal shape lens implementation;

图9为实施例2得到的椭球形貌透镜的光强分布曲线; Figure 9 is a light intensity distribution curve of the ellipsoid shape of the lens obtained in Example 2;

图10为实施3电场作用控制透镜形貌示意图; Example 3 FIG. 10 is a schematic diagram of an electric field to control the morphology of the lens;

图11为实施例3得到的非对称形貌透镜; Example 3 Figure 11 is an asymmetric lens obtained in morphology;

图12为实施例3得到的非对称形貌透镜的光强分布曲线; Figure 12 is a light intensity distribution curve obtained in Example 3 of the embodiment of the asymmetric shape of the lens;

图13为通过原子力显微镜测得的实施例1至3得到的透镜表面粗糙度; 13 is obtained by the embodiment of the lens surface measured by atomic force microscopy roughness of 1-3;

其中:1- LED封装模块,2-聚合物,3 -点胶设备,4 -直流电源,5-电极,6-电极,7-热板。 Where: 1- LED package module, 2-polymer, 3 - dispensing equipment, 4 - DC power supply, 5- electrode 6 electrodes, 7 hot plate.

具体实施方式 DETAILED DESCRIPTION

[0016] 下面通过实施例更加详细地说明本发明,但以下实施例仅是说明性的,本发明的保护范围并不受这些实施例的限制。 [0016] The present invention will be described in more detail by way of examples, but the following examples are illustrative only, the scope of the present invention is not limited to these embodiments restrictions.

[0017] 实施例1 [0017] Example 1

本发明提供的一种基于电流体动力学的LED封装中透镜形貌加工方法,通过电场在聚合物表面的诱导静电力作用实现透镜形貌控制。 The present invention provides a lens shape processing method based on the current body dynamics of the LED package to achieve morphology control lens-induced polymer surface by electrostatic force in an electric field. 通过电场的改变实现透镜形貌的精确调控。 Precise regulation of the lens by altering the topography of the electric field.

[0018] 电场的改变通过不同电极的配置和施加不同大小的电压来实现。 Change [0018] electric field by configuring different electrodes and applying a voltage of different sizes to achieve. 电极配置包括平板、圆柱、圆环及其他设计的任意结构。 Electrode configuration includes any structure flat, cylindrical, ring and other designs. 使用直流电源施加电压,电压调节范围是0-30000V内连续可调。 DC power supply voltage is applied, the voltage adjustment range is continuously adjustable 0-30000V.

[0019] 透镜形貌控制方法,具体的步骤包括: [0019] lens shape control method, specific steps include:

参见图1,I)用点胶设备3将聚合物2转移到LED封装模块I上,然后将LED封装模块I置于平板电极5和平板电极6之间; Referring to Figure 1, I) with a dispensing device 3 will be transferred to the polymer 2 LED package module I, and then the LED package module I 5 and 6 is placed between the plate electrode plate electrode;

参见图2,2)调节直流电源4输出电压大小,使聚合物2表面所受的静电力足以克服表面张力作用,驱动聚合物2的流动并对其形貌进行调控; See Figure 2,2) to adjust the size of the output voltage of the DC power supply 4, the second surface of the polymer suffered so static electricity sufficient to overcome surface tension, drive 2 polymer flow and regulate their morphology;

参见图3,保持电压不变的情况下采用热板7加热固化的方法实现聚合物固化,最终得到任意形貌的透镜。 Referring to Figure 3, keeping hot plate 7 heat-curing polymer curing methods to achieve constant voltage, and ultimately get any appearance of a lens.

[0020] 聚合物透镜制造材料为硅胶、环氧树脂、聚碳酸酯、聚甲基丙烯酸甲酯、丙烯腈-苯乙烯-丁二烯共聚物、聚氯乙烯或玻璃。 [0020] polymeric material is a lens manufacturing silicone, epoxy resin, polycarbonate, polymethyl methacrylate, acrylonitrile - styrene - butadiene copolymer, polyvinyl chloride, or glass.

[0021] 该方法适用于包括支架式、板上芯片、阵列式、系统封装、印刷电路板封装和硅基封装在内的各种LED封装形式。 [0021] The method is applicable to all kinds of LED Package includes a bracket style, on-board chip, array, system packaging, printed circuit board and the silicon package including packaging.

[0022] 参见图4,在电场作用下,透镜形貌由初始的球貌变为了锥形,整个过程在10秒内完成。 [0022] Referring to Figure 4, in the electric field, the lens shape from the initial appearance ball into the cone, the entire process is completed within 10 seconds.

[0023] 参见图5,在不同电压的作用下,得到不同锥形高度的透镜,随着电压的增大,锥形高度增大。 [0023] Referring to Figure 5, under the effect of different voltage, to obtain different height of the tapered lens, as the voltage is increased, the height of the cone is increased.

[0024] 参见图6,采用不同形貌的透镜LED封装样品的光强分布曲线表明锥形透镜将LED的出光汇聚到了中间区域。 [0024] Referring to FIG. 6, using the light intensity distribution curve of different morphologies of lens LED package samples indicates a conical lens LED light will converge to the middle of the area. 与自由成型透镜相比,电场作用得到了中间区域增强的光强分布,最大光强提高了35%。 Compared with free forming lens, the electric field has been enhanced intermediate region light intensity distribution, the maximum light intensity increased by 35%.

[0025] 实施例2 [0025] Example 2

参见图7,本实施例与实施例1的不同之处在于:电极5为圆环电极。 Referring to Figure 7, this embodiment differs from the embodiment in Example 1 in that: the electrode 5 is a ring electrode.

[0026] 参见图8,在不同电压的作用下得到不同椭球形高度的透镜,随着电压的增大,透镜高度降低。 [0026] Referring to Figure 8, under the action of different voltages to obtain different heights ellipsoidal lens, as the voltage increases, the lens height reduction.

[0027] 参见图9,采用不同形貌透镜的LED封装样品的光强分布曲线表明椭球形透镜将LED的出光发散到了两侧区域。 [0027] Referring to FIG. 9, the light intensity distribution curve LED package samples showed different morphologies ellipsoid lens lens of the LED light diverging to the sides of the area. 与自由成型透镜相比,电场作用得到了两侧区域增强的光强分布,最大光强提高了31%且发生在46视角处。 Compared with free forming lens, the electric field has been on both sides of the region enhanced light intensity distribution, the maximum light intensity improved 31 percent and occurs in the 46 viewing angle.

[0028] 实施例3, [0028] Example 3,

参见图10,本实施例与实施例1的不同之处在于:电极5为非对称圆柱电极。 Referring to Figure 10, the present embodiment is Example 1 except that: the electrode 5 asymmetric cylindrical electrode.

[0029] 参见图11,在不同电压的作用下得到不同高度的非对称透镜,随着电压的增大,透镜高度增大。 [0029] Referring to Figure 11, under the effect of different voltage obtained at different heights of the asymmetrical lens, as the voltage increases, the height of the lens is increased.

[0030] 参见图12,采用不同形貌透镜的LED封装样品的光强分布曲线表明非对称透镜将LED的出光汇聚到了透镜更高的那一侧。 [0030] Referring to FIG. 12, the light intensity distribution curve LED package samples showed different morphologies lens asymmetric lens of the LED light lens converge to a higher side. 与自由成型透镜相比,电场作用得到了一侧增强的光强分布,最大光强提高了39%且发生在-50视角处。 Compared with free forming lens, the electric field has been enhanced light intensity distribution side, maximum light intensity improved 39 percent and occurs in the -50 viewing angle.

[0031] 参见图13,实施例1至3得到的不同形貌透镜的表面粗糙度小于5nm,本发明方案提出的透镜形貌控制方法加工的透镜具有非常高的表面质量。 [0031] Referring to Figure 13, the resulting lens surfaces with different morphologies Example 1-3 roughness of less than 5nm, the lens shape of the lens processing control method of the present invention is presented with a very high surface quality.

[0032] 以上所述为本发明的较佳实施例而已,但本发明不应该局限于该实施例和附图所公开的内容。 Preferably the above [0032] embodiment of the present invention only, but the present invention should not be limited to the disclosed embodiments and the accompanying drawings in this embodiment. 所以凡是不脱离本发明所公开的精神下完成的等效或修改,都落入本发明保护的范围。 So who or modified without departing from the spirit of the present invention is equivalent to the disclosed under completion, fall within the scope of the present invention.

Patent Citations
Cited PatentFiling datePublication dateApplicantTitle
CN1780006A *28 Nov 200531 May 2006安捷伦科技有限公司Light-emitting device and method of making same
CN1930496A *1 Mar 200514 Mar 2007皇家飞利浦电子股份有限公司An optical component for introducing optical aberrations to a light beam
CN1991414A *25 Dec 20064 Jul 2007三星电机株式会社Method of fabricating liquid lens using electrowetting and liquid lens fabricated thereby
US6369954 *7 Oct 19989 Apr 2002Universite Joseph FourierLens with variable focus
US20070279732 *30 May 20076 Dec 2007Konica Minolta Opto, Inc.Shape-variable optical element, optical device and image pickup apparatus
Non-Patent Citations
Reference
1 *詹珍贤: ""液滴透镜在电场中的变形研究"", 《光子学报》
Classifications
International ClassificationH01L33/48, H01L33/58, H01L33/00
Cooperative ClassificationH01L33/005, H01L2933/0033, H01L33/58, H01L33/48
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