CN102692659A - Wafer level optical module and wafer level microelectronic imager - Google Patents
Wafer level optical module and wafer level microelectronic imager Download PDFInfo
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- CN102692659A CN102692659A CN2011100712568A CN201110071256A CN102692659A CN 102692659 A CN102692659 A CN 102692659A CN 2011100712568 A CN2011100712568 A CN 2011100712568A CN 201110071256 A CN201110071256 A CN 201110071256A CN 102692659 A CN102692659 A CN 102692659A
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- liquid
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- optical lens
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Abstract
The invention discloses a wafer level optical module of a microelectronic imager applied to an electronic device. The wafer level optical module comprises a shell body and optical lens stacks fixedly arranged in the inner space of the shell body. The above optical lens stacks comprise a plurality of optical lens stacked along an optical axis, at least one first spacer element arranged between the optical lens, and first liquid, wherein the first spacer element enables two adjacent optical lens to form closed first accommodation space, and the above first liquid is arranged in the first accommodation space. The above wafer level optical module can be applied to a wafer level microelectronic imager.
Description
Technical field
The present invention relates to a kind of optical module and microelectronic imaging device, and particularly relate to a kind of wafer scale optical module and wafer scale microelectronic imaging device.
Background technology
Along with the progress of electronics technology, increasing electronic installation is equipped with the microelectronic imaging device, for example portable electronic devices such as digital camera, hand held game device or mobile phone.In general microelectronic imaging device, include optical lens and pile up and be adjacent to the image sensing tube core that above-mentioned optical lens piles up.Wherein, optical lens piles up by a plurality of optical lenses and combines with stack manner, and the image sensing tube core can for example be charge coupled cell (Charge-coupled Device; CCD) tube core or complementary metal oxide semiconductor (CMOS) (Complementary Metal-Oxide-Semiconductor; CMOS) tube core.
Pile up when arriving at the image sensing tube core via optical lens when light from outside, the image sensing tube core can be transformed into digital signal with the image that receives, and is beneficial to follow-up as stores the carrying out of waiting other steps.
In addition; In order to design the optical property of microelectronic imaging device; A plurality of optical lenses relative position each other in can piling up to optical lens is adjusted; Change the travel path of light between the adjacent optical lens thus, or change the travel path of the light that optical lens penetrated of least significant end, and then meet the demand of design specification.
Yet, in general microelectronic imaging device, following shortcoming is arranged usually:, make the excessive shortcoming of microelectronic imaging device integral thickness in order to satisfy the optical property requirement.And when microelectronic imaging device thickness is excessive, quite unfavorable for the slimming of electronic installation.
Summary of the invention
Therefore; The object of the present invention is to provide a kind of wafer scale optical module and wafer scale microelectronic imaging device; Wherein optical lens piles up and has been installed with liquid; Can through liquid adjust optical lens pile up between a plurality of optical lenses, or optical lens piles up the refractive index of a side of the optical lens of least significant end.
According to one embodiment of the invention, a kind of wafer scale optical module that is applicable to the microelectronic imaging device of electronic installation is provided.This wafer scale optical module comprises the housing with inner space and the optical lens that is fixedly arranged in the above-mentioned inner space piles up.Above-mentioned optical lens piles up and comprises a plurality of optical lenses of piling up along optical axis, is arranged at least one first spacer element and first liquid between the optical lens.Above-mentioned first spacer element makes a plurality of optical lenses adjacent form the first airtight accommodation space between the two, and first liquid then is located in this first accommodation space.
According to another embodiment of the present invention, a kind of wafer scale microelectronic imaging device module that is applicable to electronic installation is provided.This wafer scale microelectronic imaging device module comprises housing with inner space, be fixedly arranged at the image sensing tube core that optical lens in the above-mentioned inner space piles up and be adjacent to the side that optical lens piles up.Above-mentioned optical lens piles up and comprises a plurality of optical lenses of piling up along optical axis, is arranged at least one first spacer element and first liquid between the optical lens.Above-mentioned first spacer element makes a plurality of optical lenses adjacent form the first airtight accommodation space between the two, and first liquid then is located in this first accommodation space.
Advantage of the present invention does, through in optical lens piles up, being installed with liquid, the pass through refractive index of medium in path of light is adjusted in can piling up optical lens.When comprising the different optical property of wafer scale optical module needs that above-mentioned optical lens piles up, then can satisfy specific optical property demand, and keep the unanimity of wafer scale optical module thickness simultaneously through the liquid that employing has a different refractivity.In other words, under the condition of the consistency of thickness of keeping above-mentioned wafer scale optical module, comprise the multiple kenel that wafer scale optical module that above-mentioned optical lens piles up can be designed with the different optical performance.
Description of drawings
In order preferable understanding to be arranged, please with reference to above-mentioned detailed description and cooperate corresponding accompanying drawing to viewpoint of the present invention.Be stressed that according to the standard normal of industry, the various characteristics in the accompanying drawing do not illustrate to scale.In fact, for clearly demonstrating the foregoing description, can at random amplify or dwindle the size of various characteristics.The relevant drawings description of contents is following.
Fig. 1 is the diagrammatic cross-section that illustrates according to the wafer scale microelectronic imaging device of one embodiment of the invention.
The main element symbol description
100: wafer scale microelectronic imaging device 102: housing
102a: inner space 104: optical lens piles up
106: image sensing tube core 108a-108b: optical lens
108c: 110: the first spacer elements of optical axis
110a: the first accommodation space 112a: first liquid
112b: second liquid 114: airtight element
116: the second spacer element 116a: second accommodation space
118: the three spacer elements
Embodiment
Please with reference to Fig. 1, it is the diagrammatic cross-section that illustrates according to the wafer scale microelectronic imaging device of one embodiment of the invention.Wafer scale microelectronic imaging device 100 is applicable to portable electronic devices, for example digital camera, hand held game device or mobile phone.Under general situation, a plurality of wafer scale microelectronic imaging devices 100 are to be formed at earlier on the wafer, and cut into slices to produce single wafer scale microelectronic imaging device 100 through wafer saw.
In the present embodiment, wafer scale microelectronic imaging device 100 comprises housing 102, optical lens and piles up 104 and image sensing tube core 106.Wherein, above-mentioned housing 102 and optical lens pile up 104 and can close and be called the wafer scale optical module that is applicable to wafer scale microelectronic imaging device 100.In housing 102, it has inner space 102a.The major function of this housing 102 is to pile up 104 each assembly and image sensing tube core 106 in order to the following optical lens that is about to explanation that is coated and fixed, and forms single wafer level microelectronic imaging device 100 thus.
As stated, optical lens piles up 104 and is fixedly arranged among the inner space 102a of above-mentioned housing 102.In addition, optical lens piles up 104 and comprises a plurality of optical lens 108a and 108b, at least one first spacer element 110 and the first liquid 112a.In the present embodiment, optical lens piles up 104 and only comprises two optical lens 108a and 108b.And in certain embodiments, the quantity of optical lens can optionally be adjusted, and it does not exceed with present embodiment.In addition, in the present embodiment, optical lens 108a and 108b pile up along the optical axis 108c of himself, and specifically, two optical axis 108c that these two optical lenses 108a and 108b are had overlap each other.Yet in certain embodiments, a plurality of optical axis 108c that a plurality of optical lenses have are also underlapped each other, only arrange with mode parallel to each other between these optical axises 108c.
As for first spacer element 110, it mainly is arranged between above-mentioned two optical lens 108a and the 108b, makes the first airtight accommodation space 110a of formation between adjacent two optical lens 108a and the 108b.And the quantity of first spacer element 110; Mainly adjust according to the quantity of optical lens; The quantity that the quantity of first spacer element 110 is required to be optical lens at least subtracts one, makes thus all to form the first airtight accommodation space 110a as shown in Figure 1 between adjacent two optical lenses.Yet; In the present embodiment; Optical lens piles up 104 except that comprising first spacer element 110 that is arranged between two optical lens 108a and the 108b, also comprises two second spacer element 116 and the 3rd spacer elements 118 that are arranged on outside optical lens 108a and the 108b.These two second extra spacer elements 116 and the 3rd spacer element 118 and other relative positions and effect will be done further explanation in following.
Pile up 104 as for optical lens and comprise the first liquid 112a, it is located among the first accommodation space 110a between above-mentioned adjacent two optical lens 108a and the 108b.The deviser can be required according to wafer scale microelectronic imaging device 100 optical property, select the refractive index of the first liquid 112a, guarantee that thus wafer scale microelectronic imaging device 100 whole thickness can meet design requirement.In other words, when the fixed thickness of final wafer scale microelectronic imaging device 100,, can make wafer scale microelectronic imaging device 100 have more various optical property through adjusting the refractive index of the first liquid 112a.
In addition, image sensing tube core 106 is adjacent to above-mentioned optical lens and piles up a side of 104, and wherein mainly come from optical lens in order to reception piles up 104 image light source to this image sensing tube core 106, and converts this image light source to digital signal.In the present embodiment, image sensing tube core 106 engages with the 3rd spacer element 118 earlier, and the 3rd spacer element 118 engages one another with optical lens 108b again.Yet in other embodiments, image sensing tube core 106 can directly be engaged on the housing 102, and omits the 3rd spacer element 118 between image sensing tube core 106 and the optical lens 108b.In addition, in certain embodiments, image sensing tube core 106 can be CCD tube core or CMOS tube core.
As shown in Figure 1, in the present embodiment, the optical lens of wafer scale microelectronic imaging device 100 piles up 104 and also comprises the second liquid 112b, airtight element 114 and second spacer element 116.Wherein, airtight element 114 mainly piles up in 104 and the relative opposite side of a side that above-mentioned image sensing tube core 106 is set in order to airtight this optical lens, and this airtight element 114 is adjacent to optical lens 108a.Second spacer element 116 then is arranged between airtight element 114 and the above-mentioned optical lens 108a, makes that thus airtight element 114 and above-mentioned optical lens 108a's wherein forms the second airtight accommodation space 116a between one.In addition, the above-mentioned second liquid 112b is located among this second accommodation space 116a, through selecting to have the second liquid 112b of specific refractive index, can further adjust the optical property of wafer scale microelectronic imaging device 100.
In the present embodiment, the above-mentioned first liquid 112a has different refractive indexes with the second liquid 112b.And in certain embodiments, the above-mentioned first liquid 112a then has identical refractive index with the second liquid 112b.Moreover; In certain embodiments; The quantity of piling up 104 optical lenses that comprise when optical lens surpasses more than three; Make that be located in the first liquid 112a between adjacent two optical lens 108a as shown in Figure 1 and the 108b surpasses two when above, a plurality of first liquid 112a also can have similar and different refractive index each other.
Adopt structure of the present invention, can make under identical thickness prerequisite, wafer scale optical module or wafer scale microelectronic imaging device can possess more diversified optical property.So the present invention except the design freedom that can increase the deviser, also can promote the competitive edge of the product of wafer scale optical module or wafer scale microelectronic imaging device.
Though disclosed the present invention in conjunction with above embodiment; Yet it is not in order to limiting the present invention, anyly is familiar with this operator, is not breaking away from the spirit and scope of the present invention; Can do various changes and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (9)
1. wafer scale optical module is applicable to the microelectronic imaging device of electronic installation, and wherein this wafer scale optical module comprises:
Housing has an inner space; And
Optical lens piles up, and is fixedly arranged in this inner space, and wherein this optical lens piles up and comprises:
A plurality of optical lenses pile up along the optical axis of those optical lenses;
At least one first spacer element is arranged between those optical lenses, makes that those optical lenses are adjacent to form one first airtight accommodation space between the two; And
First liquid is located in this first accommodation space.
2. wafer scale optical module as claimed in claim 1, wherein this optical lens piles up also and comprises:
Second liquid;
Airtight element, in order to the end that airtight this optical lens piles up, wherein this airtight element is adjacent to one of them person of those optical lenses; And
Second spacer element is arranged between this airtight element and those optical lenses this person wherein, makes one second airtight accommodation space of formation between this airtight element and those optical lenses this person wherein;
Wherein, this second liquid is located in this second accommodation space.
3. wafer scale optical module as claimed in claim 2, wherein this first liquid has different refractive indexes with this second liquid.
4. wafer scale optical module as claimed in claim 2, wherein this first liquid has identical refractive index with this second liquid.
5. a wafer scale microelectronic imaging device is applicable to electronic installation, and wherein this wafer scale microelectronic imaging device comprises:
Housing has an inner space;
Optical lens piles up, and is fixedly arranged in this inner space, and wherein this optical lens piles up and comprises:
A plurality of optical lenses pile up along the optical axis of those optical lenses;
At least one first spacer element is arranged between those optical lenses, makes that those optical lenses are adjacent to form one first airtight accommodation space between the two; And
First liquid is located in this first accommodation space; And
The image sensing tube core is adjacent to the side that this optical lens piles up.
6. wafer scale microelectronic imaging device as claimed in claim 5, wherein this optical lens piles up also and comprises:
Second liquid;
Airtight element, in order to the opposite side that airtight this optical lens piles up, wherein this airtight element is adjacent to one of them person of those optical lenses; And
Second spacer element is arranged between this airtight element and those optical lenses this person wherein, makes one second airtight accommodation space of formation between this airtight element and those optical lenses this person wherein;
Wherein, this second liquid is located in this second accommodation space.
7. wafer scale microelectronic imaging device as claimed in claim 6, wherein this first liquid has different refractive indexes with this second liquid.
8. wafer scale microelectronic imaging device as claimed in claim 6, wherein this first liquid has identical refractive index with this second liquid.
9. wafer scale microelectronic imaging device as claimed in claim 5, wherein this image sensing tube core is selected from a group that is made up of a charge coupled cell tube core and a CMOS tube core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100712568A CN102692659A (en) | 2011-03-24 | 2011-03-24 | Wafer level optical module and wafer level microelectronic imager |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100712568A CN102692659A (en) | 2011-03-24 | 2011-03-24 | Wafer level optical module and wafer level microelectronic imager |
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| CN102692659A true CN102692659A (en) | 2012-09-26 |
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| CN2011100712568A Pending CN102692659A (en) | 2011-03-24 | 2011-03-24 | Wafer level optical module and wafer level microelectronic imager |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446591A (en) * | 1993-02-08 | 1995-08-29 | Lockheed Missiles & Space Co., Inc. | Lens mounting for use with liquid lens elements |
| CN100426007C (en) * | 2004-01-30 | 2008-10-15 | 皇家飞利浦电子股份有限公司 | Variable focus lens package having clamping means for fixing the various lens package elements with respect to each other |
| CN101419318A (en) * | 2007-10-25 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Camera module |
| CN101872032A (en) * | 2009-04-23 | 2010-10-27 | 索尼公司 | The method of optical device, electronic installation and manufacturing optical device |
-
2011
- 2011-03-24 CN CN2011100712568A patent/CN102692659A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446591A (en) * | 1993-02-08 | 1995-08-29 | Lockheed Missiles & Space Co., Inc. | Lens mounting for use with liquid lens elements |
| CN100426007C (en) * | 2004-01-30 | 2008-10-15 | 皇家飞利浦电子股份有限公司 | Variable focus lens package having clamping means for fixing the various lens package elements with respect to each other |
| CN101419318A (en) * | 2007-10-25 | 2009-04-29 | 鸿富锦精密工业（深圳）有限公司 | Camera module |
| CN101872032A (en) * | 2009-04-23 | 2010-10-27 | 索尼公司 | The method of optical device, electronic installation and manufacturing optical device |
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Application publication date: 20120926 |